Toyoda Gosei Co., Ltd.

Sumita Optical Glass, Inc.

Other

Satoshi Wada

Yoshinobu Suehiro

Kosei Fukui

Miki Moriyama

Ryoichi Tohmon

Hideaki Kato

Koichi Goshonoo

Koji Tasumi

Hiroki Watanabe

Kazuya Aida

Kento Hayashi

Yuhki Kawamura

Naruhito Sawanobori

Toshimasa Hayashi

Koichi Ota

Masao Kamiya

Yoshinori Yamamoto

Mitsuhiro Inoue

Kunihiro Hadame

Masaaki Ohtsuka

Takashi Nonogawa

Masaaki Osawa

Masayoshi Ichikawa

Hiroyuki Tajima

Seiji Yamaguchi

Yoshiki Saito

Masakata Koseki

Aya Kawaoka

Akihito Ota

Masato Aoki

Takashi Terayama

Koji Fukugawa

Yoshiki Taniyama

A light emitting device includes: a first semiconductor laser element; a second semiconductor laser element; and a light exit surface which emits light from the first semiconductor laser element and the second semiconductor laser element. The first semiconductor laser element is disposed at a position farther than the second semiconductor laser element as seen from a flat surface including a point on a surface of the light exit surface and perpendicular to a light extraction direction.

Light emitting device

Provided is a light-emitting device having low angle dependence of chromaticity as well as achieving wide-angle light distribution. The light-emitting device has a semiconductor laser diode, a first lens, a second lens, and a wavelength converting part for converting the wavelength of the laser beam emitted from the semiconductor laser diode. The first lens has a first spread angle and refracts the laser beam emitted from the semiconductor laser diode. The second lens has a second spread angle and refracts the laser beam refracted by the first lens. The second spread angle is larger than the first spread angle.

Light-emitting device

A light-emitting device includes a plurality of semiconductor laser elements including a first semiconductor laser element, and a plurality of reflectors including a first reflector for reflecting light emitted from the first semiconductor laser element, each of reflectors reflecting light emitted from corresponding one of the plurality of semiconductor laser elements. Light emitted from the first semiconductor laser element passes through a gap between two of the plurality of reflectors excluding the first reflector and reaches the first reflector. Lights emitted from the plurality of semiconductor laser elements are extracted in a direction different than an incident direction thereof toward the plurality of reflectors.

A light-emitting device includes a laser diode element, a wavelength-converting member that absorbs light emitted from the laser diode element and converts wavelength of the light, and a transparent conductive film that is arranged on at least one of a light extracting-side surface and a laser diode element-side surface of the wavelength-converting member. The transparent conductive film is configured such that electrical resistance in a region overlapping the wavelength-converting member increases when the wavelength-converting member is damaged.

A light emitting device includes plural light emitting elements, and plural plate-shaped wavelength conversion members that are arranged above the plural light emitting elements and separated from each other. At least a part of the plural wavelength conversion members is placed across above two or more light emitting elements of the plural light emitting elements. At least one of emission intensity of the plural light emitting elements and conversion efficiency of the plural wavelength conversion members is uneven.

A solid-state device includes a metal pattern formed on a substrate, a conductive bump connected to the metal pattern so as to be contact with a side surface of the metal pattern, and a solid-state element connected to the metal pattern via the conductive bump. A bottom surface level of at least a portion of the conductive bump is substantially equal to a bottom surface level of a portion of the metal pattern at which the metal pattern is connected to the conductive bump.

Solid-state device including a conductive bump connected to a metal pattern and method of manufacturing the same

A light emitting device includes: a substrate; an electrode pattern formed on the substrate; a light emitting element connected to the electrode pattern; a ridge-shaped resin covering portion which covers a part of the electrode pattern, and which includes a first and second outer edge portions; first and second through holes formed to penetrate through the electrode pattern such that the substrate is exposed; and first and second hole arrays including the first and second through holes arranged along the first and second outer edge portions, respectively. The first and second outer edge portions cover at least a part of the first and second through holes, respectively, and are bonded to the substrate in the first and second through holes, respectively.

A light emitting device includes: a semiconductor light emitting element having a sapphire substrate and a semiconductor layer; a mounting board; and a light transmission member, wherein: the sapphire substrate is bonded to the light transmission member by an adhesive material; the semiconductor light emitting element is mounted on the mounting board in the form of a flip-chip; and a roughened peripheral edge part is formed in the sapphire substrate in the mounting board side.

Light emitting device and method for manufacturing light emitting device

A light emitting element includes a crystal growth substrate formed in a flat shape and that has a translucency, a semiconductor layer that constitutes a light emitting element structure and is formed at a side of a first surface of the crystal growth substrate, irregularities formed on a second surface of the crystal growth substrate, the second surface being an opposite surface of the first surface, and a protective layer that has a translucency and a predetermined hardness and brittleness, and covers the irregularities formed on the second surface of the crystal growth substrate.

Light emitting element and method of manufacturing the same

A luminescent color conversion member of a light emitting device includes a glass and integrated particles dispersed inside the glass, each of the integrated particles being a mixture of phosphors and a dispersively binding material that are bonded to each other. The luminescent color conversion member is configured as a sintered body of a mixture of the integrated particles and glass particles. The dispersively binding material is a non-glass material having transparency and bondability to the phosphors.

Luminescent color conversion member and light emitting device

A light-emitting device includes a plurality of light-emitting elements face-down mounted on a substrate, a phosphor-containing film on the plurality of light-emitting elements directly or via a transparent adhesive layer, a transparent plate provided on the phosphor-containing film so as to directly contact the film, and a white reflector to cover a side surface of the plurality of light-emitting elements and, of side surfaces of the phosphor-containing film, at least a side surface not located above a gap between the plurality of light-emitting elements. At least a portion of a region directly above the gap is not covered with the phosphor-containing film.

Light-emitting device and method of manufacturing the same

A light-emitting device includes a plurality of light-emitting elements face-down mounted on a substrate, a plurality of structures each including a transparent plate, a phosphor-containing film provided on a lower surface of the transparent plate and a transparent covering layer provided on the lower surface of the transparent plate so as to cover lower and side surfaces of the phosphor-containing film, the structures being each provided on each of the plurality of light-emitting elements such that a lower surface of the transparent covering layer contacts a top surface of the plurality of light-emitting elements, and a white reflector to cover a side surface of the plurality of light-emitting elements and a side surfaces of the transparent covering layer. At least a portion of a region directly above a gap between the plurality of light-emitting elements is not covered with the phosphor-containing film.

Light emitting diode

A light emitting device includes a light emitting element and a luminescent color conversion layer covering a light emitting surface of the light emitting element. The luminescent color conversion layer includes a transparent synthetic resin material and integrated particles provided inside the transparent synthetic resin material, each of the integrated particles being a mixture of phosphors and a dispersively binding material that are bonded to each other. The dispersively binding material has transparency and bondability to the phosphors. The luminescent color conversion layer is arranged such that primary light and secondary light are mixed to generate a mixed color light and such that the mixed-color light is emitted outside from the luminescent color conversion layer, the primary light being excitation light emitted by the light emitting element, and the secondary light being a portion of the primary light that has been is color-converted by an excitation of the phosphors.

Growing community of inventors

Kiyosu, Japan

Satoshi Wada