Tamura Corporation

Satoshi Okumura

Nobuhiro Yamashita

Daigo Ichikawa

Shinji Yoshizawa

Jun Aoki

Ryo Izumi

Nobuo Tajima

Mitsuru Iwabuchi

Shinichi Usukura

Kenta Fukuda

A solder composition contains: flux composition containing (A) rosin-based resin, (B) activator, and (C) solvent; and (D): solder powder with a melting point of 200 to 250 degrees C. The component (A) contains (A1) rosin-based resin with a softening point of 120 degrees C. or more and an acid number of 220 mgKOH/g or more and (A2) rosin-based resin with a softening point of 100 degrees C. or less and an acid number of 20 mgKOH/g or less. The component (C) contains (C1) hexanediol solvent with a melting point of 40 degrees C. or more and a boiling point of 220 degrees C. or less and (C2) solvent with a viscosity of 10 mPa&#xb7;s or less at 20 degrees C. and a boiling point of 270 degrees C. or more. A content of the component (A1) ranges from 15 to 25 mass % with respect to the flux composition (100 mass %).

Solder composition, electronic board, and bonding method

A solder composition of the invention includes: a flux composition containing a component (A) in a form of a rosin-based resin, a component (B) in a form of an activator, a component (C) in a form of a solvent and a component (D) in a form of a thixotropic agent; and a component (E) in a form of a solder powder. The component (C) in a form of the solvent contains a component (C1) in a form of a isobornyl cyclohexanol and a component (C2) in a form of a solvent whose viscosity at 20 degrees C. is 10 mPa&#xb7;s or less and whose boiling point ranges from 220 degrees C. to 245 degrees C.

Solder composition and electronic board

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Iruma, Japan

Satoshi Okumura