Disco Corporation

Satoshi Tateiwa

Kazuma Sekiya

Koichi Yajima

Ken Kimura

Takayuki Umahashi

Mirei Toida

A liquid jet machining apparatus including holding means for holding a workpiece, liquid jet application means for applying a liquid jet to the workpiece held by the holding means, and catching means for catching the liquid jet which has penetrated the workpiece. The catching means includes a tank for accommodating a liquid. At the bottom of the tank, a cushioning member is replaceably disposed, and an abrasive is accumulated. The liquid jet having penetrated the workpiece acts on the liquid accommodated in the tank, and then acts on the cushioning member and the abrasive. Wave suppressing means for suppressing generation of waves due to the liquid jet acting on the liquid accommodated within the tank is disposed in an upper portion of the tank.

Liquid jet machining apparatus

A water jet processing method for cutting a workpiece having a first group composed of first plural cutting lines extending in a predetermined direction and a second group composed of second plural cutting lines formed perpendicular to the plural cutting lines of the first group along the plural cutting lines of the first group and the plural cutting lines of the second group formed on the workpiece by injecting a water jet, which comprises a first cutting step for injecting a water jet to the cutting lines of the first group continuously and a second cutting step for injecting a water jet to the cutting lines of the second group continuously while the workpiece is supported by a support member.

Water jet processing method

A method of dividing a semiconductor wafer of which the surface has a plurality of chips sectioned by streets, into individual chips, characterized in that it comprises a scribing step in which division guide lines are formed by drawing scribed lines along the streets on the surface of the semiconductor wafer, a tape sticking step in which a tape is stuck onto the surface having the division guide lines formed thereon, of the semiconductor wafer, and a back surface cutting step in which cutting grooves are formed in the back surface, to which the tape is stuck, of the semiconductor wafer such that a bit of uncut portions are left along the division guide lines.

Growing community of inventors

Tokyo, Japan

Satoshi Tateiwa