Toyobo Co., Ltd.

Satoshi Maeda

Tooru Kitagawa

Tetsuo Okuyama

Naoki Watanabe

Toshiyuki Tsuchiya

Hiroyuki Wakui

Kaya Tokuda

Masahiko Nakamori

Kazuyuki Ouya

Harumi Yonemushi

Denichirou Mizuguchi

Katsuki Nakase

Masahiro Tamada

Jun Okamoto

Issei Kobayashi

Toshiyuki Tsutiya

Takehumi Yoshida

Hisato Kobayashi

Yasuo Ohta

Masayuki Tsutsumi

The invention provides a laminate having a protective film release auxiliary tape and comprising a rigid temporary support body (inorganic substrate) and a polymer film provided with a protective film. The laminate is configured such that the protective film can be peeled from the polymer film without separating the polymer film from the temporary support body. The laminate comprises an inorganic substrate, a heat-resistant polymer film, a protective film, and a protective film release auxiliary tape in this order. The adhesion strength F1 according to a 90 degree peeling method between the inorganic substrate and the heat-resistant polymer film, the adhesion strength F2 according to a 90 degree peeling method between the heat-resistant polymer film and the protective film, and the adhesion strength F3 according to a 90 degree peeling method between the protective film and the protective film release auxiliary tape satisfy the relationship F3>F1>F2.

Laminate

An inorganic substrate/polymer film laminate with an attached protective film that allows for easy individual removal even when stored in a stacked state for a long period of time is provided. A first laminate is characterized by including an inorganic substrate, a polymer film layer and a first protective film, in that order, wherein the surface roughness Ra of the surface of the inorganic substrate opposite of the polymer film layer is 0.02-1.2 μm.

Laminate of inorganic substrate/polymer film layer with attached protective film, laminate stack, laminate storage method, and laminate transport method

The invention provides a multilayer body of an inorganic substrate and a highly heat-resistant film, wherein the surface of the inorganic substrate is sufficiently smooth after removal of the highly heat-resistant film from the multilayer body, and the inorganic substrate is re-usable. The multilayer body uses substantially no adhesive and is characterized by

Multilayer body and method for producing flexible device

It is provided that a polymer film; a preparation method of the polymer film; and a laminated body used the polymer film. The polymer film is suitable for use in producing a laminate body which comprises a support and a polymer film, and is reduced in foreign-matter trapping and which can be used for supplying film devices using conventional apparatuses for glass substrates or silicon substrates. The polymer film coated with the layer of silane coupling agent, which is suitable for producing a laminate that comprises a support and a polymer film, comprises a silane coupling agent layer formed on at least one surface of the polymer film, wherein the silane coupling agent layer has a three-dimensional surface roughness (Sa) of 5.0 nm or less. The method of efficient for producing the polymer film coated with the above layer is the method for producing without using a vacuum.

Polymer film coated with a layer of silane coupling agent

By preparing a polyimide film with a face at the support side and subjected to a surface treatment; subjecting at least one of a face of the support and the face of the polyimide film which are opposite to each other to a patterning treatment using a coupling agent to form a satisfactorily bondable part and an easily releasable part which differ in adhesion/peel strength; subsequently, superposing the support and the polyimide film to be subjected to a pressurizing/heating treatment and to be bonded to each other, subjecting the surface of the polyimide film to an organic alkali treatment; and then, applying a polyamic acid solution free from a slip agent ingredient, drying the coating film and imidizing the film, a layered product having a structure of at least three layers in which at least one layer contains a slip agent material and both surface layers have no slip agent material is produced.

Method for producing layered product, layered product, method for producing layered product with device using said layered product, and layered product with device

The invention provides a laminate of an inorganic layer, a resin layer, and a coupling agent treatment layer interposed therebetween, which different delamination strengths between the inorganic layer and the resin layer to form a prescribed pattern. The invention also provides a production method comprising (1) treating an inorganic layer with a coupling agent; (2) performing a patterning process to form strong adhesion sections and easily separated sections; and (3) forming a resin layer by drying and heat-treating a coated solution layer obtained by coating a resin solution or a resin precursor solution onto the surface of the inorganic layer that was treated with a coupling agent and then patterned.

Laminate, production method for same, and method of creating device structure using laminate

The invention provides a laminate of a substrate, a polyimide film, and a coupling treatment layer interposed therebetween, which provides different delamination strengths between the substrate and the polyimide film to form a prescribed pattern. The invention also provides a method for producing such a laminate formed from at least a substrate and a polyimide film, whereby, using a film obtained by plasma treatment of at least the surface facing the substrate as the polyimide film, coupling agent treatment is performed on at least one of the surfaces facing the substrate and the polyimide film to form a coupling treatment layer, deactivation treatment is performed on a portion of the coupling treatment layer to form a pre-determined pattern, and then pressing and heating are performed with the substrate and polyimide film overlapping.

Laminate, method for producing same, and method for producing device structure using same

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Otsu, Japan

Satoshi Maeda