Nichia Corporation

Satoshi Okada

Shinji Nishijima

Haruaki Sasano

Yuichi Okada

Takahiro Amo

Tatsuya Yanamoto

Yuji Satake

Satoshi Kinoshita

Kenji Ozeki

Masafumi Kuramoto

Masaki Hayashi

Yuta Oka

Daisuke Iwakura

Yusuke Kawano

Tomoaki Tsuruha

Shinsuke Sofue

Yoshifumi Hodono

Hideyuki Nagai

To provide a light emitting device having high light extraction efficiency, and a method for manufacturing the light emitting device. A method for manufacturing a light emitting device () according to the present invention, includes: forming a sealing member () for sealing a light emitting element () on a base body () by dropping, the base body () including a conductive member () for connecting to the light emitting element (), and a molding () integrally molded with the conductive member (); the sealing member () being formed such that at least a part of a periphery of the sealing member () is located on an outward surface () of the conductive member () or the molding (), the outward surface facing outward in a top view.

Light emitting device and method for manufacturing the same

A light-emitting device includes a lead frame, a white resist, a light-emitting element, and a wire. The white resist is provided on the lead frame to be in contact with the lead frame. The white resist has an opening to expose the lead frame. The light-emitting element is disposed on the white resist and includes a transparent substrate and a semiconductor layer. The transparent substrate is bonded to the white resist via a bonding member. The semiconductor layer is provided on the transparent substrate. The wire connects the light-emitting element and the lead frame at the opening.

Light-emitting device

A light emitting device includes a package and a light emitting element. The package includes a resin portion and at least one lead frame arranged in the resin portion. The at least one lead frame has at least one protrusion which is surrounded by the resin portion and which has an upper surface exposed from the resin portion. The light emitting element is mounted on the upper surface of the at least one protrusion and is electrically connected to the at least one lead frame. At least a half area of the upper surface is covered with the light emitting element.

Light emitting device

The light emitting device is provided with a substrate, semiconductor light emitting elements mounted on the substrate, a mold frame that surrounds the periphery of the light emitting elements on the substrate, and resin layers that fill the inside of the mold frame. The mold frame includes a first mold frame, and a second mold frame formed on top of the first mold frame. The resin layers include a first resin layer that embeds the light emitting elements in resin and is formed with a height approximately equal to the height of the top of the first mold frame, and a second resin layer on top of the first resin layer that is formed with a height approximately equal to the height of the top of the second mold frame. At least one of the resin layers (which are the first resin layer and the second resin layer) includes wavelength-shifting material to change the wavelength of light emitted from the semiconductor light emitting elements.

Light emitting device and its method of manufacture

Light emitting diode

A light-emitting apparatus includes a package including a support having a central section and a peripheral section around the central section. The central section is raised upwardly from the peripheral section, providing a pedestal for supporting a light-emitting device. A light-emitting device secured on an upper surface of the pedestal and has electrodes. Electrically conductive members are provided on a peripheral region of the package and electrically connected to the electrodes of the light-emitting device. A color conversion layer covers the light-emitting device. A light-transmitting member is formed in the package, sealing at least the light-emitting device together with the color conversion layer. The pedestal has its side surface at least partially exposed from the color conversion layer.

Light-emitting apparatus and method of producing the same

Growing community of inventors

Anan, Japan

Satoshi Okada