Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Satoshi Shida

Takaari Uemoto

Yasuharu Ueno

Keiji Nishimoto

Yuji Omata

Shinji Kanayama

Hiroyuki Naito

Akira Kabeshita

Makoto Morikawa

Shuichi Hirata

Kenji Takahashi

Shoriki Narita

Shozo Minamitani

Shunji Onobori

Takashi Shimizu

Osamu Okuda

Nobuyuki Matsui

Yoshihiko Kanayama

Hideo Nagai

Makoto Imanishi

Naoyuki Kitamura

Yoshihiro Yoshida

Kohei Enchi

Mamoru Nakao

Akira Kugihara

Hiroshi Haji

Tatsumi Setomoto

Kazushi Higashi

Noriyasu Tanimoto

Yasushige Tomiyoshi

Ryoji Inutsuka

Naoto Hosotani

Akira Taniuchi

Makoto Sueki

Kenzi Takahasi

Kunio Oe

Yoshitaka Etoh

Toshifumi Ogata

Kanji Hata

Masahiro Miki

Takaharu Mae

Wataru Hirai

Hiroyuki Yoshida

Muneyoshi Fujiwara

Osamu Nakao

Hirokazu Honkawa

Hiroaki Hayashi

Makoto Akita

Hiroshi Ohta

Mitsuko Shuto

Takafumi Tsujisawa

Yuichi Takakura

Hironori Kobayashi

Hirokuni Miyazaki

Yasuhiro Noma

Kenzi Takahashi

Mitsuhito Miyazaki

Masakazu Yamano

Kazuya Yamamoto

Kenichi Ishida

An LED lamp has an envelope that includes a globe and a case, an interior space of the envelope being divided in two by a mount closing an opening of the globe, the lamp containing, in a globe side of the interior space, an LED and, in a case side of the interior space, a circuit unit for causing the LED to emit light. The LED is thermally connected to the mount, and the mount and the case are joined to the globe such that, during light emission, at least as much heat from the LED is propagated from the mount to the globe as from the mount to the case.

LED lamp and lighting device

A light source used for illumination provides favorable heat dissipation properties while suppressing the lowering of the efficiency of light emission. The light source includes a mount substrate, an LEDmounted on the mount substrate and a silicon resin mold containing phosphor particles that convert the wavelength of light emitted from the LED. The mount substrate includes a metal substratecoated with a ceramic layercontaining light-transmissive or highly reflective ceramic particles.

Light source for lighting

Provided is a bulb-type lamp including a lightweight housing with great handleability. An LED light bulb comprises: an LED module on which LEDs are mounted; a cylindrically-shaped case having openings at both ends, which are first and second ends; a mount member on a front surface of which the LED module is mounted, the mount member closing a corresponding one of the openings of the case by being in contact with an inner circumferential surface of the first end of the case; a base member attached to the second end of the case; and a lighting circuit that is disposed inside the case. A wall thickness of the case is in a range of 200 &#x3bc;m to 500 &#x3bc;m inclusive, and the wall thickness of at least one portion of the case decreases from the first end toward the second end of the case.

Bulb-type lamp and lighting device

A light source that restricts the heat accumulation in the phosphor. The light source includes: a substrate; LED elements D, D, D, D, Dthat have been implemented on a main surface of the substrate; projectionsthat have been formed in areas of the main surface of the substratein which any of the LED elements D, D, D, D, Dhave not been implemented; and a translucent sealing memberthat has been formed on the substrate in a state that the LED elements D, D, D, D, Dand the projectionsare covered and sealed with the sealing member. The sealing memberincludes a phosphorthat converts light from the LED elements D, D, D, D, Dinto light of a predetermined color. The heat conductivity of the projectionsis higher than the heat conductivity of the sealing member

Light source

A bulb-type lighting source employs a light-emitting element in a structure that facilitates heat dispersal. The lighting source includes a first heat sink member mounted in a bowl shaped case supporting a power supply circuit. A mounting substrate is positioned in surface contact with a surface of the heat sink member and is capable of supporting a light-emitting unit. A globe covers the light-emitting unit to permit light emission. A second heat sink member has a surface in contact with a perimeter of the mounting substrate and offset from the light-emitting unit to provide a second part in surface contact with the first heat member to facilitate the release of heat.

Bulb-type lighting source

Provided is a bulb-type lamp including a lightweight housing with great handleability. An LED light bulb () comprises: an LED module () on which LEDs are mounted; a cylindrically-shaped case () having openings at both ends, which are first and second ends; a mount member () on a front surface of which the LED module () is mounted, the mount member () closing a corresponding one of the openings of the case () by being in contact with an inner circumferential surface of the first end of the case (); a base member () attached to the second end of the case (); and a lighting circuit () that is disposed inside the case (). A wall thickness of the case () is in a range of 200 &#x3bc;m to 500 &#x3bc;m inclusive, and the wall thickness of at least one portion of the case () decreases from the first end toward the second end of the case ().

Bulb-shaped lamp and lighting device

A phosphor layer forming apparatus () in which a paste () containing a phosphor is discharged so as to cover each of a plurality of light-emitting elements () mounted on a substrate () includes the following: a discharge portion () for discharging the paste () in the form of droplets onto each of the light-emitting elements (); a measurement portion () for measuring the thickness of individual phosphor layers that are formed of the paste () covering each of the light-emitting elements (); and a discharge control portion () for controlling the amount of the paste () to be redischarged for each phosphor layer in accordance with the thickness of the individual phosphor layers measured by the measurement portion (). This phosphor layer forming apparatus can reduce the manufacturing time.

Apparatus for forming phosphor layer and method for forming phosphor layer using the apparatus

A light-emitting module () includes a mounting board () with a conductor pattern and a plurality of light-emitting elements () mounted on the conductor pattern via wires (). The extending direction of each of the wires () toward the conductor pattern is oriented irregularly when viewed perpendicularly to the mounting board (). This can prevent the shadows of the wires () from overlapping, and thus can suppress the luminance nonuniformity.

Light-emitting module with plural light emitters and conductor pattern

A light-emitting device () includes a substrate (), a light-emitting element () that is mounted on the substrate () and includes a luminous region () and a nonluminous region (), and a phosphor layer () that is formed to cover the light-emitting element (). The thickness of the phosphor layer () located on the nonluminous region () is smaller than that of the phosphor layer () located on the luminous region (). The light-emitting device () can suppress nonuniform luminescent color.

LED with phosphor layer having different thickness or different phosphor concentration

A component mounting system includes first to third (pickup, transfer, and placement) stations. A component supplied at a component supply is picked up by a transport head at the pickup station and then transferred to a placement head at the transfer station. The placement head carries the component to the placement station where the component is placed and mounted onto a substrate such as a circuit board. The component, when held by the placement head, is recognized by an imaging device at or in the vicinity of the transfer station.

Component mounting apparatus

In a receiver for component feed plates for housing, in multi-stage stacks, a plurality of component feed plates with a plurality of components placed thereon, identification mark portions are formed so as to be placed at end portions or their proximities of support guide portions in a plate feed direction so that each paired set of support guide portions out of individual support guide portions can be distinguished from the other paired sets of support guide portions and moreover visually discerned in the plate feed direction.

Receiver for component feed plates and component feeder

In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

Lighting apparatus

According to the type of the plate placed in a plate placing device of a component feeder, appropriate holding operation and expanding operation are performed selectively and automatically according to the type of the plate by regulating the lowered position of a plate pressurizing member for the tray feeding plate to securely hold the plate and performing wafer expanding while securely holding the wafer feeding plate by releasing the regulation of the lowered position for the wafer feeding plate.

Component feeder

Growing community of inventors

Osaka, Japan

Satoshi Shida