Disco Corporation

Taiyo Yuden Co., Ltd.

Sony Corporation

Hoya Corporation

Other

Sony Electronics Inc

Adv Antest Corporation

Yokogawa Electric Corporation

Nippon Steel Corporation

Osaka University

Nippon Kayaku Kabushiki Kaisha

Joled Inc.

Daiwa Seiko, Inc.

Tokyo Metropolitan Public University Corporation

Orbray Co., Ltd.

Satoshi Kobayashi

Yusuke Nagai

Takahisa Fukuda

Kiyoshiro Yatagawa

Makoto Sato

Kazuhiro Suzuki

Yuji Kimura

Hiroshi Takano

Futoshi Kaibuki

Hiroshi Utsunomiya

Yukio Morishige

Tomoaki Nakamura

Keiji Nomaru

Masaru Nakamura

Mikio Tahara

Satoshi Tokunaga

Yuki Ikku

Yuki Iguchi

Ryosuke Hoshino

Masahiko Sato

Kenichi Suzuki

Naoki Saito

Tomoo Kashiwa

Hiroshi Kawazoe

Junya Saito

Tsutomu Kume

Hiroaki Yanagita

Naoki Ohmiya

Takatomo Nagamine

Kenji Matsuoka

Shuichiro Tsukiji

Yasuyoshi Yubira

Masahiro Murata

Osamu Kikuchi

Yuki Tani

Kazue Sadanaka

Yukiko Einaga

Tomonori Kaizaki

Akira Furusawa

Kazuma Sekiya

Nobuyuki Kimura

Yosuke Watanabe

Kenichi Nendai

Youngsuk Kim

Hidenori Aoki

Takashi Yoshimoto

Tsuyoshi Yamamoto

Shunsuke Teranishi

Jinyan Zhao

Atsushi Ueki

Masahiro Orita

Seiji Harada

Koichi Shigematsu

Natsuko Sato

Kimikazu Takahashi

Masashi Aoki

Zhiwen Chen

Yoshihiko Noro

Nobuto Hosono

Yasuaki Tsunemi

Shinji Murakami

Makoto Kawamura

Tomomi Abe

Kiyoshi Ohsuga

Nobumori Ogoshi

Yoshio Umeda

Yusuke Tone

Hiroo Sato

Shiro Takahashi

Hisanori Suzuki

Yuriko Sato

Shinichi Hashimoto

Misaki Hatsuda

Shinichiro Miyasaka

Mihoko Tanaka

Takahisa Omata

Katsuhiro Nose

Morihiro Niimi

Makoto Kaneshima

Yasuaki Uchida

Satsuki Fujii

Akifumi Yue

Norihiko Fujioka

Hikaru Muto

Xuan Han

Ryuki Kitagawa

Ken Mitsudo

Yumi Sugiura

Tsukasa Nagase

Yasuhiro Shimma

A multi-layer ceramic electronic component includes a ceramic body and a pair of external electrodes. The ceramic body includes a pair of main surfaces perpendicular to a first axis, a pair of end surfaces perpendicular to a second axis, a pair of side surfaces perpendicular to a third axis, and internal electrodes drawn to the end surfaces, and has a substantially rectangular parallelepiped shape. The external electrodes each include an end-surface-covering portion that covers one of the end surfaces, and a main-surface-covering portion that is formed to be continuous from the end-surface-covering portion and covers a part of the main surface. The main-surface-covering portion includes a conductive resin layer, and first and second convex portions formed on the basis of a shape of the conductive resin layer, each swelling toward the center in the direction of the second axis, and disposed apart from each other in the third axis direction.

Multi-layer ceramic electronic component and circuit board

A multi-layer ceramic electronic component includes: a ceramic body having a substantially rectangular parallelepiped shape; and external electrodes each including a base layer, a conductive resin layer, and first and second conductive layers. A conductive filler includes a core portion and a silver coating film made of silver and covering the core portion. In a cross-section parallel to the first and second axes, when a straight line parallel to the first axis is drawn to pass through a range distant from a base end portion, and when a thickness of the first conductive layer along the line is a conductor thickness, and the sum of lengths of the silver coating film along the line in all the conductive fillers on the line is a total thickness of silver coating, a ratio of the conductor thickness to the total thickness of silver coating is 2 or more and 10 or less.

A zirconia material manufacturing method includes: dispersing hydroxyapatite powder in water to prepare a slurry having a hydroxyapatite powder concentration of 1%; and dipping zirconia in the slurry to form, on the zirconia, a coating layer containing hydroxyapatite.

Method for producing zirconia material

A laser reflow apparatus reflows solder bumps disposed on a side of a semiconductor chip in a workpiece and included in an irradiation range on the workpiece by applying a laser beam to an opposite side of the semiconductor chip. The laser reflow apparatus includes a spatial beam modulation unit including a laser power density setting function to locally set the laser power density in the irradiation range of a laser beam emitted from a laser beam source, and an image focusing unit including an image focusing function to focus the laser beam emitted from the laser beam source and apply the focused laser beam to the irradiation range on the workpiece.

Laser reflow apparatus and laser reflow method

A content providing system is provided that includes a client terminal and a server, and provides content based on a use state of the client terminal. The client terminal includes a client control unit and a display unit. The server includes a client terminal management unit, a content recording unit, a content management unit, a content distribution control unit, and a distribution condition management unit. The client control unit secures a content frame based on a distribution condition notified from the distribution condition management unit, and transmits a distribution request of the content to the content distribution control unit. The content distribution control unit extracts and distributes the content from the content recording unit, and the client control unit displays the content distributed by the content distribution control unit on the display unit within the content frame.

Content providing system, content providing method, and content providing program

One object of the present invention is to provide a magnetic coupling coil component having a coupling coefficient that can be readily adjusted. A coil component according to one embodiment of the present invention includes: a drum core including a winding core, a first flange, and a second flange, the first flange being provided on one axial end of the winding core, the second flange being provided on another axial end of the winding core; a spacer provided on a surface of the winding core between the first flange and the second flange, the spacer being separate from the winding core; a first winding wire wound around the winding core between the first flange and the spacer; and a second winding wire wound around the winding core between the second flange and the spacer.

Magnetic coupling coil component

A ceramic electronic component includes an element body, and first and second external electrodes formed on the element body. The element body has a dielectric, and first and second internal electrodes. The first external electrode includes a first base layer formed on the element body. The first base layer is connected to the first internal electrode and an edge of the first baser layer is present on a first surface of the element body. The first external electrode also includes a first plating layer formed on the first base layer. An edge of the first plating layer is present on the first surface of the element body at a position different from a position of the edge of the first base layer in a direction perpendicular to the first surface. The second external electrode has a similar structure to the first external electrode.

Ceramic electronic component, substrate arrangement and method of manufacturing ceramic electronic component

A ceramic electronic device includes: a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, a main component of the dielectric layers being ceramic, the plurality of internal electrode layers being alternately exposed to a first end face and a second end face of the multilayer chip, the first end face facing with the second end face; a first external electrode provided on the first end face; and a second external electrode provided on the second end face, wherein a silane film is provided on a surface of the ceramic electronic device, and wherein an organic compound is provided on the silane film, and has a siloxane bonding.

Ceramic electronic device

A multilayer ceramic capacitor includes: a multilayer chip in which each of dielectric layers and each of internal electrode layers are stacked, the plurality of internal electrode layers being exposed to at least one of a first end face and a second end face of the multilayer structure, the first end face being opposite to the second end face, a first external electrode provided on the first end face; a second external electrode provided on the second end face; and a fluorine compound that is adhered to at least a part of a region including a surface of the multilayer chip where neither the first external electrode nor the second external electrode is formed and surfaces of the first external electrode and the second external electrode, fluorine compound being released at a temperature of 380 degrees C. or more.

Multilayer ceramic capacitor having external electrodes provided with fluorine compound

An electronic component includes an element body having a dielectric and an inner electrode. The electronic component also includes at least one external electrode. Each external electrode includes a base layer, a plating layer and a covering layer. The base layer is formed on a plurality of surfaces of the element body to have a plurality of faces facing different directions. The base layer is connected to the inner electrode, and contains a metal. The plating layer is formed on a mounting face of the base layer and on a side face of the base layer to which the inner electrode is connected. The covering layer is formed on at least a portion of a face of the base layer, which is opposite to the mounting face of the base layer. A surface of the covering layer is less wettable than a surface of the plating layer by solder.

Electronic component, circuit board arrangement and method of manufacturing electronic component

A coil component according to one aspect is provided with a core containing a plurality of soft magnetic metal particles, a winding wire wound on the core, and a sheathing body provided on the core so as to cover at least part of the winding wire and having a relative magnetic permeability smaller than that of the core.

Wire-wound coil component

A processing method of a wafer in which a modified layer is formed inside the wafer. In the processing method, irradiation with a first laser beam is executed from a back surface side of the wafer and the modified layer is formed inside the wafer. Then, irradiation with a second laser beam is executed with the focal point thereof positioned to the inside or the front surface of the wafer and reflected light is imaged by an imaging unit. Furthermore, a processing state of the wafer is determined on the basis of a taken image. The second laser beam is shaped in such a manner that a sectional shape thereof in a surface perpendicular to a traveling direction thereof becomes asymmetric across the modified layer.

Processing method of wafer

A manufacturing method of a ceramic electronic device includes: preparing a ceramic electronic device having a multilayer chip, a first external electrode, and a second external electrode, and bonding an organic compound having a siloxane bonding to at least a part of a region including a surface of the multilayer chip where neither the first external electrode nor the second external electrode is formed and surfaces of the first external electrode and the second external electrode, by contacting heated silicon rubber to the region.

Manufacturing method of ceramic electronic device

A ceramic electronic component includes external electrodes having conductive resin layers thereinside on respective two ends opposed to each other in a rectangular parallelepiped ceramic component body. Each of the external electrodes includes an underlying metal layer, an intermediate metal layer, a conductive resin layer, an external metal layer. A tip angle &#x3b1; between an outer face of a tip portion of the wraparound portion of the underlying metal layer and a surface of the ceramic component body is 20&#xb0; or smaller, and a tip angle &#x3b2; between an outer face of a tip portion of the wraparound portion of the intermediate metal layer and a surface of the ceramic component body is 20&#xb0; or smaller.

Ceramic electronic component and production method therefor

A ceramic electronic component includes: a ceramic body including a pair of end surfaces, and a side surface connecting the pair of end surfaces and including a pair of end regions adjacent to the pair of end surfaces and an intermediate region located between the pair of end regions; and a pair of external electrodes including a pair of base layers that cover the pair of end surfaces and the pair of end regions of the side surface and include outer surfaces, a difference of a surface roughness Ra of the outer surfaces with respect to the intermediate region of the side surface being 40 nm or less, and a pair of plating layers covering the outer surfaces of the pair of base layers and including a pair of extending portions extending from the outer surfaces of the pair of base layers to the intermediate region of the side surface.

Ceramic electronic component, method of producing the same, and circuit board

Growing community of inventors

Tokyo, Japan

Satoshi Kobayashi