Nichia Corporation

Satoshi Shichijo

Kunihito Sugimoto

Hiroki Fukuta

Yusuke Hayashi

Kenji Ozeki

Takeshi Kususe

Koichi Takenaga

Shogo Abe

Tatsuya Hayashi

Harunobu Sagawa

Masahiro Okazaki

Masatsugu Ichikawa

Takehito Shimatsu

Takanobu Sogai

Yasuhiro Miki

Shusaku Bando

Masahiro Sakamoto

Takanori Fukumori

Kazuhide Yanasaka

A light-emitting device includes a light-emitting element, a light-transmissive member, and a first light adjustment member. The light-transmissive member has a first upper surface, a second upper surface, a lower surface facing a first surface of a support substrate of the light-emitting element, a first lateral surface contiguous with the first upper surface and the second upper surface, a second lateral surface contiguous with the second upper surface and the lower surface, and a third lateral surface contiguous with the first upper surface and the lower surface. The first light adjustment member exposes the first upper surface of the light-transmissive member and covers the second upper surface and the first lateral surface of the light-transmissive member. The light-transmissive member and the first light adjustment member collectively define a rectangular cross-sectional shape.

Light-emitting device

A light emitting device includes: a substrate; a light emitting element disposed on the substrate; a first wavelength conversion member disposed on the light emitting element and having a lower surface bonded to the light emitting element, an upper surface opposite the lower surface, and a lateral surface that meets the upper surface; a first light reflecting member disposed on an upper surface of the substrate and covering lateral surfaces of the light emitting element; and a second wavelength conversion member disposed on the first light reflecting member, on the upper surface of the substrate, and on the lateral surface of the first wavelength conversion member without covering the upper surface of the first wavelength conversion member.

Light emitting device

A light-emitting device includes a light-emitting element, a light-transmissive member, and a light adjustment member. The light adjustment member exposes a first upper surface and covers a second upper surface and a first lateral surface of the light-transmissive member. The light-transmissive member has a thickness from a lower surface to the first upper surface larger than a thickness from the lower surface to the second upper surface. In a plan view, first and second light-emitting regions have the first and second upper surfaces of the light-transmissive member, respectively, and an area of the second light-emitting region is in a range from 35% to 95% of an area of a light-emitting region. A boundary between the first and second light-emitting regions includes first and second points on a perimeter of a light-emitting region, and a straight line connecting the first and second points extends across the light-emitting region.

A light emitting device includes: a light emitting element configured to emit first light; a first wavelength conversion member disposed on the light emitting element and having a lower surface bonded to the light emitting element, an upper surface, and a lateral surface that meets the upper surface, the first wavelength conversion member being configured to emit second light when excited by the first light; a second wavelength conversion member covering the lateral surface of the first wavelength conversion member without covering the upper surface of the first wavelength conversion member, the second wavelength conversion member having an oblique surface extending outward from the lateral surface of the first wavelength conversion member, the second wavelength conversion member being configured to emit third light when excited by at least one of the first light and the second light; and a first light reflecting member covering the oblique surface.

A method of manufacturing a light emitting device includes: bonding a light emitting element and a light transmissive member by a surface activated bonding method, which includes: activating a first bonding surface of the light emitting element to which the light transmissive member is to be bonded, by irradiating at least the first bonding surface with an ion beam, activating a second bonding surface of the light transmissive member to which the light emitting element is to be bonded, by irradiating at least the second bonding surface with an ion beam, and joining the light emitting element and the light transmissive member by bringing the activated first bonding surface and the activated second bonding surface into contact.

Method of manufacturing light emitting device

A light emitting element includes a semiconductor stacked body, an insulating film, first and second electrodes, a second external connection portion, and first external connection portions. The first semiconductor layer is exposed at a plurality of exposed portions disposed in a plurality of rows in plan view. The first external connection portions include at least one smaller-size first external connection portion disposed between adjacent ones of the rows other than the outermost one of the rows, and at least one larger-size first external connection portion extending from the end region, in which a spacing between a first outer edge of a second semiconductor layer and the exposed portions in the outermost one of the rows is narrower than a spacing between the exposed portions in adjacent ones of the rows, to at least a position between the outermost one of the rows and an adjacent one of the rows.

Light emitting element, light emitting device, and method for manufacturing light emitting element

A light emitting element includes a semiconductor layered body, an insulating film, first and second electrodes, and first and second external connection parts. The first semiconductor layer is exposed from the light emitting layer and the second semiconductor layer at exposed portions arranged in columns each extending in a first direction. The insulating film defines openings respectively located above the exposed portions. The first electrode is connected to the first semiconductor layer through the openings and covers a part of the second semiconductor layer via the insulating film. The first external connection part is connected to the first electrode and spaced apart from the exposed portions in the plan view. The first external connection part has a shape elongated in the first direction between adjacent ones of the columns of the exposed portions. The second external connection part is connected to the second semiconductor layer via the second electrode.

Light emitting element and light emitting device

A light emitting device includes: a light emitting element; and a light transmissive member bonded to an emission surface of the light emitting element; wherein the light emitting element and the light transmissive member are bonded via a bonding portion that comprises a portion of the light emitting element and a portion of the light transmissive member; wherein the bonding portion contains at least one rare gas element selected from the group consisting of He, Ne, Ar, and Kr; and wherein a peak of a rare gas element distribution is positioned away from the emission surface in at least one of the light emitting element and the light transmissive member.

A light emitting device including: a light emitting element, a phosphor plate, and a light guiding part. The lower face of the light emitting element has a rectangular shape. The light guiding part covers lateral faces of the light emitting element and the lower face of the phosphor plate that is exposed from the light emitting element. The light guiding part has one or more lateral faces having at least one of structures below: a height at both ends being different from the height at a central area; outer lateral faces being parallel to the lateral faces of the light emitting element.

Light emitting device and method of manufacturing same

A light-emitting device includes: a mounting base; a plurality of light-emitting elements mounted on or above the mounting base; a plurality of light-transmissive members respectively disposed on upper surfaces of the plurality of light-emitting elements; a plurality of light guide members respectively covering lateral surfaces of the plurality of light-emitting elements; a plurality of antireflective films respectively disposed on upper surfaces of the plurality of the light-transmissive members; and a covering member covering lateral surfaces of the plurality of antireflective films.

A method of manufacturing a light-emitting device includes: directly bonding a plurality of light-emitting elements to a collective light-transmissive member having a plate shape, each light-emitting element comprising a plurality of electrodes; subsequently, forming stud bumps on each electrode of each light-emitting element; subsequently, dividing the collective light-transmissive member to obtain a plurality of light-transmissive members on each of which one or more of the light-emitting elements are bonded; and subsequently, mounting the light-emitting elements on or above a mounting base by a flip-chip technique.

Method of manufacturing light-emitting device

A light emitting device includes a mounting board including: a base part, and one or more wiring structures, each of which includes one or more first wiring parts, and one or more second wiring parts, in that order, from a base part side, wherein, in a plan view, an area of each of the one or more second wiring parts is smaller than an area of each of the one or more first wiring parts; one or more light emitting elements bonded to the second wiring parts via bonding members; and a reflective member covering at least a portion of the bonding members and at least a portion of the one or more wiring structures. A reflectance of the one or more first wiring parts is higher than a reflectance of the bonding members. The one or more second wiring parts and the bonding members comprise the same material at their outermost surfaces.

A light emitting device includes a light emitting element, a first light transmissive member, a second light transmissive member, and a light reflective member. The first light transmissive member contains a first phosphor. The first light transmissive member is in contact with an upper surface of the light emitting element, and has an area smaller than the light emitting element in a plan view. The second light transmissive member contains a second phosphor. The second light transmissive member covers lateral surfaces of the first light transmissive member and a part of the upper surface of the light emitting element that is exposed from the first light transmissive member, with an upper surface of the first light transmissive member being not covered by the second light transmissive member. The light reflective member covers lateral surfaces of the second light transmissive member and lateral surfaces of the light emitting element.

A method of manufacturing a light emitting device includes: forming a light-transmissive member that is substantially rectangular in a plan view to cover an upper surface of a light emitting element mounted on a base member; and forming a frame body so as to surround the light-transmissive member, wherein, in the step of forming the frame body, the frame body is formed such that a distance from an upper surface of the base member to an upper end of the frame body is smaller along a short side of the light-transmissive member than along a long side of the light-transmissive member.

A semiconductor device includes an insulating substrate,a semiconductor element disposed on an upper surface of the substrate, a heat dissipation member, and a metal bonding layer that bonds the lower surface of the substrate to the upper surface of the heat dissipation member, and the area of the upper surface of the heat dissipation member is larger than the area of the lower surface of the substrate, and the metal bonding layer contacts the whole of the lower surface of the substrate and has an area larger than the area of the lower surface of the substrate, and the heat conductivity of the metal bonding layer is higher than the heat conductivity of the heat dissipation member.

Growing community of inventors

Tokushima, Japan

Satoshi Shichijo