Tdk Corporation

Japan Display Inc.

Other

International Business Machines Corporation

Jfe Steel Corporation

Toppan Printing Co., Ltd.

Alps Alpine Co., Ltd.

Satoshi Maruyama

Tsuyoshi Iijima

Atsushi Sano

Kazuya Ogawa

Tadashi Suzuki

Masato Kurihara

Hisashi Suzuki

Toshinobu Miyakoshi

Kazuhide Ohe

Makoto Kobayashi

Atsuko Kosuda

Tsuneo Kuwahara

Jun-ichi Satoh

Hideo Ohkuma

Evan G Colgan

Hiroyuki Kimura

Hiroki Ohara

Masaru Suzuki

Fuad Elias Doany

Hirotaka Hayashi

Tetsuya Takahashi

Kenji Harada

Takanori Tsunashima

Rama Nand Singh

Hirohisa Tanaka

Jun Nakagawa

Takao Mizushima

Kohei Kurata

Toshifumi Tanaka

Noriyoshi Kanda

Keita Kobayashi

Makoto Kondo

Masakazu Kaida

Akira Kakinuma

Masato Kurokawa

Toshiro Ijima

Yasuhiko Saito

Koichi Kitazawa

Takanobu Takenaka

Tomohito Johnai

Yukiko Hirabayashi

Yohei Kitamura

Hiroki Ichiba

Shinichi Yamashita

Yasukazu Hayasaka

Masao Matsui

Tomohito Jounai

Fei Song

Ryouhei Adachi

Takamasa Yamamoto

Masakatsu Kujira

Kozo Sakurai

Kiyoshi Tomiki

Kazuhiko Toyoda

Makoto Fujikawa

Yutaka Kunii

Takuro Homma

Noriyuki Hirota

Hiroharu Sugawara

Atushi Sano

Hiroki Yamaguchi

Katsunori Kikuchi

Kouji Uchimura

A method of heating up a furnace bottom and a burner lance used in the method are proposed. The method of heating up the furnace bottom includes a step of opening, in the tap hole, a burner lance insertion hole having a diameter larger than a diameter of the burner lance so as to penetrate into the furnace, a step of installing the burner lance in the opened burner lance insertion hole, a step of filling a gap between the installed burner lance and a furnace exterior side of the tap hole with a refractory, and a step of blowing in gas for heating into the furnace from the burner lance to heat up the furnace bottom.

Method of heating up furnace bottom, and burner lance used in the method

The display device includes a substrate including a first resin layer, a second resin layer overlapping the first resin layer, and a first inorganic insulating layer between the first resin layer and the second resin layer, and having flexibility, a display region provided on the substrate, a terminal region arranged outside the display region on the substrate, and a bending region arranged between the display region and the terminal region. A thickness of the second resin layer is larger than a thickness of the first resin layer. The substrate includes a first region and a second region. The first resin layer, the first inorganic insulating layer, and the second resin layer are laminated in the first region. The first resin layer and the second resin layer are laminated in the second region and the first inorganic insulating layer is not laminated in the second region.

Display device including bending region including laminated first and second resin layers

A production method for a wavelength conversion sheet, including: a bonding step of bonding a multilayer film and a release film together to obtain a phosphor protective film, the multilayer film including a barrier film, the release film being releasable from the multilayer film; a phosphor layer formation step of forming a phosphor layer containing phosphors on a surface of the multilayer film of the phosphor protective film to obtain a wavelength conversion sheet with the release film; and a release step of releasing the release film from the wavelength conversion sheet with the release film.

Phosphor protective film, wavelength conversion sheet with release film, wavelength conversion sheet, and production method for wavelength conversion sheet

A plurality of thin film transistors provided in a peripheral region are first staggered thin film transistors where a first channel layer configured of low-temperature polysilicon is included, and the first channel layer is not interposed between a first source electrode and a first gate electrode, and between a first drain electrode and the first gate electrode. A plurality of thin film transistors provided in a display region are second staggered thin film transistors where a second channel layer configured of an oxide semiconductor is included, and the second channel layer is not interposed between a second source electrode and a second gate electrode, and between a second drain electrode and the second gate electrode. The first thin film transistor is located below the second thin film transistor.

Display device

A display device having an improved display characteristics and reduced manufacturing cost is provided. The display device includes a plurality of pixels arranged on a surface of a substrate. The plurality of pixels each include: a light-emitting element; a driving transistor; a selecting transistor; and a retention capacitor. The driving transistor has a bottom-gate structure. The driving transistor has a semiconductor layer containing a first semiconductor. The retention capacitor has a first electrode and a second electrode. The first electrode doubles as a gate of the driving transistor. The second electrode is disposed at a lower layer than the first electrode and contains a second semiconductor.

Semiconductor device having multiple semiconductor layers

A powder core includes a compact including a soft magnetic powder, and an outer coating of the compact. The outer coating contains polyethersulfone. An electric or electronic component including the powder core, and an electric or electronic device having the electric or electronic component mounted therein are also provided.

Powder core, electric or electronic component including the powder core and electric or electronic device having the electric or electronic component mounted therein

Method for manufacturing a display device

A display device includes a flexible substrate, and a display region having a plurality of pixels on the flexible substrate. The substrate includes a resin layer, a first inorganic insulating layer provided on the first resin layer, and a second resin layer provided on the first insulating layer. A thickness of the second resin layer is larger than a thickness of the first resin layer, and the first resin layer is a resin layer baked at a higher baking temperature than the second resin layer.

Manufacturing method of display device

Disclosed is a display device including: a first conductive film over and in contact with a substrate; a first undercoat and a second undercoat over and in contact with the first conductive film; a pixel over the first undercoat; a wiring over the first undercoat, the first conductive film, and the second undercoat and in contact with the first conductive film between the first undercoat and the second undercoat. The first undercoat and the second undercoat are spaced from each other over the first conductive film and each cover a part of the first conductive film. The wiring is configured to form a terminal to which a signal for driving the pixel is input over the second undercoat.

Display device having flexibility

Semiconductor device including semiconductor layers having different semiconductor materials

A display device according to the present invention includes a substrate, and a plurality of pixels arranged in the substrate, wherein each of the plurality of pixels includes a light emitting element, a first transistor, a second transistor, a first insulation layer and a second insulation layer, the first transistor includes a first semiconductor layer, the second transistor includes a second semiconductor layer, the first insulation layer is arranged across the plurality of pixels between the first semiconductor layer and the second semiconductor layer, the second insulation layer is arranged between the first insulation layer and the second semiconductor layer, the first semiconductor layer is arranged on the substrate side sandwiching the first insulation layer with respect to the second semiconductor layer, the first insulation layer includes a silicon oxide layer; and the second insulation layer includes an aluminum oxide layer.

Growing community of inventors

Tokyo, Japan

Satoshi Maruyama