Sony Corporation

Nippon Sheet Glass Company, Limited

Ricoh Company, Ltd.

Sharp Kabushiki Kaisha Corporation

Sony Semiconductor Solutions Corporation

Micro Optics Co., Ltd.

Satoshi Taniguchi

Katsuhiko Takeuchi

Hideki Ono

Kenjiro Hamanaka

Nobuhiro Suzuki

Toshikazu Suzuki

Tomonori Hino

Jun Araseki

Akira Ishibashi

Hiroshi Hamada

Hiroyuki Okuyama

Takahiro Arakida

Katsuyuki Yamada

Tomoyuki Oki

Rintaro Koda

Masao Ikeda

Hiroshi Miura

Hiroshi Deguchi

Kenichi Nakama

Yuji Masui

Hajime Yuzurihara

Eiko Hibino

Kazushi Nakano

Shinya Narumi

Satoshi Ito

Mikiko Abe

Norihiko Yamaguchi

Hironori Tsukamoto

Hiroshi Koshi

Kayoko Kikuchi

Takeshi Kibe

Kenji Morio

Chiyomi Uchiyama

Hiroko Miyashita

Atsushi Toda

Takashi Kobayashi

Yasuyuki Watanabe

Masaharu Nagai

Takashi Kishimoto

Yasuhiro Terai

Takeshi Morita

Norikazu Nakayama

Motonobu Takeya

Daisuke Arai

Shigetaka Tomiya

Koshi Tamamura

Mikihiro Yokozeki

Shigeru Kanematsu

Eisaku Kato

Satoru Kijima

Masashi Yanagita

Atsunori Matsuda

Naoto Hirayama

Minoru Taniyama

Hiroyasu Noguchi

Masatake Ishikawa

Toshi-kazu Suzuki

Kazuya Ookawa

Takanori Higashi

[Overview] [Problem to be Solved] To provide a switching transistor and a semiconductor module having lower distortion generated in a signal. [Solution] A switching transistor including: a channel layer including a compound semiconductor and having sheet electron density equal to or higher than 1.7&#xd7;10cm; a barrier layer formed on the channel layer by using a compound semiconductor that is of a different type from the channel layer; a gate electrode provided on the barrier layer; and a source electrode and a drain electrode provided on the barrier layer with the gate electrode interposed between the source electrode and the drain electrode.

Switching transistor and semiconductor module to suppress signal distortion

A semiconductor device includes: a channel layer made of a compound semiconductor; a barrier layer provided above the channel layer and made of a compound semiconductor in which an energy band on a carrier travel side in a junction with respect to the channel layer is farther from an intrinsic Fermi level in the channel layer than in the channel layer; a low-resistance region provided in a surface layer of the barrier layer, in which resistance is kept lower than portions around by containing impurity; a source electrode and a drain electrode connected to the barrier layer at positions sandwiching the low-resistance region; a gate insulating layer provided on the low-resistance region; and a gate electrode provided above the low-resistance region through the gate insulating layer.

High mobility electron transistor

A semiconductor device includes: a laminated body including a channel layer that is configured of a compound semiconductor; and at least one gate electrode that is provided on a top surface side of the laminated body, wherein the laminated body includes a first low-resistance region that is provided on the top surface side of the laminated body, the first low-resistance region facing the at least one gate electrode, and a second low-resistance region that is provided externally of the first low resistance region on the top surface side of the laminated body, the second low-resistance region being continuous with the first low-resistance region.

Semiconductor device, antenna switch circuit, and radio communication apparatus

Provided is a semiconductor apparatus including a channel layer, an upper barrier layer that is provided on the channel layer, a first barrier layer that constitutes a boundary layer on a side of the channel layer in the upper barrier layer, a second barrier layer that is provided in a surface layer of the upper barrier layer, a low-resistance region that is provided in at least a surface layer in the second barrier layer, a source electrode and a drain electrode that are connected to the second barrier layer, at positions across the low-resistance region, a gate insulating film that is provided on the low-resistance region, and a gate electrode that is provided above the low-resistance region via the gate insulating film.

Semiconductor apparatus and manufacturing method of the semiconductor apparatus

A semiconductor device includes a channel layer; and a high resistance layer that is provided on the channel layer, and is made of a semiconductor with high resistance which has a conduction band position higher than that of the semiconductor which forms the channel layer. The semiconductor device includes a first conduction-type low resistance region provided on a surface layer of the high resistance layer, and is made of a semiconductor including first conduction type impurities. The semiconductor device includes: a source electrode and a drain electrode that are connected to the high resistance layer, in a position crossing the low resistance region; a gate insulating film provided on the low resistance region; and a gate electrode provided on the low resistance region via the gate insulating film. The semiconductor device includes current block regions between the low resistance region, and between the source electrode and the drain electrode respectively.

Semiconductor device and method of manufacturing the semiconductor device

The present application provides a thin film transistor and a method of manufacturing same capable of suppressing diffusion of aluminum to oxide semiconductor and selectively etching oxide semiconductor and aluminum oxide. The thin film transistor includes: a gate electrode; a channel layer whose main component is oxide semiconductor; a gate insulating film provided between the gate electrode and the channel layer; a sealing layer provided on the side opposite to the gate electrode, of the channel layer; and a pair of electrodes which are in contact with the channel layer and serve as a source and a drain. The sealing layer includes at least a first insulating film made of a first insulating material, and a second insulating film made of a second insulting material having etching selectivity to each of the oxide semiconductor and the first insulating material and provided between the first insulating film and the channel layer.

Thin film transistor, method of manufacturing the same, and display device

There is provided a thin film transistor including: a gate electrode; a pair of source/drain electrodes; a first oxide semiconductor layer provided between the gate electrode, and the pair of source/drain electrodes, and forming a channel; and a second oxide semiconductor layer provided on the pair of source/drain electrodes side of the first oxide semiconductor layer, and having a polarity different from that of the first oxide semiconductor layer.

Thin film transistor, method of manufacturing thin film transistor, display unit, and electronic device

A thin film transistor, which is capable of improving carrier mobility, and a display device and an electronic device, each of which uses the thin film transistor, are provided. The thin film transistor includes: a gate electrode; an oxide semiconductor layer including a multilayer film including a carrier travel layer configuring a channel and a carrier supply layer for supplying carriers to the carrier travel layer; a gate insulating film provided between the gate electrode and the oxide semiconductor layer; and a pair of electrodes as a source and a drain. A conduction band minimum level or a valence band maximum level corresponding to a carrier supply source of the carrier supply layer is higher in energy than a conduction band minimum level or a valence band maximum level corresponding to a carrier supply destination of the carrier travel layer.

Thin film transistor, display device, and electronic device

A method for making a light-emitting element assembly including a support substrate having a first surface, a second surface facing the first surface, a recessed portion, and a conductive material layer formed over the first surface and the inner surface of the recessed portion, and a light-emitting element. The light-emitting element has a laminated structure including a first compound semiconductor layer, a light-emitting portion, and a second compound semiconductor layer, at least the second compound semiconductor layer and the light-emitting portion constituting a mesa structure. The light-emitting element further includes an insulating layer formed, a second electrode, and a first electrode. The mesa structure is placed in the recessed portion so that the conductive material layer and the second electrode are in at least partial contact with each other, and light emitted from the light-emitting portion is emitted from the second surface side of the first compound semiconductor layer.

Light-emitting element assembly and method for manufacturing the same

There is provided a method of manufacturing a semiconductor device which, in the case where an InP-based device is formed with a sacrificial layer in between, is capable of obtaining better device characteristics than those in the case where an AlAs single layer is used as the sacrificial layer, and which does not have the possibility that the device layer is etched together with the sacrificial layer during etching of the sacrificial layer. A method of manufacturing a semiconductor device includes: a formation step of forming a sacrificial layer which is pseudomorphic to InP on an InP substrate, and then forming an InP-based device layer on the sacrificial layer; and a separation step of separating the InP substrate and the device layer from each other by etching the sacrificial layer.

Method of manufacturing semiconductor device

A nondestructive testing method for an oxide semiconductor layer includes the steps of applying excitation light to an amorphous or polycrystalline target oxide semiconductor layer to be tested and measuring an intensity of photoluminescence in a wavelength region longer than a wavelength corresponding to a bandgap energy among light emitted from the target oxide semiconductor layer; and estimating a film property of the target oxide semiconductor layer on the basis of measurement results.

Nondestructive testing method for oxide semiconductor layer and method for making oxide semiconductor layer

A light-emitting element assembly includes a support substrate having a first surface, a second surface facing the first surface, a recessed portion, and a conductive material layer formed over the first surface and the inner surface of the recessed portion, and a light-emitting element. The light-emitting element has a laminated structure including a first compound semiconductor layer, a light-emitting portion, and a second compound semiconductor layer, at least the second compound semiconductor layer and the light-emitting portion constituting a mesa structure. The light-emitting element further includes an insulating layer formed, a second electrode, and a first electrode. The mesa structure is placed in the recessed portion so that the conductive material layer and the second electrode are in at least partial contact with each other, and light emitted from the light-emitting portion is emitted from the second surface side of the first compound semiconductor layer.

Growing community of inventors

Kanagawa, Japan

Satoshi Taniguchi