Nitto-denko Corporation

Panasonic Healthcare Holdings Co., Ltd.

Panasonic Healthcare Co., Ltd.

Japan Tobacco Inc.

Phc Holdings Corporation

Satoshi Okuda

Susumu Kobayashi

Hidetoshi Shinya

Hideyuki Usui

Minoru Nakao

Yuichi Tamaoki

Tadahisa Saga

Ryuichi Tsuruma

Ryuzo Tobe

Jiro Yuzawa

Hiroshi Kawakami

Takashi Matsuda

Hisashi Shinkai

Mitsuru Takahashi

Katsumi Shimada

Wataru Watanabe

Yuji Matsuzaki

Motohide Satoh

Hisateru Aramaki

Shuichi Wamaki

Shinjiro Uenishi

Kazunobu Yamataka

Shinichi Kiyonari

Masato Noro

Naohito Yamada

Akemi Nagao

Nariya Komada

Kuniharu Hattori

A refrigerating apparatus includes an insulation housing including an inner box. The inner box has side plates and first and second refrigerating circuits including a first evaporation pipe and a second evaporation pipe, respectively. The first and second evaporation pipes are disposed on the side plates. The first and second evaporation pipes are bent so as to form a first comb shape and a second comb shape, respectively. The first and the second comb shapes form a nested structure. The first and second evaporation pipes include a first straight portion and a second straight portion extending the horizontal direction, respectively. A first distance between the first straight portion of the first evaporation pipe and the first straight portion of the second evaporation pipe and a second distance between the first straight portion of the second evaporation pipe and the second straight portion of the second evaporation pipe are substantially equal.

Refrigerating apparatus

A refrigerating apparatus includes an insulation housing including an inner box. The inner box has first and second side plates and a first curved corner connecting the first and second side plates; and a first refrigerating circuit including a first compressor and a first evaporator constituted by a first evaporation pipe, the first evaporation pipe including a first portion extending a horizontal direction and a second portion extending a vertical direction. The first portion of the first evaporation pipe is disposed to contact to the first and second side plates and the first curved corner of the inner box, and the second portion of the first evaporation pipe is disposed outside of the first portion of the first evaporation pipe at the first curved corner so that the first portion of the first evaporation pipe locates between the first curved corner and the second portion of the first evaporation pipe.

A refrigerating apparatus includes first and second refrigerant circuits including respective first and second compressors, condensers, pressure reducers, and evaporators, connected circularly with first and second refrigerant pipes, respectively, refrigerants discharged from the first and second compressors being respectively condensed at the first and second condensers and thereafter respectively evaporated at the first and second evaporators to acquire a cooling effect; a temperature sensor that detects a temperature of an internal portion of a cold storage cabinet, the first and second evaporators being disposed to cool the internal portion simultaneously; and a first control device that controls the first and second compressors such that the first compressor and the second compressor start being alternately operated each time a temperature detected by the temperature sensor reaches a first temperature, and are continuously operated until the detected temperature reaches a second temperature lower than the first temperature.

A refrigerating apparatus includes first and second refrigerant circuits including respective first and second compressors, condensers, pressure reducers, and evaporators, connected circularly with first and second refrigerant pipes, respectively, refrigerants discharged from the first and second compressors being respectively condensed at the first and second condensers and thereafter respectively evaporated at the first and second evaporators to acquire a cooling effect; a temperature sensor that detects a temperature of an internal portion of a cold storage cabinet, the first and second evaporators being disposed to cool the internal portion simultaneously; and a first control device that controls the first and second compressors such that both of them are operated each time a temperature detected by the temperature sensor reaches a first temperature, and the first and second compressors are alternately operated each time a temperature detected by the temperature sensor reaches a second temperature lower than the first temperature.

Provision of a compound having an anti-HIV activity, particularly an integrase inhibitory activity. A 4-oxoquinoline compound represented by the following formula [I] or a pharmaceutically acceptable salt thereof: wherein each symbol is as defined in the specification. The present invention also relates to a pharmaceutical composition containing the 4-oxoquinoline compound or a pharmaceutically acceptable salt thereof, and a pharmaceutically acceptable carrier; an integrase inhibitor, an antiviral agent, anti-HIV agent, and the like, which contains the 4-oxoquinoline compound or a pharmaceutically acceptable salt thereof as an active ingredient; an anti-HIV composition containing the 4-oxoquinoline compound or a pharmaceutically acceptable salt thereof, and one or more other kinds of anti-HIV activity substances as active ingredients; an anti-HIV agent containing the 4-oxoquinoline compound or a pharmaceutically acceptable salt thereof as an active ingredient, which is used for a multiple drug therapy with other anti-HIV agent(s), and the like.

4-oxoquinoline compound and use thereof as HIV integrase inhibitor

An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 &#x3bc;m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 &#x3bc;m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 &#x3bc;m or smaller is 80% by weight or more. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.

Epoxy resin composition for semiconductor encapsulation, process for producing the same, and semiconductor device

An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 &mgr;m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 &mgr;m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 &mgr;m or smaller is 80% by weight or more; and (D) a silicone oil having at least one amino group per molecule. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.

Composition of epoxy resin, phenolic resin, butadiene particles and amino silicone oil

An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 &mgr;m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 &mgr;m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 &mgr;m or smaller is 80% by weight or more. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.

Butadiene rubber particles with secondary particle sizes for epoxy resin encapsulant

Epoxy resin composition for encapsulating photosemiconductor element and photosemiconductor device

Growing community of inventors

Osaka, Japan

Satoshi Okuda