Hewlett-packard Company

Say-Teng Lai

Mohammad Akhavain

Robert-Scott Melendrino Lopez

The disclosure describes a method for predicting and avoiding bad bonds or connections when performing electrical connection of two electrical conductors by using a laser light beam attached to an optical fiber system which directs the light to the spot to be bonded. The method provides for rapid detection of damaged optical fibers before bad bonds or connections occur. Disclosed is a method for predicting and avoiding bad bonds or connections when performing solderless electrical connection of two contact elements by using a laser light beam attached to a optical fiber system which directs the light to the spot to be bonded.

Method for predicting and avoiding a bad bond when utilizing fiber push connect laser bonding

The disclosure describes a method for predicting and avoiding bad bonds or connections when performing electrical connection of two electrical conductors by using a laser light beam attached to an optical fiber system which directs the light to the spot to be bonded. The method provides for rapid detection of damaged optical fibers before bad bonds or connections occur. Disclosed is a method for predicting and avoiding bad bonds or connections when performing solderless electrical connection of two contact elements by using a laser light beam attached to a optical fiber system which directs the light to the spot to be bonded. The method of the present invention performs optical fiber push laser bonding operations on electric conductor leads includes providing an optical fiber push laser bonding system having an optical fiber for directing a laser beam, positioning first and second electrical leads in a bonding position, holding the first and second electrical leads in contact at a bond surface with an optical fiber, bonding the first and second electrical leads at the bond surface by directing the laser beam through the optical fiber, repeating said positioning, holding and bonding steps for a plurality of bonds, interrupting the aforesaid laser bonding operations in order to examine the condition of the fiber; wherein the following procedures occur during said interrupting directing the laser beam through the optical fiber, capturing the spatial energy distribution of the laser beam exiting the optical fiber and analyzing the spatial energy distribution of the laser beam to determine condition of the optical fiber in order to determine the need for corrective action.

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Singapore, Singapore

Say-Teng Lai