Brother Kogyo Kabushiki-kaisha

Fuji Corporation

Fuji Machine Mfg. Co., Ltd.

Satoshi Yoshioka

Isao Kubo

Shigeto Oyama

Takahiko Watari

Yukinori Nakayama

Kenji Nakai

Satoshi Ushii

Hirotaka Hirayama

Daiki Higashiguchi

A liquid ejecting apparatus includes an ejection portion and a circuit. The ejection portion has a plurality of ejection ports configured to eject liquid supplied from a liquid storage portion defining a liquid storage space configured to store liquid. The circuit is electrically connected to at least one of a bottom electrode and a side electrode. The circuit is configured to detect a capacitance between the bottom electrode and the side electrode. The bottom electrode is provided at a bottom surface of the liquid storage portion. The side electrode is provided at one side surface of the liquid storage portion and electrically isolated from the bottom electrode.

Liquid ejecting apparatus and cartridge

In a case where check unnecessary components (chip components a to c) that do not require checking of the mounted states of the other components before being mounted and check necessary components (die components X and Y) that require checking of the mounted states of the other components before being mounted are mounted on a board, the check unnecessary components are mounted first and the mounted state of each component is inspected. When mounting of the check unnecessary components is completed, the check necessary components are mounted after it is checked that the mounted states of the check unnecessary components are normal based on the inspection results.

Component mounting apparatus and component mounting system

The inspection support device is provided with a camera provided on a moving body so as to be capable of imaging a circuit board, and an imaging control section configured to control imaging processing of the camera and acquire image data of an inspection component, which is a component that is a target for inspection among electronic components mounted by the component mounter, when the inspection component is mounted on the circuit board. The imaging control section optimizes the performance sequence of multiple of the mounting operations and multiple of the imaging operations based on a moving distance of the moving body during the performance sequence or based on a time required for the mounting operation and the imaging operation during the performance sequence.

Inspection support device and inspection support method

A die mounting system in which die supply device is set on component mounter and dies supplied from die supply device are mounted on circuit board by mounting head of component mounter, determines the next die transfer position is determined such that the longer of time required for die transfer preparation operation (die imaging and image processing, die pickup operation, and movement and vertical inverting operation of a supply head) of die supply device and time required for die mounting operation (movement and vertical motion at the mounting position of mounting head) of component mounter is made shorter, and the difference (which corresponds to the waiting time at the die transfer position) between the two times decreased, such that the cycle time is shortened.

Die mounting system and die mounting method

In a die mounting system in which a die supply device is set on a component mounter and dies supplied from a die supply device are mounted on a circuit board by a mounting head of the component mounter, the position of a die is recognized by processing an image of the die on a dicing sheet captured by a camera, a supply head is moved to a die pickup position by a supply head moving mechanism, the die is picked up, the supply head is vertically inverted and moved to a die transfer position, and the die held by the supply head is picked up by a mounting head of the component mounter at a component transfer position and mounted on the circuit board. The die transfer position is set at a position such that die transfer and die imaging are able to be performed in parallel.

Growing community of inventors

Nagoya, Japan

Satoshi Yoshioka