Ebara Corporation

Fujitsu Corporation

Satoshi Wakabayashi

Tetsuji Togawa

Nobuyuki Takada

Daisuke Koga

Kunihiko Sakurai

Masahiko Sekimoto

Kenichiro Saito

Takuji Hayama

Kuniaki Yamaguchi

Hideo Aizawa

Soichi Isobe

Hiroomi Torii

Osamu Nabeya

Kenya Ito

Hirokuni Hiyama

Yutaka Wada

Hisanori Matsuo

Kazuto Hirokawa

Hiroo Suzuki

Hiroshi Sotozaki

Ryuichi Kosuge

Koji Ato

Yoriko Yamada

Takanori Hamano

Seiji Kurimoto

Yumiko Yamagata

Yoko Miura

Robert R Jackson

Yoshimi Yufu

A non-transitory computer-readable storage medium storing a control program that causes a computer to execute a process including receiving specified information generated in response to reception of an acquisition request of data from a terminal device that decrypts an encrypted data corresponding to the data, and identification information on the terminal device, determining whether or not the specified information is stored, in a storage unit, in association with the received identification information on the terminal device that has sent the acquisition request, the storage unit storing the specified information to be generated in association with the identification information on a terminal device for which a data acquisition is permitted for each of the plurality of pieces of data, and transmitting information that permits decryption of the encrypted data corresponding to the data to the terminal device when the specified information is stored in association with the received identification information.

Non-transitory computer-readable storage medium, and information processing device using unique file-specific information for decryption of a target file

A polishing apparatus has a plurality of polishing units. Moving mechanisms for moving top rings between polishing positions on polishing surfaces and wafer receiving/delivering positions are provided in each of the polishing units. Linear transporters are provided for transferring a wafer between a plurality of transferring positions including the wafer receiving/delivering positions. Pushers for receiving and delivering the wafer between the linear transporters and the top rings are provided at the transferring positions as the wafer receiving/delivering positions.

Polishing device and substrate processing device

A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring guide and the top ring guide lifting table together form a sealed space below the substrate held by the top ring in a condition where the substrate loader is moved up by the pusher mechanism, wherein the substrate is detached from the top ring by exhausting the sealed space while at the same time injecting a fluid from through-holes provided in a substrate holding surface of the top ring.

Substrate delivery mechanism

A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

Polishing apparatus

A polishing apparatus for polishing a workpiece has a polishing unit and a cleaning unit. The polishing unit has a polishing table having a polishing surface thereon, and a top ring for pressing the workpiece against the polishing surface. The cleaning unit has a rotatable shaft configured to be vertically movable, a holding mechanism mounted to the rotatable shaft for detachably holding the workpiece, and a plurality of cleaning devices disposed around the rotatable shaft for cleaning the workpiece which has been polished in the polishing unit.

A dressing apparatus is used for dressing a polishing surface of a polishing table used for polishing a workpiece such as a semiconductor wafer. The dressing apparatus for dressing apparatus comprises a dresser having a dressing surface for dressing the polishing surface, and the dressing surface has an area which covers an entire area of the polishing surface.

Dressing apparatus and polishing apparatus

Disclosed is a dressing apparatus wherein a polishing surface can be regenerated stably over a long period without any danger of an object to be polished being scratched. A dressing surface of a dresser is caused to slide on a polishing surface of a polishing table while the dressing surface is urged against the polishing surface. The dressing surface is formed from a grindstone

Dressing apparatus

The present invention provides a substrate holder for holding and transferring a thin substrate, comprising a substrate support member having a recessed area for placing a thin substrate therein and substrate mount portions formed in the recessed area in the vicinity of a circumferential edge thereof. The substrate mount portions is adapted to be engaged with an outer circumferential portion of a backside of the substrate placed in the recessed area. The substrate holder further comprises a substrate detector for detecting presence or absence of the substrate in the recessed area.

Substrate holder and substrate transfer apparatus using the same

An object of the present invention is to provide a polishing apparatus with a grinding plate that can easily and reliably be installed on and detached from a turntable. The polishing apparatus has a grinding plate tool, fixedly mounted on the turntable, which includes the grinding plate, and a top ring for holding a workpiece to be polished and pressing the workpiece against the grinding plate in sliding contact therewith for polishing a surface of the workpiece to a flat, mirror finish. A clamping mechanism is mounted in the turntable for fixing an outer circumferential flange of the grinding plate tool to the turntable.

A polishing apparatus has a polishing table having a polishing surface, a carrier for carrying a plate-like member and bringing the plate-like member into contact with the polishing surface, and a dresser including a dressing tool adapted to be brought into contact with the polishing surface to dress or normalize the polishing surface. The carrier is movable along a first path between a work position for bringing into contact the plate-like member with the polishing surface and a rest position. The dresser is movable along a second path between a work position for bringing the dressing tool into contact with the polishing surface and a rest position. The first and second paths have a common overlapping area. A contact prevention device is provided to prevent the carrier and the dresser from coming into contact with each other. An actuator is provided to bring the plate-like member into a condition that a predetermined area of the surface of the plate-like member extends beyond a peripheral edge of the polishing surface.

A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by the top ring and having a plurality of stages positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces. The polishing apparatus further includes a plurality of support tables removably held by the respective stages of the rotary transporter for supporting the workpieces, and a pusher for transferring the workpiece between the support table and the top ring.

Growing community of inventors

Tokyo, Japan

Satoshi Wakabayashi