Kioxia Corporation

Satoshi Tanaka

Hiroyuki Tanizaki

Soichi Inoue

Manabu Takakuwa

Kiminori Yoshino

Kentaro Kasa

Hiroaki Shirakawa

Susumu Iida

Takayuki Uchiyama

Kaori Fumita

A measuring device includes a light source that irradiates a measurement spot on a wafer formed with memory holes and slits with a multi-wavelength light, a first imaging unit that acquires a first pupil plane intensity distribution image of reflected light from the measurement spot, a second imaging unit that acquires a second pupil plane intensity distribution image of the reflected light, and a detection unit that analyzes the second pupil plane intensity distribution image to measure overlay. The measuring device includes an overlay analysis unit that acquires the first and second pupil plane intensity distribution images while moving a position of the measurement spot and selects a measurement spot not including the slit based on the first pupil plane intensity distribution image, and uses the overlay obtained by analyzing the second pupil plane intensity distribution image of the selected measurement spot as the overlay of the memory hole and a slit.

Measuring device and measuring method

A measurement apparatus which measures a relative positional displacement amount of a partial pattern to another pattern in a complex pattern on a surface of an object, includes: a measurement part to measure two-dimensional intensity distributions having a first and a second two-dimensional intensity distribution, the first distribution being formed by applying first light having a first shape to a region on which the complex pattern is measured and detecting only zero order diffraction light from the region via a first filter, and the second distribution being formed by applying second light having a second shape to the region and detecting only zero order diffraction light from the region via a second filter; a storage part to store measurement data indicating the distributions; and a calculation part to form a synthesized intensity distribution obtained by the two-dimensional intensity distributions to calculate a positional displacement amount of the partial pattern.

Measurement apparatus and measurement method

A pattern according to an embodiment includes first and second line patterns, each of the first and second line patterns extends in a direction intersecting a &#x3c;111&#x3e; direction and has a side surface, the side surface has at least one {111} crystal plane, the side surface of the first line pattern has a first roughness, and the side surface of the second line pattern has a second roughness larger than the first roughness.

Substrate and method for calibration of measurement apparatus

Growing community of inventors

Kawasaki Kanagawa, Japan

Satoshi Tanaka