Seiko Epson Corporation

Satoshi Suzuki

Mitsuru Sato

Yasutaka Matsumoto

Takashi Saiba

Hitoshi Matsumoto

Satoshi Kimura

Wataru Takahashi

Osamu Tonomura

Kei Jintsugawa

A nozzle plate includes a nozzle open to one surface of the nozzle plate to eject ink, and a diamond-like carbon (DLC) layer disposed adjacent to the one surface. The DLC layer has surface irregularities including recesses and protrusions. The protrusions adjoining one another have ends to be in contact with the ink. The ends are located at mutually different positions in a direction intersecting the one surface.

Nozzle plate, liquid ejecting head, and liquid ejecting apparatus

A liquid ejecting head (recording head) includes a structure (flow path member) having a plurality of stacked plates (a nozzle plate, a flow path plate, and a diaphragm) in which end surfaces at both sides in one direction are aligned. At least two plates of the plates (the nozzle plate, the flow path plate, and the diaphragm) have different coefficients of linear expansion in the one direction, and holding members are fixed to the end surfaces of the structure (flow path member) at both sides in the one direction, the holding members having stiffness higher than stiffness of a plate having the highest coefficient of linear expansion in the one direction among the plates (the nozzle plate, the flow path plate, and the diaphragm).

Liquid ejecting head and liquid ejecting apparatus

A nozzle plate is a nozzle plate provided with a plurality of nozzle openings, in which a DLC film is provided on a base material (silicon substrate) of the nozzle plate, the DLC film contains fluorine, a fluorine concentration in the DLC film decreases in a direction from a surface of the DLC film toward the silicon substrate, and a fluorine concentration in a region along the nozzle opening is lower than a fluorine concentration in the surface of the DLC film (surface of flat portion).

Nozzle plate, liquid ejecting head, liquid ejecting apparatus, and manufacturing method of nozzle plate

A wiping member is configured to wipe a nozzle forming surface of a liquid ejecting head, which has nozzles through which a liquid is ejected, in a first direction. The wiping member includes a fibrous material and is configured to satisfy the following:&#x3bc;

Wiping member, liquid ejecting apparatus, wiping method in cleaning mechanism, and method of controlling liquid ejecting apparatus

A control device includes a recording control unit, a detection unit, a port selection unit and a communication control unit. The recording control unit configures a logical port for data communication according to an interface standard. The detection unit detects a recording device wirelessly communicable with the control device. The port selection unit links a virtual port corresponding to the detected recording device with the logical port. The communication control unit opens the virtual port linked to the logical port and the recording device for wireless data communication with the recording device according to a wireless communication standard.

Control device, for communicating wirelessly with a recording device, a control method, and recording medium

A semiconductor device manufacturing method is provided in which, in the dummy gate pattern formation process, the pattern formation process is simplified and costs are reduced. A semiconductor device manufacturing method including: forming a mask element on a substrate; patterning the mask element into a prescribed shape, and forming a depression in the mask element; placing a functional liquid in the depression; drying the functional liquid placed in the depression so as to form a functional film; annealing the functional film; and, removing the mask element so as to form a dummy gate pattern of a residue of the functional liquid.

Growing community of inventors

Chino, Japan

Satoshi Suzuki