Denso Corporation

Nippon Soken, Inc.

Satoshi Sakimichi

Kimio Kohara

Koji Noda

Shogo Kawaguchi

Yousuke Goto

Masahiro Sakamoto

A heat exchange apparatus includes a heat exchanger through which a heat exchange medium flows inside, a fluid transport device that causes the heat exchange medium to flow, and a flow path through which the heat exchange medium flows. The heat exchange apparatus includes a flow rate controller configured to increase or decrease the flow rate of the heat exchange medium flowing through the flow path, and a driving part that drives the flow rate controller by receiving a force from the flow of the heat exchange medium flowing through the flow path.

Heat exchange apparatus

A bonding structure includes a first member, a second member and a bonding member. The first member has a plate shape and is made of a carbon-base material. The first member serves as a heat diffusion member that transfers heat at least in a thickness direction, which is perpendicular to a plane of the plate shape. The second member is bonded to the first member through the bonding member. The first member has a metal thin film at least on an opposed surface that is opposed to the second member. The bonding member is disposed between the opposed surface of the first member and the second member. The bonding member is provided by a sintered body of metal particle. For example, the bonding structure is employed in a cooling unit including a heat source.

Bonding structure and bonding method of heat diffusion member, and cooling unit using the same

Growing community of inventors

Anjo, Japan

Satoshi Sakimichi