Asahi Kasei Emd Corporation

Asahi Kasei Kabushiki Kaisha

Asahi Kasei E-Materials Corporation

Satoshi Shibui

Takahiro Sasaki

Tatsuya Hirata

Taisuke Yamada

Mayuki Yoshida

The present invention provides a photosensitive resin laminate in which (A) an alkali-soluble polymer, (B) a compound having an ethylenically unsaturated double bond, and (C) a photosensitive resin layer including a photopolymerization initiator are laminated on a support film. The photosensitive resin laminate is used in forming the protective film of a conductor part, the thickness of the photosensitive resin is 20 &#x3bc;m or less, and the cured product of the photosensitive resin layer satisfies conditions (1) to (3): (1) the crosslink density is 1,000 mol/m-8,000 mol/m; (2) the peak top value of Tan &#x3b4; is 0.4 or greater; and (3) the refractive index at a wavelength of 532 nm is 1.50-1.60.

Photosensitive resin composition, photosensitive resin laminate, resin pattern production method, cured film, and display device

Provided is a photosensitive resin composition which comprises: (A-1) a resin containing a structure represented by general formula (1); and (B) a photo-acid generating agent. In general formula (1), X, Rto R, mto m, n, n, Y and W are each as defined in the description. 

Photosensitive resin composition, method for producing hardened relief pattern, semiconductor device and display device

A positive photosensitive resin composition excellent in sensitivity and resolution, characterized by comprising 100 parts by mass of (A) a hydroxypolyamide comprising repeating units represented by the general formula (1), 1 to 50 parts by mass of (B) a photoacid generator, 5 to 20 parts by mass of (C) a carboxylic acid compound having 6 to 18 carbon atoms as represented by the general formula (2), and 0.01 to 70 parts by mass of (D) an alcohol having 4 to 14 carbon atoms as represented by the general formula (3).

Positive photosensitive resin composition

The present invention provides a positive photosensitive resin composition, characterized by comprising 1 to 50 parts by mass of a photo-acid generator and 0.01 to 70 parts by mass of a terpene compound in combination with 100 parts by mass of a hydroxypolyamide having repeating units. A terpene compound can be combined with a hydroxypolyamide having a particular structure to provide a positive photosensitive resin composition excellent in positive lithography performance such as sensitivity and resolution.

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Tokyo, Japan

Satoshi Shibui