Denso Corporation

Satoshi Yamaura

Keisuke Mizushiri

A sensor unit includes a first connection bus bar to a seventh connection bus bar connected to switch modules. The sensor unit includes a base integrally molding the first connection bus bar to the seventh connection bus bar. The sensor unit includes a plurality of magnetic-electric conversion units which detects current of the first connection bus bar to the seventh connection bus bar, respectively. The sensor unit includes a nut box connected to the base. The base and the nut box extends in the x-direction. A plurality of pillars, which are separated each other in the x-direction, are formed on the base. The nut box is fixed to the plurality of pillars by fixing bolts.

Sensor unit

The waterproof casing has a housing and a grommet. The grommet is disposed in a hole of the housing. The grommet has a body, a flange, and a lip. The flange extends radially outward from the body. The lip protrudes from an outer peripheral part of the body and extends in a circumferential direction. The lip has a high compression portion in contact with a wall surface of the hole and a low compression portion adjacent to the high compression portion at a further side from the flange. The low compression portion has a lower compressed state than the high compression portion. The housing has a recess to allow the low compression portion to escape radially outward.

Waterproof casing with a sealing grommet in a casting hole

A sensor unit includes a plurality of bus bars connected to a plurality of switch modules, a terminal block that integrally links the bus bars, and a plurality of magnetoelectric conversion parts that detect currents flowing through the bus bars. Embedded parts of the bus bars embedded in the terminal block are aligned in a first predefined direction with spaces therebetween. The magnetoelectric conversion parts are provided in the terminal block such that they face the embedded parts. Extension parts, extending in the first predefined direction, of any two embedded parts adjacent to each other in a predefined direction adjoin each other in a second predefined direction that intersects the first predefined direction.

A power conversion apparatus includes a plurality of semiconductor modules each having a semiconductor element integrated thereto; a plurality of cooling pipes that cools the semiconductor modules; a plurality of dummy modules with no integrated semiconductor element; and a pair of DC bus bars that constitute a current path between a DC power source and respective semiconductor modules. The semiconductor modules or the dummy modules, and the cooling pipes are alternately stacked to form a stack; m the plurality of semiconductor modules constitute an inverter circuit that converts a DC power supplied from the DC power source into a multi-phase AC power in which a plurality of types of AC outputs having mutually different phases are combined; and the dummy modules are each interposed between two semiconductor modules having mutually different phases of the AC outputs.

Power conversion apparatus

A power conversion apparatus includes a plurality of semiconductor modules each with a power terminal protruding therefrom, a capacitor, and a pair of bus bars. The power terminals include a pair of DC terminals electrically connected to the capacitor via the bus bars, and an AC terminal. Each of the bus bars includes terminal connection portions welded to the respective DC terminals and a common portion electrically connected to the plurality of terminal connection portions. The common portions are arranged between the sets of the plurality of power terminals. An insulation member is interposed between the pair of common portions. High-thermal-resistance portions having a higher thermal resistance than the terminal connection portions are each formed between the corresponding terminal connection portion and the corresponding common portion.

Power conversion apparatus and manufacturing method for the same

In an electric power converter, a stacked-layer unit has a plurality of semiconductor modules arrayed as layers along a stacking direction, each semiconductor module containing a semiconductor element and a pair of power terminals protruding outward in a protrusion direction at right angles to the stacking direction, each pair consisting of an AC terminal and a positive-polarity or negative-polarity power terminal. The semiconductor modules are arranged with the positive-polarity and negative-polarity power terminals in a single column at one side of the stacked-layer unit, and respectively connected to a positive-polarity busbar and negative-polarity busbar which are located at that side and which are separated by a fixed spacing in the protrusion direction, while the AC terminals of each layer-adjacent pair of semiconductor modules are connected in common to a corresponding one of a plurality of AC busbars.

Electric power converter having plurality of semiconductor modules arrayed in successive layers

A power conversion apparatus is provided which includes a semiconductor module which include a switching element, a cooler which cools the semiconductor module, and has a pair of cylindrical pipes which introduce a cooling medium to a channel therein or discharge the cooling medium, a frame which holds the cooler, and a pair of clamps which fix the cylindrical pipes to the frame. Each of the clamps has a fastener portion which is fastened to the frame, and a pressing portion which presses the cylindrical pipe toward the frame. Each of the cylindrical pipes is held between a concave support portion, which is formed in the frame, and the clamp. Each of the cylindrical pipes is supported by two support surfaces of the concave support portion and the pressing portion of the clamp at three support points when viewing from the direction in which the cylindrical pipe extends.

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Kariya, Japan

Satoshi Yamaura