Kabushiki Kaisha Toshiba

Tokyo Shibaura Denki Kabushiki Kaisha

Nissan Chemical Industries Limited

Waseda University

Satoshi Nakao

Yasuo Taguchi

Tetsujiro Tsunoda

Hiroyuki Nishide

Takuji Yoshimoto

Kenichi Oyaizu

Kaoru Imamura

Shinichi Umekawa

Hiroshi Sawano

Takuma Kawai

Hidekazu Sugawara

Yoshiaki Imaji

Takashi Higuchi

A fused-ring quinone-substituted polynorbornene has recurring units of formula (1) and/or (2) below.  In formulas (1) and (2), Ais independently a substituent of formula (3) or (4) below, n is an integer from 1 to 6, and Ais a substituent of formula (5) or (6) below.  In formulas (3) to (6), each X is independently a single bond or a divalent group, and Arand Arare each independently an aromatic hydrocarbon ring or an oxygen atom or sulfur atom-containing aromatic heterocycle that forms together with two carbon atoms on a benzoquinone skeleton. This polymer has charge-storing properties and, when used as an electrode active material, is capable of providing a high-performance battery possessing high capacity, high rate characteristics and high cycle characteristics.

Fused-ring quinone-substituted polynorbornene, electrode active material and secondary battery

A power semiconductor module comprises a circuit board made of an insulating substrate of good thermal conductivity formed with interconnect patterns, a plurality of power semiconductor chips mounted on the circuit board, bonding wires for electrically connecting the semiconductor chips and the interconnect patterns, outer lead terminals fixed to the interconnect patterns, and a resin layer for covering at least the chip mounted surface of the circuit board in its entirety so that the tip of each of the outer lead terminals is exposed.

Power semiconductor module for use in power conversion units with downsizing requirements

On a metal base, an insulated wiring substrate is fixed, and, on a conductive layer on the insulated wiring substrate, semiconductor chips are disposed. Above the semiconductor chips, a controlling substrate is provided, and the signals produced in this controlling substrate are supplied to electrodes on the surfaces of the semiconductor chips via bonding wires passing through openings provided in the controlling substrate.

Power semiconductor module with a plurality of semiconductor chips

In the present invention, a heat spreader, circuit boards for power semiconductor elements, and a circuit board for a control circuit are fixed on a metal plate. The heat spreader is made of an IMS. The IMS has a metal base made of Cu or Cu clad plate, and a high heat radiating insulating layer made of a resin-based material, and the metal plate and the heat spreader are adhered by the high heat radiating insulation layer and electrically insulated from each other. Only a power semiconductor element is soldered onto the heat spreader. A wiring pattern for guiding each terminal of the power semiconductor element to the outside is formed on a power circuit board. A control circuit for controlling the power semiconductor element is formed on the circuit board for the control circuit.

Power module using IMS as heat spreader

In a comparator according to this invention, a first transistor of a first polarity and a second transistor of a second polarity are connected to each other between a first and second potentials so as to provide positive feedback. The control terminal of a third transistor of the second polarity is connected to one end of the current path of the second transistor and at the midpoint of the positive feed back path between the first and second transistors. A reference voltage is supplied to the base of the first transistor from a voltage dividing resistor circuit that varies the reference voltage according to the conducting state of either the second transistor or the third transistor. The input signal is received at one end of the current path of the first transistor, while the output signal appears at one end of the current path of the third transistor.

Comparator having a reduced number of elements

An ignition detector circuit includes first and second resistors connected in series between a primary winding of a coil and the ground, a comparator having a first input terminal connected to the junction between first and second resistors and a second input terminal to which a reference voltage is applied, and a capacitor and a third resistor connected in parallel between the first input terminal of the comparator and the ground.

Ignition detector circuit

An ignition control device includes a signal generating circuit for generating an output signal which has a frequency corresponding to the rotation speed of an engine, a rotation speed indication voltage generating circuit for generating a voltage which has a level corresponding to the rotation speed of engine, a saw-tooth wave generating circuit for generating a saw-tooth wave signal which changes at a frequency corresponding to the output signal from the signal generating circuit and at a rate corresponding to the voltage applied from the rotation speed indication voltage generating circuit, and a control circuit for generating an ignition signal every time when the saw-tooth wave signal has reached a predetermined voltage. The ignition control device further includes a control circuit for comparing a reference voltage with the saw-tooth wave signal in response to an output signal from the signal generating circuit and controlling the voltage stored in the voltage generating circuit according to the difference between both input signals.

Ignition control device

A semiconductor integrated circuit is temperature compensated by circuit elements which may be integrated on a typical semiconductor chip. The elements may include resistances formed by different means to have different temperature coefficients so that the collective temperature coefficient of the resistances can be adjusted by changing the values of the resistances.

Semiconductor integrated circuit providing temperature compensation

An ignition coil energizing circuit is provided which has a signal generator for generating an output signal having a frequency corresponding to an engine rotational speed, a switching circuit connected to an ignition coil, a current detector for detecting a current flowing through the ignition coil, a duty control for supplying to the switching circuit a control signal having a duty cycle corresponding to a duty cycle of an output signal from the signal generator and controlling a conduction state of the switching circuit, and a current control circuit for controlling the switching circuit in response to an output signal generated from the current detector and maintaining a current flowing through the current detector at a predetermined value. The ignition coil energizing circuit also has a timer for generating an output signal when the switching circuit is detected to be on over a predetermined period of time and a current supply circuit for supplying a gradually increasing current to the current detector in response to an output signal of the timer.

Growing community of inventors

Tokyo, Japan

Satoshi Nakao