Smart Modular Technologies, Inc.

Satyanarayan Shivkumar Iyer

Robert S Pauley, Jr

Victor Mahran

Reuben J Chang

Mike Hossein Amidi

Fong-Long Lin

Kwang Jin Gooi

Approaches, techniques, and mechanisms are disclosed for manufacturing and operating high density memory systems. The high density memory systems can increase the amount of memory available to a computing system by allowing the connection of multiple memory modules into a single memory interface on a motherboard via a memory adapter as described herein.

High density memory module system

A system and method of manufacture of an integrated circuit device system includes mounting a first elevated device on a first riser positioned adjacent to a base device. The first elevated device includes a first device overhang that extends over the base device. A second elevated device can be mounted on a second riser adjacent to the first riser to allow the attachment of a second elevated device mounted above the first elevated device to achieve higher component densities.

Integrated circuit device system with elevated configuration and method of manufacture thereof

Approaches, techniques, and mechanisms are disclosed for manufacturing and operating portable module systems. The portable module systems can provide additional computing, memory, communication, networking, and power functionality in compact package that can be connected to a host system. The portable module system can dissipate thermal energy using an embedded cooling system to allow the use of high performance components. The portable module system can improve the functionality and computing capacity of the host system by linking off the shelf component boards with the external bus using a bridge interface unit to transfer information from an internal bus to the external bus.

Portable module system

A system and method of manufacture of an integrated circuit device system includes: a module interposer having a module first side and a module second side; an outer chip assembly mounted to the module first side; a mirrored chip assembly mounted to the module second side, the mirrored chip assembly below the outer chip assembly; and a carrier attached to the module second side, the carrier includes a carrier first side and a carrier second side, the mirrored chip assembly suspended above the carrier first side.

Integrated circuit device system with elevated stacked configuration and method of manufacture thereof

A system and method of manufacture of an integrated circuit device system includes: a carrier having a first side; a base device mounted on the first side; a first riser mounted on the first side; a second riser mounted on the first side and adjacent to the first riser; a peripheral elevated device mounted on the first riser, the peripheral elevated device having a device overhang above the base device; and an inner elevated device mounted on the second riser, the inner elevated device having the device overhang above the base device.

A memory module with attached transposer and interposers to provide additional surface area for the placement of memory devices is disclosed. The memory module includes a memory board with a first surface, a second surface and an edge with a set of electrical contacts. A transposer is attached to each surface of the memory board, and an interposer is attached to each transposer on the opposite surface of the transposer from the memory board. The interposer has space to allow placement of memory devices on both a first surface between the interposer and the memory board, and on a second surface of the interposer away from the memory board.

Growing community of inventors

Fremont, CA, United States of America

Satyanarayan Shivkumar Iyer