Semiconductor Energy Laboratory Co., Ltd.

Satoshi Toriumi

Shunpei Yamazaki

Mitsuhiro Ichijo

Takashi Ohtsuki

Taketomi Asami

Masahiko Hayakawa

Mitsunori Sakama

Koji Dairiki

Makoto Furuno

Sho Kato

Akihisa Shimomura

Tetsuhiro Tanaka

Ryo Tokumaru

Toshiya Endo

Yasuhiro Jinbo

Fumito Isaka

Tomokazu Yokoi

Sachiaki Teduka

Hideaki Kuwabara

Masashi Tsubuku

Tamae Takano

Kenji Kasahara

Takashi Hamada

Yasumasa Yamane

Toshihiko Takeuchi

Yuhei Sato

Toru Mitsuki

Chiho Kokubo

Takeshi Shichi

Yoshikazu Hiura

Yasuyuki Arai

Hidekazu Miyairi

Hideto Ohnuma

Kosei Noda

Ryota Tajima

Kazutaka Kuriki

Tetsunori Maruyama

Yuki Imoto

Yuji Asano

Kazuki Tanemura

Noriyoshi Suzuki

Ryunosuke Honda

Toshiyuki Isa

Shinobu Furukawa

Kunihiko Fukuchi

Mai Sugikawa

Makoto Foruno

A minute transistor is provided that includes a first insulator, a second insulator, a first, conductor, a second conductor, and third conductor, in which an angle is formed between a side surface of the first insulator and a top surface of the first conductor, and a length between the first conductor and a surface of the second conductor closest to the first conductor is at least greater than a length between the first conductor and the third conductor.

Semiconductor device and manufacturing method of the same

A minute transistor with low parasitic capacitance, high frequency characteristics, favorable electrical characteristics, stable electrical characteristics, and low off-state current is provided. A semiconductor device includes a semiconductor over a substrate, a source and a drain over the semiconductor, a first insulator over the source and the drain, a second insulator over the semiconductor, a third insulator in contact with a side surface of the first insulator and over the second insulator, and a gate over the third insulator. The semiconductor includes a first region overlapping with the source, a second region overlapping with the drain, and a third region overlapping with the gate. The length between a top surface of the third region of the semiconductor and a bottom surface of the gate is longer than the length between the first region and the third region.

A semiconductor device includes a first layer, a second layer over the first layer, and a third layer over the second layer. The first layer includes a first transistor. The third layer includes a second transistor. A channel formation region of the first transistor includes a single crystal semiconductor. A channel formation region of the second transistor includes an oxide semiconductor. The second layer includes a first insulating film, a second insulating film, and a conductive film. The conductive film has a function of electrically connecting the first transistor and the second transistor. The first insulating film is over and in contact with the conductive film. The second insulating film is provided over the first insulating film. The second insulating film includes a region with a carbon concentration of greater than or equal to 1.77&#xd7;10atoms/cmand less than or equal to 1.0&#xd7;10atoms/cm.

Semiconductor device, manufacturing method thereof, and electronic device

A change in electrical characteristics is suppressed and reliability in a semiconductor device using a transistor including an oxide semiconductor is improved. One feature resides in forming an oxide semiconductor film over an oxygen-introduced insulating film, and then forming the source and drain electrodes with an antioxidant film thereunder. Here, in the antioxidant film, the width of a region overlapping with the source and drain electrodes is longer than the width of a region not overlapping with them. The transistor formed as such has less defects in the channel region, which will improve reliability of the semiconductor device.

Method for manufacturing semiconductor device

A transistor with favorable electrical characteristics is provided. A minute transistor is provided. Provided is a semiconductor device including a first insulator over a substrate, a second insulator over the first insulator, a semiconductor over the second insulator, a first conductor and a second conductor over the semiconductor, a third insulator over the semiconductor, a fourth insulator over the third insulator, a third conductor over the fourth insulator, and a fifth insulator over the first insulator, the first conductor, and the second conductor. In the semiconductor device, the second insulator and the third insulator each include at least one element other than oxygen included in the semiconductor, respectively, and the semiconductor includes a region having a carbon concentration of 3&#xd7;10atoms/cmor lower.

Semiconductor device and manufacturing method thereof

An object of the present invention is to prevent the deterioration of a TFT (thin film transistor). The deterioration of the TFT by a BT test is prevented by forming a silicon oxide nitride film between the semiconductor layer of the TFT and a substrate, wherein the silicon oxide nitride film ranges from 0.3 to 1.6 in a ratio of the concentration of N to the concentration of Si.

Semiconductor device and method for manufacturing the same

Electrical characteristics of a semiconductor device including the oxide semiconductor are improved. Furthermore, a highly reliable transistor with small variation in electrical characteristics is manufactured. An oxynitride insulating film functioning as a base insulating film and a transistor in contact with the oxynitride insulating film are provided. The transistor includes an oxide semiconductor film in contact with the oxynitride insulating film functioning as a base insulating film. The total amount of gas having a mass-to-charge ratio of 30 released from the oxynitride insulating film by heat treatment and double of the amount of a gas having a mass-to-charge ratio of 32 released from the oxynitride insulating film by heat treatment is greater than or equal to 5&#xd7;10/cmand less than or equal to 5&#xd7;10/cm, or greater than or equal to 5&#xd7;10/cmand less than or equal to 3&#xd7;10/cm.

A liquid crystal display device which includes a pair of substrates, a pixel including a liquid crystal element between the pair of substrates, a lighting portion provided on the outer side of the pair of substrates, a first polarizing member between the pair of substrates and the lighting portion, a reflective member provided outside the lightning portion, a second polarizing member on a side opposite to the first polarizing member with the pair of substrates provided therebetween, and a first optical sensor and a second optical sensor. The first optical sensor has a function of detecting illuminance of external light, and the second optical sensor has a function of detecting a color tone of polarized light emitted from the pixel portion. The lightning portion can emits light having a predetermined wavelength depending on the color tone of the pixel portion which is detected by the second optical sensor.

Liquid crystal display device having optical sensor

A change in electrical characteristics is suppressed and reliability in a semiconductor device using a transistor including an oxide semiconductor is improved. Oxygen is introduced into a surface of an insulating film, and then, an oxide semiconductor, a layer which is capable of blocking oxygen, a gate insulating film, and other films which composes a transistor are formed. For at least one of the first gate insulating film and the insulating film, three signals in Electron Spin Resonance Measurement are each observed in a certain range of g-factor. Reducing the sum of the spin densities of the signals will improve reliability of the semiconductor device.

A change in electrical characteristics is suppressed and reliability in a semiconductor device using a transistor including an oxide semiconductor is improved. The semiconductor device includes an oxide semiconductor film over an insulating surface, an antioxidant film over the insulating surface and the oxide semiconductor film, a pair of electrodes in contact with the antioxidant film, a gate insulating film over the pair of electrodes, and a gate electrode which is over the gate insulating film and overlaps with the oxide semiconductor film. In the antioxidant film, a width of a region overlapping with the pair of electrodes is longer than a width of a region not overlapping with the pair of electrodes.

Semiconductor device

An object is to increase conversion efficiency of a photoelectric conversion device without increase in the manufacturing steps. The photoelectric conversion device includes a first semiconductor layer formed using a single crystal semiconductor having one conductivity type which is formed over a supporting substrate, a buffer layer including a single crystal region and an amorphous region, a second semiconductor layer which includes a single crystal region and an amorphous region and is provided over the butler layer, and a third semiconductor layer having a conductivity type opposite to the one conductivity type, which is provided over the second semiconductor layer. A proportion of the single crystal region is higher than that of the amorphous region on the first semiconductor layer side in the second semiconductor layer, and the proportion of the amorphous region is higher than that of the single crystal region on the third semiconductor layer side.

Photoelectric conversion device and manufacturing method thereof

Provided is a silicon structure with a three-dimensionally complex shape. Further provided is a simple and easy method for manufacturing the silicon structure with the use of a phenomenon in which an ordered pattern is formed spontaneously to form a nano-structure. Plasma treatment under hydrogen atmosphere is performed on an amorphous silicon layer and the following processes are performed at the same time: a reaction process for growing microcrystalline silicon on a surface of the silicon layer and a reaction process for etching the amorphous silicon layer which is exposed, so that a nano-structure including an upper structure in a microcrystalline state and a lower structure in an amorphous state, over the silicon layer is formed; accordingly, a silicon structure with a three-dimensionally complex shape can be provided.

Silicon structure and manufacturing methods thereof and of capacitor including silicon structure

After a gate insulating film is formed over a gate electrode, in order to improve the quality of a microcrystalline semiconductor film which is formed in an early stage of deposition, a film near an interface with the gate insulating film is formed under a first deposition condition in which a deposition rate is low but the quality of a film to be formed is high, and then, a film is further deposited under a second deposition condition in which a deposition rate is high. Then, a buffer layer is formed to be in contact with the microcrystalline semiconductor film. Further, plasma treatment with a rare gas such as argon or hydrogen plasma treatment is performed before formation of the film under the first deposition condition for removing adsorbed water on a substrate.

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Kanagawa, Japan

Satoshi Toriumi