Reflectivity, Inc.

Texas Instruments Corporation

Reflectvity, Inc

Satyadev R Patel

Andrew Gerrit Huibers

Jonathan Clayton Doan

Peter W Richards

Andrew Gerritt Huibers

Peter Heureux

Steve S Chiang

Hongqin Shi

Gregory P Schaadt

James C Dunphy

Regis Grasser

Robert M Duboc

Terry Tarn

Douglas B MacDonald

Dmitri Simonian

Jianglong Zhang

Dietrich A Dehlinger

Michel Combes

Niles MacDonald

Igor Volfman

Christopher J Spindt

Jason S Reid

Jim Dunphy

Chris Spindt

Leonid Frenkel

John K Stockton

Greg Schaadt

Steven S Chiang

Fedor A Ilkov

The present invention provides a microstructure device comprising multiple substrates with the components of the device formed on the substrates. In order to maintain uniformity of the gap between the substrates, a plurality of pillars is provided and distributed in the gap so as to prevent decrease of the gap size. The increase of the gap size can be prevented by bonding the pillars to the components of the microstructure. Alternatively, the increase of the gap size can be prevented by maintaining the pressure inside the gap below the pressure under which the microstructure will be in operation. Electrical contact of the substrates on which the micromirrors and electrodes are formed can be made through many ways, such as electrical contact areas, electrical contact pads and electrical contact springs.

Micromirror array assembly

Micromirror array assembly with in-array pillars

A micromirror device and a method of making the same are disclosed herein. The micromirror device comprises a mirror plate, hinge, and post each having an electrically conductive layer. One of the hinge, mirror plate, and post further comprises an electrically insulating layer. To enable the electrical connections between the conducting layers of the hinge, mirror plate, and post, the insulating layer is patterned.

Method of fabricating micromirror device

Disclosed herein are a system and apparatus for operating a device that comprises an array of micromirrors. The system and apparatus are usable for repairing stuck micromirrors of the micromirror array during the operation. The reparation applies, at the ON state, two consecutive refresh voltages to the mirror plates of the micromirrors in the array with the pulses being separated in time longer than the characteristic oscillation time of the micromirrors. The reparation can be applied independently to the micromirrors. Alternatively, the reparation can be incorporated with a bias inversion process.

System and apparatus for repairing micromirrors in spatial light modulators

A micromirror of a micromirror array of a spatial light modulator used in display systems comprises a mirror plate attached to a hinge that is supported by two posts formed on a substrate. Also the mirror plate is operable to rotate along a rotation axis that is parallel to but offset from a diagonal of the mirror plate when viewed from the top. An imaginary line connecting the two posts is not parallel to either diagonal of the mirror plate.

Micromirror and post arrangements on substrates

A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Interferometers of high resolutions

A method is disclosed for forming a micromechanical device. The method includes fully or partially forming one or more micromechanical structures multiple times on a first substrate. A second substrate is bonded onto the first substrate so as to cover the multiple areas each having one or more micromechanical structures, so as to form a substrate assembly. The substrate assembly is then separated into individual dies, each die having the one or more micromechanical structures held on a portion of the first substrate, with a portion of the second substrate bonded to the first substrate portion. Finally, the second substrate portion is removed from each die to expose the one or more micromechanical structures on the first substrate portion. The invention is also directed to a method for forming a micromechanical device, including: forming one or more micromechanical structures in one or more areas on a first substrate; bonding caps onto the first substrate so as to cover the one or more areas each having one or more micromechanical structures, so as to form a substrate assembly; after a period of time, removing the caps to expose the one or more micromechanical structures. During the period of time between bonding the caps and later removing the caps, the substrate assembly can be singulated, inspected, irradiated, annealed, die attached, shipped and/or stored.

Method for making a micromechanical device by using a sacrificial substrate

The invention provides a method and apparatus for evaluating the quality of microelectromechanical devices having deformable and deflectable members using resonation techniques. Specifically, product quality characterized in terms of uniformity of the deformable and deflectable elements is inspected with an optical resonance mapping mechanism on a wafer-level.

Characterization of micromirror array devices using interferometers

The present invention discloses a method for processing a deformable element of a microstructure for reducing the plastic deformation by oxidizing the deformable element. The method of the present invention can be performed at a variety of stages of the fabrication and packaging processes.

Pre-oxidization of deformable elements of microstructures

A projection system is disclosed herein. The projection system employs a spatial light modulator comprising an array of individually addressable pixels for modulating the incident light based on image data. The modulated light is projected on a screen for viewing.

Mirror-based projection system with a programmable control unit for controlling a spatial light modulator

Growing community of inventors

Elk Grove, CA, United States of America

Satyadev R Patel