Other

Nippon Zeon Company, Ltd.

Fujitsu Corporation

Satoshi Tazaki

Akira Tanaka

Kishio Yokouchi

Yasuhiro Yoneda

Kei Sakamoto

Daisuke Mizutani

Yoshikatsu Ishizuki

A polyimide resin composition comprising a polyimide resin (A) and at least one 1H-tetrazole (B) selected from the group consisting of 1H-tetrazole, 5,5&prime;-bis-1H-tetrazole, and derivatives thereof, and having an excellent rust preventing effect on copper and copper alloys.

Polyimide film

Pattern forming process using polyimide resin composition

Polyimide resin composition

Provided are photosensitive resin compositions comprising a polyamic compound having, at each terminal thereof, a specific actinic ray-sensitive functional group which has substituent groups each having a photopolymerizable carbon-carbon double bond, a photosensitive auxiliary having a photopolymerizable functional group and a solvent. The photosensitive resin compositions of the invention are excellent in resist properties such as sensitivity and good in storage stability and can provide a film small in residual stress.

Photosensitive polyimide resin composition

Growing community of inventors

Kanagawa, Japan

Satoshi Tazaki