Tokyo Ohka Kogyo Co., Ltd.

Satoshi Kobari

Akihiko Nakamura

Yoshihiro Inao

Junichi Katsuragawa

Yasumasa Iwata

Kimihiro Nakada

Shigeru Kato

Tamotsu Sasaki

Shugo Tsushima

An overlapping device which is configured to detect the center positions of a substrate and a support which are held in a center position detecting portion, carry the substrate and the support from the center position detecting portion to an overlapping portion, and overlap the substrate and the support such that the detected center positions of the substrate and the support are overlapped in the overlapping portion.

Overlapping device, and overlapping method

A transport arm including a holding unit that holds a substrate by vacuum adsorption. The holding unit has an air discharge port and an adsorption member formed so as to surround the air discharge port. The adsorption member is a squeeze packing.

Transport arm, transport apparatus and transport method

An attaching device configured to attach a substrate and a support via an adhesive layer is provided with support holding members. Holding tools of the support holding members are configured to hold the support with oblique surface parts (contact members) of the holding tools without coming into contact with a surface of the support, which is to be attached to the substrate. The attaching device attaches, to the substrate, the support of which the surface is held not to be contacted.

Attaching device and attaching method

A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.

Stripping device and stripping method

A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes the step of supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.

Provided is an alignment apparatus including holding and rotating means for holding an alignment object and rotating the alignment object, the alignment apparatus including supporting means for supporting that part of the alignment object being rotated which is different from that part of the alignment object which is held by the holding and rotating means. This makes it possible to align the alignment object highly accurately by preventing the alignment object from being deformed, e.g. bent, due to its own weight.

Growing community of inventors

Kawasaki, Japan

Satoshi Kobari