Matsushita Electric Industrial Co., Ltd.

Satoshi Kuwano

Hitoshi Minabe

Mamoru Inoue

Toshihiro Mihara

Tsuneshi Nakamura

Takeo Takayanagi

Takao Kusuda

Masaaki Yonemura

Satoshi Kitaichi

Seiichi Takesawa

Shunichi Yabuzaki

Shun-ichi Yabuzaki

An exhaust gas filter for diesel particulates, comprising a row of a plurality of channels of honeycomb structure of porous sintered ceramic fiber composite sheet, the ceramic fiber composite sheet being produced by a paper-forming method from a slurry of alumino-silicate fiber and fire clay. The honeycomb structure of the ceramic fiber composite sheet is formed by stacking plane sheets and corrugated sheets one atop the other. The filter exhibits low pressure drop yet highly efficient operation by having a bulk density of the ceramic fiber composite sheet in the range of 0.1 g/cm.sup.3 to 0.8 g/cm.sup.3.

Exhaust gas filter

A method and apparatus for preparing a casing loaded with a plurality of articles such as small-sized electronic parts for use in the electronic industries, which ensures that the stored parts will be positively and stably aligned in the casing without the possibility of any play or disorientation from their regular positioning within the casing. The casing is provided with a single piece resilient element which is inserted into the casing, the resilient element being designed to resiliently expand against the inner wall surface of the casing to frictionally engage therewith. Thereafter, a plurality of parts are inserted one after another into the casing so that they become stacked in a serially aligned manner inside the casing against the resilient force of the resilient element, thus preparing a casing loaded with a plurality of parts therein stacked in a serially end-to-end resting state. If desired, another resilient element may be inserted into the casing onto the lastly fed part so that the parts stored within the casing may be positively held in their original position.

Method and apparatus for preparing a casing loaded with a plurality of

Chip type circuit elements are mounted on adhesive layers provided on predetermined positions of a printed circuit board by pushing up each circuit element stack inserted in a magazine which is vertically held just below the corresponding adhesive layer and which is inserted through a corresponding through-hole defined by a lattice-shaped and horizontally placed magazine guide. This method and apparatus can quickly mount chip type circuit elements on the printed circuit board, and make possible an easy change of the circuit element pattern, without necessitating the use of an NC machine.

Method for mounting chip type circuit elements on a printed circuit

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Kawanishi, Japan

Satoshi Kuwano