Jds Uniphase Corporation

Koninklijke Philips Corporation N.v.

Lumileds LLC

Satyanarayana Rao Peddada

Douglas E Crafts

Frank Lili Wei

James F Farrell

Duane Cook

Mark Brian Farrelly

Some embodiments include a III-nitride light emitting device with a light emitting layer disposed between an n-type region and a p-type region. A glass layer is connected to the III-nitride light emitting device. A wavelength converting layer is disposed between the III-nitride light emitting device and the glass layer. The glass layer is narrower than the III-nitride light emitting device.

Dicing a wafer of light emitting devices

Embodiments of the invention are directed to a method of separating a wafer of light emitting devices. The light emitting devices are disposed in rows. The method includes dividing the wafer into a plurality of regions. Each region comprises a plurality of rows of light emitting devices and a first region is wider than a second region. For each region, the method includes determining a position of first and second dicing streets. The dicing streets are located between the rows of light emitting devices. The method includes determining, using the position of the first and second dicing streets, positions of a plurality of dicing streets disposed between the first and second dicing streets. The method includes cutting the wafer along streets.

Separating a wafer of light emitting devices

An optical packaging arrangement combines a planar lightwave circuit (PLC) having an array of waveguides thereon, an array of photodetectors on a substrate to receive light beams coupled out of the PLC by the output ports, and a collimating faceplate, having a plurality of glass cores, extending between the PLC and the photodetector array for coupling the output light beams to respective photodetectors. The faceplate forms a cover for a hermetic cavity encompassing the photodetectors. The PLC is disposed either co-planarly with the faceplate or transversely to it. Light from the PLC is tapped via a plurality of taps formed on the PLC for coupling to the photodetectors.

Planar lightwave circuit package

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San Jose, CA, United States of America

Satyanarayana Rao Peddada