Dai Nippon Printing Co., Ltd.

Nichia Corporation

Satoshi Shibasaki

Masachika Masuda

Koji Tomita

Masaki Yazaki

Kazuyuki Miyano

Atsushi Kurahashi

Kazuhito Uchiumi

Masaaki Katsumata

Daisuke Matsuura

Tomohiro Ikeda

Naoto Yamanaka

Takayuki Komai

A substrate for a light emitting element including a resin substrate exhibiting flexibility and a metal wiring portion being formed on at least one surface side of the resin substrate via an adhesive layer, in which a reflective layer composed of a thermosetting resin is disposed between the resin substrate and the adhesive layer, in which the reflective layer contains a light reflective filler at 10% by mass or more and 85% by mass or less and has a reflectance to light at a wavelength of 450 nm of 80% or more.

Substrate for light emitting element and module

A lead frame includes a die pad and a plurality of lead portions each including an internal terminal and an external terminal. The external terminals of the plurality of lead portions are arranged in an alternately staggered form such that the respective external terminals of a pair of lead portions adjacent to each other are alternatively located on an inside or an outside. A lead portion has an inside region located on the inside of a first external terminal, an outside region located on the outside of the first external terminal, and an external terminal region having the first external terminal. The inside region and the outside region are each formed thin by means of half etching. A maximum thickness of the outside region is larger than a maximum thickness of the inside region.

Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device

Growing community of inventors

Hasuda, Japan

Satoshi Shibasaki