Denso Corporation

Other

Satoshi Takeuchi

Koji Kondo

Motoki Shimizu

Toshihiro Miyake

Tomohiro Yokochi

Hiroki Kamiya

Toshikazu Harada

Teiyuu Kimura

Shinji Nanba

Kazuo Tada

Katsumi Yamazaki

Eiichi Kobayashi

Toshihisa Taniguchi

Atusi Sakaida

Yoshihiko Shiraishi

Tsuyoshi Arai

Masahiko Ito

Yoshitaro Yazaki

Katsuyoshi Nishii

Masashi Totokawa

Kazuhiro Umetani

Noriyasu Inomata

Satoru Kodama

Rie Ohsaki

Masakazu Terada

Kunihiro Kodama

Masayuki Aoyama

Tsukasa Koumura

Yosuke Ozaki

Junichiro Hayano

Masao Hasegawa

Katsunori Kubota

Seiichi Yamada

Yoshihide Itou

Maki Chiba

Shuntaro Iguro

Seiji Konishi

Seiichi Shindou

In a manufacturing method of a soft magnetic member, a material powder that includes ferrous particles and an organic layer formed on a surface of each of the ferrous particles is prepared. The organic layer contains at least one element selected from the group consisting of Si, Mg, Ti, and V. The material powder is compacted to form a green compact, and the green compact is induction-heated with a frequency of 100 kHz or higher to form an insulation layer made of an oxide containing the element on the surface of each of the ferrous particles.

Soft magnetic member and manufacturing method of soft magnetic member

An induction heating apparatus includes: a core that has a pair of magnetic poles and transfers magnetic flux; a coil generating magnetic flux; conductors adjacently provided on both left and right sides of the magnetic poles; and lateral magnetic members formed of a magnetic material and arranged on an outer side of end portions of the object so as to extend along the end portions. The conductors shut off the magnetic flux that flows from a center portion of the heating object, taking a detour to the end portions, permit the magnetic flux to concentrate on the center portion, and accelerate temperature rise. The lateral magnetic members introduce the magnetic flux that propagates from one surface to the other surface, detouring around the end portions to thereby mitigate the magnetic flux density in the end portions and suppress overheating.

Induction heating apparatus

A dielectric heating system which is provided with a high frequency oscillator, a housing which forms part of a waveguide and is provided with a loading opening and unloading opening, first and second conductive closing members which respectively close the loading opening and the unloading opening from the inner side of the housing, and a first position holding member which holds the object to be heated inside the housing, which makes the first conductive closing member slide to open the loading opening and charges the object to be heated into the housing, and which makes the second conductive closing member slide to open the unloading opening and unload the object to outside the housing.

Material heating and providing apparatus

In a printed circuit board manufacturing equipment, a pressing die includes a first pressing part, a second pressing part, and a frame part. A buffer member is disposed between a first surface of a laminated body and the first pressing part. The second pressing part has a portion facing a second surface of the laminated body and a portion facing the buffer member. The frame part surrounds a whole area of a side surface of the buffer member. Before pressing and heating, the laminated body, the second pressing part, and the buffer member define an escape space therebetween for escaping the buffer member deformed due to the pressing. A lip protrudes from the frame part toward the laminated body. The lip is deformed following the deformation of the buffer member and comes in contact with a surface of the second pressing part facing the buffer member.

Printed circuit board manufacturing equipment

A component-embedded board device has a wiring board in which an electronic component is embedded, a connection member which is conductive and arranged at a surface of the wiring board, and an inner wiring unit which is arranged in the wiring board and connects an electrode of the electronic component with the connection member. The component-embedded board device is further provided with an inspection connection member for an inspection of a faulty wiring of the inner wiring unit, and an inspection wiring unit which is arranged in the wiring board and connects the inspection connection member with one of the electrode and a predetermined portion of the inner wiring unit. The inspection connection member is conductive and arranged at a surface of the wiring board.

Component-embedded board device and faulty wiring detecting method for the same

A multilayer substrate includes an insulating base member having a plurality of resin films, an electric element embedded in the insulating base member, and a spacer. The resin films are made of a thermoplastic resin and stacked and attached to each other. At least one resin film has a through hole for inserting the electric element. The one resin film further has a plurality of protruding members. One protruding member opposes to another one protruding member so that the one and the another one contact and sandwich the electric element. The spacer is arranged between the one resin film and an adjacent resin film and is disposed at a base portion of one of the protruding members.

Multilayer substrate and method of manufacturing the same

A multi-layer printed circuit board includes: a resin substrate including a plurality of laminated thermoplastic resin films; a thin film resistor embedded in the resin substrate; and an electrode disposed on the thin film resistor. The thermoplastic resin film includes a conductive pattern made of metallic film. The electrode is covered with the conductive pattern disposed over or under the electrode.

Multi-layer printed circuit board and method for manufacturing the same

Two types of resin films are prepared for manufacturing a multi-layer board containing a chip component. A fist type has a via hole for the chip component to be inserted into, while a second type does not have the via hole. Resin films including the two types are piled before the chip component is inserted. At least a given resin film of the first type has a via hole provided with protruding members. Of the protruding members, opposing protruding members form a gap between their tips. This gap is shorter than an outer dimension of the inserted chip component. The chip component crushes portion of the tips of the protruding members while being pressed and inserted into the via hole in the given resin film.

Multi-layer board manufacturing method

A multilayer printed circuit board with a built-in capacitor includes a plurality of resin films, each of which is made of thermoplastic resin and has a plurality of via-holes at predetermined positions, a plurality of conductive patterns, which are located on the resin films, and a plurality of conductive pattern interconnecting members, which are located in the via-holes to electrically interconnect the conductive patterns that are electrically separated by the resin films. Two of the conductive patterns are respectively located on two surfaces, which are opposite to each other, of one of the resin films while overlapping. The two of the conductive patterns and the one of the resin films make up a capacitor.

Printed circuit board with a built-in passive device, manufacturing method of the printed circuit board, and elemental board for the printed circuit board

A manufacturing method of a printed wiring board having an embedded electric device is as follows. A first resin film having an opening or a sheet member having a recess is piled with a plurality of second resin films, on which a plurality of conductive layers is formed. The first and second resin films and the sheet member include thermoplastic resin. An electric device is inserted in the opening or the recess. Then, the piled body including the electric device is pressed and heated to integrate the piled body. When the piled body is pressed and heated, electrodes of the electric device are electrically connected to the conductive layers while the first and second resin films and the sheet member plastically deformed to seal the electric device.

Method for manufacturing printed wiring board with embedded electric device

In a manufacturing method of a rigid-flexible printed circuit board, slits for defining two sides of a removing portion are formed in a part of plural resin films, and the plural resin films are stacked and bonded to form a circuit board. Then, a product portion is cut from the circuit board. Before the bonding, a separation sheet is disposed between predetermined adjacent layers of the plural resin films to separate the removing portion from a residual portion of the product portion. Accordingly, while the product portion is cut from the circuit board, the removing portion is separated from the product portion, because the removing portion are defined by the separation sheet, the slits, and a cutting outline of the product portion.

Manufacturing method of rigid-flexible printed circuit board and structure thereof

In a clinical and physiological abnormality monitoring apparatus, and blood pressure monitoring apparatus detects a blood pressure abnormality and the like of a body by employing a pulse wave signal. A frequency analysis is carried out with respect to a pulse wave signal, while this pulse wave signal corresponds to time sequential data of pulse waves. As a result, both a C-frequency component indicative of a fluctuation component of a base line of the pulse wave signal, and also an A-frequency component representative of the respective pulse waves are acquired. A ratio C/A of power of a peak contained in the C-frequency component with respect to power of a peak contained in the A-frequency component is calculated to determine abnormality of the blood pressure.

Method and apparatus for monitoring biological abnormality and blood pressure

A printed wiring board having an embedded electric device is manufactured as follows. A first resin film having an opening or a sheet member having a recess is piled with a plurality of second resin films, on which a plurality of conductive layers are formed. The first and second resin films and the sheet member include thermoplastic resin. An electric device is inserted in the opening or the recess. Then, the piled body including the electric device is pressed and heated to integrate the piled body. When the piled body is pressed and heated, a plurality of electrodes of the electric device are electrically connected to the conductive layers while the first and second resin films and the sheet member plastically deformed to seal the electric device.

Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device

A vital signal detecting apparatus comprises an attachable device to be attached to a finger, a sensor having a light-emitting device and a light-receiving device, and a transmitting circuit for transmitting a signal waveform as a pulse wave from the sensor to a pulse wave monitoring unit. The pulse wave detecting unit also has an attachment detecting circuit for detecting whether or not the attachable device is in an attached state by comparing a signal waveform obtained when the light-emitting device is on with a signal waveform obtained when the light-emitting device is off and an operation control circuit for controlling the operation of the sensor, the transmitting circuit and the attachment detecting circuit. Preferably, the light-transmitting plate is disposed above the light-emitting device and the light-receiving device to pass light therethrough, and the light transmitting plate may be an IR-cut filter capable of blocking light of wavelengths greater than 700 nm.

Growing community of inventors

Nagoya, Japan

Satoshi Takeuchi