Lg Innotek Co., Ltd.

Satoshi Ozeki

Yuichiro Tanda

Byung Mok Kim

Hiroshi Kodaira

Ha Na Kim

Bo Hee Kang

Su Jung Jung

Young Jin No

Baek Jun Kim

A light emitting device may include a substrate; a body which is disposed on the substrate and has a first hole having a predetermined size and a light emitting chip which is disposed within a cavity formed by the substrate and the first hole of the body. A cap may be disposed on the body and may have a second hole having a predetermined size. A transparent window may be disposed in the second hole. A lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, and at least a portion of the first surface is attached and fixed to the body.

Light emitting package

A light emitting device package may be provided that includes: a lead frame; a light emitting device disposed on the lead frame; a metallic reflector which is disposed on the lead frame, has a hollow portion in which the light emitting device is disposed, reflects light emitted from the light emitting device, and is formed by a mold; and a resin body which surrounds the lead frame and the reflector. The resin body includes an insulation layer disposed between the lead frame and the reflector, and a protrusion disposed on the reflector.

Light emitting device package

A light emitting device package is disclosed. The light emitting device package includes a package body including at least one ceramic layer, a submount disposed at the package body, a light emitting device disposed on the submount for emitting ultraviolet (UV)-wavelength light, and an anti-reflection (AR) coating layer disposed around the light emitting device, the AR coating layer being formed of an inorganic coating layer.

A light emitting device package including a package body including a first cavity and a second cavity, a pad disposed on a bottom surface of the first cavity, a light emitting device disposed on the second cavity electrically connected to the pad, a heat dissipation member inserted into the package body, the heat dissipation member including a body and expanded portions disposed at a partial edge region of the body and electrode patterns disposed at the package body, wherein the package body has an upper portion and a lower portion disposed under the upper portion, wherein the first cavity including side surfaces and a bottom surface, wherein the second cavity provided in the bottom surface of the first cavity.

An embodiment relates to a light-emitting device package. In an embodiment, the light-emitting device package includes a package body configured to include a top surface, a plate guide unit disposed on the top surface, and a cavity formed in the top surface, a light-emitting device disposed within the cavity, a plate disposed on the top surface of the package body and guided by the plate guide unit, and an adhesive member disposed between the top surface of the package body and the plate. The adhesive member includes a base layer made of a flexible material, a first adhesive tape disposed between the base layer and the top surface of the package body and bonded to the base layer and the top surface of the package body, and a second adhesive tape disposed between the base layer and the plate and bonded to the base layer and the plate.

A light emitting device package may be provided that includes: a lead frame which includes a first frame and a second frame disposed on both sides of the first frame respectively; a light emitting device which is disposed on the first frame and is electrically connected to the second frame; and a resin body which includes a first resin body which is disposed between the first frame and the second frame, and a second resin body which covers an outer surface of the lead frame. An end of the first frame and an end of the second frame are disposed on an outer surface of the second resin body.

Disclosed is a light emitting device package with improved light extraction efficiency. The light emitting device package includes a substrate, a light emitting device disposed on the substrate, and a light transmission unit disposed above the light emitting device, the light transmission unit being spaced from the light emitting device, wherein a distance between an upper surface of the light emitting device and the light transmission unit is 0.15 mm to 0.35 mm.

A light emitting device package including a package body, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, and an anti-fracture layer placed on the heat dissipation member, wherein a width of the heat dissipation member is different at different heights of the package body.

A light emitting device package including a package body including a plurality of first ceramic layers, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, and a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, wherein the heat dissipation member is provided with an expanded portion at a region corresponding to a boundary of different first ceramic layers.

Embodiments provide a light emitting device package including a package body, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, a heat dissipation member inserted into the package body to thermally come into contact with the light emitting device, and a anti-fracture layer placed on the heat dissipation member. The anti-fracture layer vertically overlaps with at least a partial peripheral region of the heat dissipation member.

Growing community of inventors

Seoul, South Korea

Satoshi Ozeki