Shin-Etsu Polymer Co., Ltd.

Lintec Corporation

Satoshi Odashima

Kazuyoshi Yoshida

Takeshi Segawa

Hironobu Fujimoto

Kiyofumi Tanaka

Hidehiro Masuko

Noriyoshi Hosono

Osamu Ogawa

Hiroshi Mimura

Tsutomu Suzuki

Hiroyuki Shida

Kazumasa Ohnuki

Toshihiko Egawa

Naoki Fujinami

To provide a substrate storage container capable of keeping low a relative humidity in an internal closed space for a long period of time even after purging, a substrate storage container including a constitutive material, which includes a shell body, a door and an on-off valve, defining the internal closed space, the constitutive material being formed of a specific constitutive material having a water absorption of 0.1 wt. % or less when immersed in water at 23 degree C. for 24 hours, and thereby, an actual requirement is objectively satisfied in terms of water release suppression ability under JIS K 7209 or ISO 62 to significantly suppress releasing of water into the internal closed spacethrough the shell body, the door and the on-off valve.

Substrate storage container

A separate supporting body for supporting semiconductor wafers of &#x3c6;450 mm is attached to the inner surface of either side wall of a container body. Each supporting body is formed of a front supporting piece that is projected laterally from a frame and horizontally retains the wafer on, at least, the side part in the front peripheral edge; and a rear supporting piece that is projected laterally from frame and horizontally retains the wafer on, at least, the side part in the rear peripheral edge. Front supporting piece is formed of a projected part that extends from the front of frame toward the front peripheral edge of the semiconductor wafer and a curved part that extends rearwards from projected part along the peripheral edge of the semiconductor wafer.

A substrate storage container includes a locking mechanism, provided in a lid for opening and closing an opened front portion of a container body which stores a substrate of three sheets or less, for locking the lid fitted into the front portion of the container body. The locking mechanism is supported by the lid which is substantially laterally long when viewed from the front. The locking mechanism includes an advance/retreat engaging body that opposes an inner periphery of the front portion of the container body when the lid is fitted into the front portion of the container body, and a spring member that causes the advance/retreat engaging body to advance from the lid to the inner periphery of the front portion of the container body and thus causes a tip end portion side thereof to interfere when the lid is fitted into the front portion of the container body.

Lid body for substrate storage container and substrate storage container

A backgrinding machineof a semiconductor wafer W includes: a tableset on the working plane of a mount; a multiple number of holding jigsarranged via check tableson table; a grinding machinefor performing a grinding process of the rear side of semiconductor wafer W held by holding jig; and a washing devicefor ground semiconductor wafers W. Each holding jigis constructed of a concavedepressed on the surface of a base plate, a multiple number of supporting projectionsprojectively arrayed on the bottom surface of concave, a deformable contact film, covering the concave, being supported by the multiple supporting projections, for detachably holding semiconductor wafer W in close contact with it; and an exhaust pathfor conducting air from the concavecovered by contact filmto the outside.

Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure

A die is formed of a cavity mold having a hollow portion and a slidable core mold that allows a core to be inserted into hollow portion of cavity mold. An insert part that has been previously molded is fitted to and supported by the front end of core of core mold. Then, insert part is inserted into die and clamped therein, then a molten molding material is injected into die so as to perform injection molding of a container body of a substrate storage container with its rear part formed with insert part. Since insert part is put into contact with hollow portion of cavity core so as to restrain vibration of tapering flat core, core of core mold will not be flapped or flexed even if difference in injection pressure occurs in the molding material.

Injection molding die and injection molding method

Proposed is an improved heat-sealable connector having aligned lines of an electroconductive paste formed by screen printing on the surface of a flexible substrate. Different from conventional heat-sealable connectors, the electroconductive lines are not formed directly on the surface of the substrate but the substrate surface is first provided with a layer of a solvent-absorptive material and the electroconductive lines are formed on the solvent absorptive layer by screen printing so that the screen-printed lines of the paste never cause running to broaden the line width by virtue of immediate absorption of the solvent in the paste into the solvent-absorptive layer to contribute not only to the productivity but also to the quality of the product connectors.

Heat-sealable connector and method for the preparation thereof

Proposed is an improved heat-sealable connector having aligned lines of an electroconductive paste formed by screen printing on the surface of a flexible substrate. Different from conventional heat-sealable connectors, the electroconductive lines are not formed directly on the surface of the substrate but the substrate surface is first provided with a layer of a solvent-absorptive material and the electroconductive lines are formed on the solvent-absorptive layer by screen printing so that the screen-printed lines of the paste never cause running to broaden the line width by virtue of immediate absorption of the solvent in the paste into the solvent-absorptive layer to contribute not only to the productivity but also to the quality of the product connectors.

Proposed is a novel heat-sealable connector sheet, by which very reliable electric connection can be obtained with electrode terminals on an electronic device or a circuit board, consisting of a flexible insulating plastic substrate sheet and a patterned electroconductive layer formed thereon from an electroconductive paste with an overcoating layer of an insulating melt-flowable adhesive. Different from the electroconductive pastes used in conventional connector sheets, the electroconductive paste used here is compounded with an appropriate amount of relatively coarse particles of an insulating material having elasticity, e.g., plastic resins. The patterned electroconductive layer is formed from such a composite conductive paste in such a fashion that the insulating particles are fully embedded in the conductive paste but forming protrusions on the surface of the patterned electroconductive layer which accordingly exhibits a rugged appearance.

Heat-sealable connector sheet

An improvement is proposed in an anisotropically electroconductive adhesive composition comprising an insulating adhesive resin as a matrix and electroconductive carbon particles dispersed in the matrix used for electrically connecting oppositely facing electrode terminals on various kinds of electronic devices and circuit boards. Different from conventional spherical carbon particles, the conductive particles used here are carbon particles each having a plurality of projections on the surface as formed, for example, by the high-temperature calcination of spherical carbon particles blended with a tar or pitch. By virtue of the projections on the carbon particles, the electric connection formed by using the inventive adhesive composition is very reliable and durable even under adverse ambient conditions involving a high temperature, high humidity, vibrations and mechanical shocks by virtue of the anchoring effect by the projections.

Anisotropically electroconductive adhesive composition

A device is proposed to detect firm and reliable adhesive bonding and electrical connection between electrode arrays on two circuit boards by sandwiching a layer of an anisotropically electroconductive adhesive composition, in which the adhesive composition is formulated with an epoxy resin capable of changing color by complete curing and at least one of the circuit boards is prepared of a substrate having an opening or made from a transparent material in the vicinity of the electrode array so as to facilitate visual see-through inspection of the adhesive layer to detect complete curing of the adhesive composition.

Anisotropically electroconductive adhesive and adhesively bonded

The anti-glare covering for illuminate switch or indicator of the invention is formed of a covering member shaped from a transparent synthetic resin and a microlouver-type anti-glare sheet melt-bonded to the lower surface of the covering member. This structure is different from conventional anti-glare coverings for illuminate switch or indicator in which the covering member has a top opening and the microlouver-type anti-glare sheet covers the opening. Thus, the anti-glare covering of the invention is provided with improved visiblity and rigidity and is easy to maintain beautiful appearance. The visibility of the illuminate switch or indicator is further improved by providing a thin light-transmitting metallizing layer on the upper surface of the covering member at the top portion.

Growing community of inventors

Saitama, Japan

Satoshi Odashima