Kyocera Corporation

Satoshi Yoshiura

Tadashi Nagasawa

Chie Chikara

Satoshi Kajita

Yasuhide Tami

Kouji Fujikawa

An organic insulator is produced by cured resin product containing a cyclic olefin copolymer as a main component and has a cumulative luminescence amount measured by chemiluminescence measurement method of 4×10cpm or less. The glass transition temperature of the cured product is from 134° C. to 140° C. The cumulative luminescence amount is from 8.2.8×10cpm to 3.2×10cpm. A wiring board includes an insulation layer and an electrical conductor layer disposed on a surface of the insulation layer, and the insulation layer is the organic insulator described above.

Organic insulator and wiring board

A wiring board includes an insulating layer comprising organic resin with inorganic particles, a first metal layer on a first surface, and a second metal layer disposed on a second surface. The insulating layer has a thickness of 75-1000 μm and a storage modulus of 4 GPa-7 GPa. The first metal layer has a thickness of 1.5-10 μm and a coverage of 5%-25%. The second metal layer has a thickness of 3-10 μm or 25-100 μm and a coverage of 85% or more. A surface part of the insulating layer on the first metal layer side has a higher ratio of organic resin than a surface part of the insulating layer on the second metal layer side.

Wiring board

A laminated uncured sheet of the present disclosure has a structure in which resin sheet layers and resin layers are alternately laminated and a through hole penetrating in the laminating direction is formed, wherein the resin sheet layers are formed with a thermosetting resin composition containing a thermosetting resin as a main component, the resin layers are formed with a thermoplastic resin composition containing a thermoplastic resin, and the thermoplastic resin composition is adhered to the inner wall surface of the resin sheet layer part in the through hole.

Laminated uncured sheet

An organic insulator is composed an organic resin phase as a main component. The organic resin phase includes a weather-resistant stabilizer. The organic resin phase includes an inner region and a surface region formed in at least one surface of the inner region. The surface region has a higher content ratio of the weather-resistance stabilizer than the inner region. A metal-clad laminate includes the organic insulator and a metallic foil laminated on at least one surface of the organic insulator. A wiring board includes a plurality of insulating layers composed of the organic insulator, and a metallic foil disposed between the insulating layers.

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Kirishima, Japan

Satoshi Yoshiura