Disco Corporation

Sax Liao

Makoto Tanaka

Xin Lu

A wafer processing method includes a first correction step of measuring a distance 'a' between a first cut groove previously formed by a first cutting unit and a division line for the next cut groove, and correcting an actual index amount by using a deviation 'b' of the first cutting unit equivalent to the difference between the distance &#x201c;a&#x201d; and a proper index amount of the first cutting unit, and a second correction step of forming a measurement groove by using a second cutting unit along the division line for the next cut groove, measuring a distance &#x201c;c&#x201d; between the first cut groove and the measurement groove, and correcting an actual index amount of the second cutting unit by using a deviation &#x201c;d&#x201d; equivalent to the difference between the distance &#x201c;c&#x201d; and a proper index amount of the second cutting unit during the cutting step.

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Hsinchu, Taiwan

Sax Liao