Dow Corning Corporation

Satyendra Kumar Sarmah

Dimitris Katsoulis

Brian Harkness

Gary Thomas Burns

Geoffrey Bruce Gardner

Ronald Paul Boisvert

Gregory Scott Becker

Timothy Chi-Shan Chao

Louise Ann Malenfant

A semiconductor package comprising a wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and a cured silicone layer covering the surface of the wafer, provided at least a portion of each bond pad is not covered with the silicone layer and wherein the silicone layer is prepare by the method of the invention.

Semiconductor package and method of preparing same

A polymer matrix composite comprises a matrix of a cured methylsilsesquioxane resin and a reinforcing material. The composite has low heat release rate, smoke yield, and carbon monoxide yield when burned. After burning, the composite has high char yield and retains much of its initial tensile strength. The method for making the composite comprises applying a silanol-functional methylsilsesquioxane resin comprising 70 to 90 mol % ((CH.sub.3)SiO.sub.3/2) units and 10 to 25 mol % (CH.sub.3 Si(OH)0.sub.2/2) units to a reinforcing material and curing the resin.

Silicone resin composites for fire resistance applications and method

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Midland, MI, United States of America

Satyendra Kumar Sarmah