Sharp Kabushiki Kaisha Corporation

Satoshi Yabuta

Katsuhiro Kawai

Masaru Kajitani

Masaya Okamoto

Mikio Katayama

Atsushi Ban

Shinya Yamakawa

An active matrix substrate of a Pixel on Passivation structure includes TFTs and pixel electrodes on an interlayer insulating film over bus lines. The interlayer insulating film is formed of an organic insulating film, and the contact layer of the TFT has a double layer structure of a fine crystal silicon (n.sup.+) layer and an amorphous silicon (n.sup.+) layer the crystal silicon (n.sup.+) layer being placed on the side closer to the source electrode and the drain electrode, and the amorphous silicon (n.sup.+) layer being placed on the opposite side. This improves both the ON characteristics and the OFF characteristics of the TFT are improved, and the stable operative region of the active matrix substrate and the margin to accommodate to variations in threshold value due to aging are expanded, without substantial additional production costs and a decrease in productivity.

Actived matrix substrate having a transistor with multi-layered ohmic

A thin film transistor (TFT) has a substrate. There is provided on the substrate a gate electrode, a gate insulating layer, a semiconductor layer, ohmic contact layers, electrodes (i.e., a source electrode and a drain electrode), and a protective layer in this order. An oxidized film is provided on a channel area of the semiconductor layer. With the arrangement, it is possible, without providing a channel protective layer, to prevent undesirable etching to the channel area, thereby greatly reducing the number of defective products. Since it is not necessary to make the semiconductor layer thicker than is required, it is possible to minimize the occurrence that the TFT characteristic is affected by the projected light. In addition, it is possible to realize miniaturization and to get a great aperture ratio when used as a switching element in a liquid crystal display (LCD) device.

Thin film transistor including oxidized film by oxidation of the surface

A simplified method of manufacturing an active matrix substrate is disclosed. Gate wires, gate electrodes, gate insulating films, an etching stopper layer, semiconductor layers and contact layers are formed on an electrically insulating substrate. Pixel electrode material films, second electrical conductor films and second insulating films are formed successively on the substrate. The second insulating film and the second electrical conductor film are simultaneously patterned, so that source wires, source electrodes and drain electrodes are formed from the second electrical conductor film, and a protective film from the second insulating film. Then, the pixel electrode material film is patterned thereby to form pixel electrodes in a plurality of regions defined by the gate wires and the source wires.

Method of manufacturing active matrix substrate

An object of the invention is to facilitate identifying the display color of each pixel during a test process and to apply a correction to a defective switching device in accordance with a test criterion established for each display color. On one transparent substrate, there are formed gate wiring and source wirings intersecting at right angles to each other so that insulation therebetween is maintained, and a pixel electrode and a TFT device are formed for each pixel, thus constructing one substrate member. On another transparent substrate, there is formed a counter electrode facing the pixel electrodes, and identifying means for identifying the display color of each pixel is formed on the side opposite from the side where the counter electrode is formed, the identifying means then being covered with a light-blocking member, thus constructing the another substrate member. The light-blocking member contains openings formed therethrough in portions facing the pixel electrodes. Since the display color of each pixel can be identified using the identifying means, a defective switching device in a pixel can be corrected in accordance with a correction criterion established for each display color.

Matrix type display device

An object of the invention is to enhance the ashing speed of resist. A parallel plate electrode type plasma etching device is used in a mixed gas atmosphere of SF.sub.6 gas and O.sub.2 gas with the concentration of SF.sub.6 gas defined within 5 vol. % to 15 vol. %. A substrate to be treated, coated with a resist of hydrocarbon polymer is placed on a lower electrode. A high frequency electric power is applied to an upper electrode and lower electrode placed parallel to each other, and a plasma of mixed gas is generated in the reactor. A chemical reaction is induced in the resist and active ions of the plasma to vaporize and remove the resist.

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Taki-gun, Japan

Satoshi Yabuta