Mitsubishi Heavy Industries Limited

Satoshi Tawara

Takayuki Goto

Jun Utsumi

Kensuke Ide

Masato Kinouchi

Takenori Suzuki

Takeshi Tsuno

Yoichiro Tsumura

Hiroshi Yasukura

Yasuhiro Kanai

A room temperature bonding apparatus includes angle adjustment means supporting a first sample stage holding a first substrate so as to be able to change a direction of the first sample stage; a first driving device driving the first stage in a first direction; a second driving device driving a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table supporting the second sample stage in the first direction when the second substrate and the first substrate are brought into contact. The apparatus can impose a load exceeding a withstand load of the second driving device on the first and second substrates. Further, the apparatus uses angle adjustment means to change direction of the first substrate to be parallel with the second substrate and uniformly impose the larger load on a bonding surface.

Room temperature bonding apparatus

A room temperature bonding machine is provided with an evacuation apparatus, a gas supply apparatus, a pressure gauge, a cleaner apparatus, a pressure controller and a pressing mechanism. The evacuation apparatus evacuates gas from the chamber. The gas supply apparatus supplies introduction gas into the chamber. The pressure gauge measures the pressure in the chamber. The cleaner apparatus cleans first and second substrates in the chamber when said pressure is at a predetermined degree of vacuum. The pressure controller controls both of the evacuation apparatus and the gas supply apparatus so that the pressure is regulated to a target pressure. The pressing mechanism presses and bonds the first and second substrates when the pressure is set to said target pressure.

Room temperature bonding machine and room temperature bonding method

A room temperature bonding apparatus according to the present invention is provided with a load lock chamber having an internal space which is pressure-reduced; and a cartridge arranged in the load lock chamber. The cartridge includes an island portion formed to contact a substrate when the substrate is put on the cartridge. A flow passage is formed for the island portion to connect a space between the cartridge and the substrate to outside when the substrate is put on the cartridge. Therefore, in the room temperature bonding apparatus can prevent making the substrate is moved to the cartridge due to gas when the internal space is pressure-reduced.

A room temperature bonding apparatus includes: an angle adjustment mechanism that supports a first sample stage holding a first substrate to a first stage so as to be able to change a direction of the first sample stage; a first driving device that drives the first stage in a first direction; a second driving device that drives a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table that supports the second sample stage in the first direction when the second substrate and the first substrate are brought into press contact with each other. In this case, the room temperature bonding apparatus can impose a larger load exceeding a withstand load of the second driving device on the first substrate and the second substrate. Further, the room temperature bonding apparatus can use the angle adjustment mechanism to change a direction of the first substrate such that the first substrate and the second substrate come into parallel contact with each other, and uniformly impose the larger load on a bonding surface.

A wafer bonding apparatus of the present invention includes a first sample base configured to hold a first substrate; a second sample base configured to hold a second substrate to oppose to the first substrate; a load transferring section coupled to an outer edge portion of the first sample base and configured to support the first sample base to a first stage; and a drive unit configured to perform pressure bonding on the first substrate and the second substrate by driving the second sample base to the first stage. In the wafer bonding apparatus, it is possible to prevent that a load which is larger than a load applied on the outer edge portion of the first substrate is applied to the center of the first substrate, and to apply uniform load the first substrate and the second substrate, when pressure bonding is performed on the first substrate and the second substrate.

Wafer bonding apparatus

A grinding apparatus with a grinding wheel on the output shaft of a fluid servomotor driven by fluid from a fluid source and controlled by a servo valve. The servomotor housing is mounted on a stage moveable toward a work to press the grinding wheel against the work. The output shaft extends through a cover. A rotational speed detector includes a rotating member disposed on the output shaft inside the cover and a rotation detecting member attached to the cover facing the rotating member. Differences between the detected rotational speed of the shaft and a target rotational speed are determined by a control device, and the stage is moved in response to signals from the control device, so grinding can be adapted to various conditions. To increase grinding efficiency of the grinding wheel, the target rotation speed is set at the maximum output speed range and the grinding wheel is pressed with increased force against the work, or to prevent wear of the grinding wheel, the target rotation speed is set at the high speed range and the grinding wheel is pressed with decreased force against the work.

Grinding apparatus using fluid servomotor

A grinding swarf collector is disclosed. An outer periphery and side surfaces of a grinding wheel, except a site of grinding including a grinding point, are covered with a cover. A dust collecting plate is disposed behind the grinding point in a direction of rotation of the grinding wheel. Swarf scattered rearward collides with the dust collecting plate, and is scooped up thereby toward a suction port. The suction port sucks the swarf, which is sucked into a vacuum cleaner. Swarf scattered around the grinding wheel collides with the cover, falls to an opening formed below, and is sucked through the suction port. Thus, grinding swarf is collected efficiently.

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Yokohama, Japan

Satoshi Tawara