Matsushita Electric Industrial Co., Ltd.

Satoshi Murakawa

Yo Hasegawa

Yukihiro Shimazaki

Takeo Yasuho

Masaaki Hayama

Toshio Sugawa

A circuit board is manufactured by filling a via-hole formed in an insulating substrate with conductive material, disposing conductive layers on both sides of the insulating substrate, and forming alloy of component material of the conductive material with component material of the conductive layers. In the circuit board, therefore, the conductive material filled in the via-hole formed in the insulating substrate is securely connected electrically as well as mechanically to the conductive layers on both sides of the insulating substrate with high reliability.

Circuit board and method of manufacturing the same

A resin having a monomer unit structure represented by the formula: ##STR1## can be cured by an actinic irradiation such as electron beam, ultraviolet ray or infrared ray to give a heat-resistant, moisture-resistant, acid- and alkali-resistant and solvent-resistant film which is especially suitable for a paint vehicle resin for use in resistor element or magnetic recording medium. A composition comprising said resin modified by incorporating at least of one monomer or oligomer containing at least one acryl, methacryl or allyl group therein for facilitating the control of the characteristics of a resistor element obtained by using said composition is also disclosed.

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Neyagawa, Japan

Satoshi Murakawa