Fujitsu Corporation

Satoshi Osawa

Akira Tamura

Shunichi Kikuchi

Yasushi Masuda

Kiyokazu Moriizumi

Mitsuo Suehiro

A socket for providing an electric connection between a package and an electronic circuit board, the socket includes a package mounting area in which the package is mounted and an isotropic elastic body provided on the package mounting area and having a continuous shape along four side walls of the package so as to press the four side walls of the package.

Socket and device having the socket

An electronic device cooling apparatus includes a cooling unit that is thermally connected to an electronic device and is configured to induce heat generated from the electronic device to be conducted to a cooling medium that is channeled into the cooling unit; and a heat dissipating unit including a cooling chamber configured to cool the cooling medium that is heated by the heat conducted from the electronic device. The cooling unit and the heat dissipating unit are integrated.

Electronic device cooling apparatus

There is provided a card connector for electrically coupling a card with a motherboard. The card connector includes a housing to and from which a contact pad of the card is inserted and ejected, where the housing is mountable on the motherboard; a pair of contacts is configured to hold the card between the pair of the contacts and to be electrically coupled with the contact pads of the card inserted into the housing, and extend in a first direction, and a pair of urging members is configured in the housing to force the pair of the contacts toward the card and extend in a second direction opposite to the first direction.

Card connector and electronic apparatus including the same

A plurality of multi-chip modules are incorporated in a semiconductor device. Each of the multi-chip modules has a plurality of functional parts mounted on a circuit board. A flexible wiring board connects the multi-chip modules to each other. An interface part is mounted on the flexible wiring board so as to control input and output signals of the multi-chip modules.

Semiconductor device having a plurality of multi-chip modules interconnected by a wiring board having an interface LSI chip

There is provided an I/O pin by which an MCM is positively prevented from being damaged by solder flowing from the fore end to the base of the I/O pin when the I/O pin is soldered in the case of mounting the MCM. An I/O pin used for an electrical connection is provided, one end of which is perpendicularly fixed to an MCM and the other end of which is soldered to a predetermined position on the mother board in the case of mounting the MCM on the mother board. In an intermediate portion of the I/O pin, there is formed a solder dam composed of a plated layer of Ni of low solder wettability, a layer of highly heat-resistant resin or a layer of high-temperature solder.

Growing community of inventors

Kawasaki, Japan

Satoshi Osawa