Kabushiki Kaisha Toshiba

Toto Ltd.

Satoshi Shimizu

Teruo Takeuchi

Kazuhisa Iwashita

Tatsuo Tonedachi

Kazuhiro Inoue

Hiroaki Oshio

Tetsuro Komatsu

Gen Watari

Mami Yamamoto

Hidenori Egoshi

Iwao Matsumoto

Naoya Ushiyama

Takuma Kawasaki

Tomoki Baba

Hironori Hatono

Saori Ukigai

Atsushi Teramoto

Kazuhiro Tamura

Nobuhiko Kanekuni

Kazuhiro Ishikawa

Teruo Takeguchi

Yukika Yamazawa

Ayako Hasegawa

Mayui Noborisaka

Disclosed is an article provided with a glaze layer having a mat tone surface having excellent texture. This article is provided with a substrate and a glaze layer provided on the surface of the substrate. The 60° glossiness of the surface of the glaze layer is greater than 20 and equal to or less than 50. The article has properties such that: the coefficient of variation of the root mean square slope (RΔq) of the roughness curve is 0.4-1 inclusive which is obtained by using a stylus type surface roughness measuring device according to JISB0651(2001) under a condition separately specified in JISB0601(2001); and the arithmetic average roughness (Ra) is 0.0-0.5 μm inclusive. The article has softness and warmness, is sensed to be moisturized and have high quality, and has improved touch feeling.

Article having glaze layer

According to one embodiment, a wet-area device includes a main part, a first layer, and a second layer. The first layer is provided on an outer surface of the main part. The second layer is provided on an outer surface of the first layer. A hardness of the second layer is greater than a hardness of the first layer. The first layer includes a first unevenness at a side of the outer surface of the first layer. The first unevenness includes a plurality of recesses and a plurality of protrusions. The second layer includes a second unevenness at a side of an outer surface of the second layer. The second unevenness includes a plurality of recesses and a plurality of protrusions. The second unevenness is arranged along the first unevenness. An average height of the first unevenness is less than an average length of the first unevenness.

Wet-area device and method for manufacturing wet-area device

According to one embodiment, a wet-area device includes a main part and a first layer. The first layer is provided on an outer surface of the main part. The main part includes a main part unevenness at a side of the outer surface of the main part. The main part unevenness includes a plurality of main part recesses and a plurality of main part protrusions. The first layer includes a first unevenness at a side of an outer surface of the first layer. The first unevenness includes a plurality of first recesses and a plurality of first protrusions. The first unevenness is arranged along the main part unevenness. An average height of the main part unevenness is less than an average length of the main part unevenness.

An object of the present invention is to provide a matted object capable of achieving both a lower range of glossiness and an antifouling property. A matted object includes a substrate, and a glassy layer provided on the surface of the substrate. The surface of the glassy layer has a 60&#xb0;-glossiness of 20 or less, a skewness Rsk of &#x2212;0.5 or more, and a maximum height roughness Rz more than 2.5 &#x3bc;m and less than 5.7 &#x3bc;m, the skewness Rsk and the maximum height roughness Rz being specified in JIS B0601 (2001).

Antifouling matted object

Provided is a wet area member for use in an indoor wet environment, comprising: a base member; and an amorphous carbon layer formed on a surface of the base member and mainly containing carbon atoms, wherein the amorphous carbon layer further contains hydrogen atoms, and the amorphous carbon layer contains the hydrogen atoms in a predetermined amount or more and has a density lower than a predetermined value so as to be capable of inhibiting sticking of water scale for a long period. This makes it possible to obtain a wet area member which exhibits a high stain release property and a high stain release durability.

Wet area member

According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, the LED chip includes a semiconductor layer which contains at least indium, gallium and aluminum, one terminal of the LED chip is connected to the first lead frame, and another terminal of the LED chip is connected to the second lead frame. The resin body covers the LED chip and an entire upper surface, a part of a lower surface, and parts of edge surfaces of each of the first and second lead frames, and the resin body exposes a rest of the lower surface and a rest of the edge surfaces. And, an appearance of the resin body is a part of an appearance of the LED package.

LED package and method for manufacturing same

According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and the LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the resin body covers the first and second lead frames and the LED chip, and has an upper surface with a surface roughness of 0.15 &#x3bc;m or higher and a side surface with a surface roughness higher than the surface roughness of the upper surface.

LED package, method for manufacturing LED package, and packing member for LED package

According to one embodiment, an LED package includes a first lead frame, a second lead frame, an LED chip, a wire, and a resin body. The first lead frame and the second lead frame are arranged with a space between each other. The LED chip is provided above the first lead frame and the second lead frame. The LED chip has a first terminal connected to the first lead frame and a second terminal connected to the second lead frame. The wire connects the first terminal to the first lead frame. The resin body covers the LED chip as well as a top surface, a part of a bottom surface, and a part of an edge surface of each of the first lead frame and the second lead frame. A remaining portion of each of the bottom surfaces and a remaining portion of each of the edge surfaces are exposed. A chip side angle formed by a top surface of the LED chip and a direction in which the wire is extracted from the first terminal is smaller than a frame side angle formed by the top surface of the first lead frame and a direction in which the wire is extracted from the first lead frame.

LED package

According to one embodiment, an LED package includes (2&#xd7;n) (n is an integer of 2 or more) lead frames, n LED chips and a resin body. The (2&#xd7;n) lead frames are arranged to be apart from each other. The n LED chips are provided above the lead frames. Each of the n LED chips has one terminal connected to each of n lead frames of the (2&#xd7;n) lead frames and another terminal connected to each of lead frames of the (2&#xd7;n) lead frames other than the n lead frames. The resin body covers the (2&#xd7;n) lead frames and the n LED chips.

According to one embodiment, an LED package includes first and second lead frames spaced from each other, and an LED chip. Each of the first and second lead frames includes a base portion and a plurality of extending portions extending from the base portion. A part of a lower surface of the base portion, side surfaces of the base portion, lower surfaces of the extending portions and side surfaces of the extending portions are covered by resin. A remaining part of the lower surface of the base portion and tip surfaces of the extending portions are not covered by resin. The part of the lower surface of the base portion includes a first edge of the first lead frame and a second edge of the second lead frame. The first edge and the second edge are opposed each other.

According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are made of a metal material, and disposed to be apart from each other. The LED chip is provided above the first and second lead frames, the LED chip having one terminal connected to the first lead frame and another terminal connected to the second lead frame. The resin body is made of a resin material having a shore D hardness of 25 or higher. In addition, the resin body covers the first and second lead frames and the LED chip. And, an appearance of the resin body is an appearance of the LED package.

Growing community of inventors

Kitakyushu, Japan

Satoshi Shimizu