Canon Kabushiki Kaisha

Tokyo Electron Limited

Hitachi, Ltd.

Ricoh Company, Ltd.

Mitsubishi Paper Mills Limited

Renesas Electronics Corporation

Fuji Electric Co., Ltd.

Kabushiki Kaisha Toshiba

Mitsubishi Denki Kabushiki Kaisha

Mimaki Engineering Company, Ltd.

E.i. Dupont De Nemours and Company

Hgst Netherlands, B.v.

Mitsubishi Electric System Lsi Design Corporation

National Institute of Technology

Commitment Technologies Inc.

Satoshi Kaneko

Shuji Hirai

Satoru Kutsuwada

Tokuharu Kaneko

Shinichi Nakamura

Tadashi Suzuki

Shingo Suzuki

Hideki Adachi

Shinji Kato

Hiroshi Ozaki

Satoshi Kuroyanagi

Yukinori Sakashita

Naoyuki Ohki

Hisatsugu Tahara

Masanori Miyata

Hirokazu Takahashi

Kenji Kobayashi

Shinichi Hayashi

Yoshiyuki Suzuki

Masanori Sakai

Yoshinori Abe

Norifumi Miyake

Koichi Kudo

Yoshihiko Suzuki

Jun Yamane

Noriaki Matsui

Hirohiko Tashiro

Akiyoshi Kimura

Hitoshi Ishibashi

Akira Tanaka

Tsukasa Shibayama

Shokyo Koh

Masami Akimoto

Hironori Emaru

Keizo Isemura

Jiro Higashijima

Norihiro Ito

Akihiko Sakai

Shinichi Akatsu

Masahiro Serizawa

Nobuhiro Maki

Takayuki Toshima

Yasushi Miura

Hisashi Fukushima

Katsunori Suzuki

Masahito Yamamoto

Nobuhiko Takekoshi

Yoshifumi Amano

Isahiro Hasegawa

Hiroaki Tsuchiya

Keiju Kuboki

Akio Fujii

Minoru Ohashi

Hiroyuki Kimura

Toshihisa Nozawa

Mitsuhiko Sato

Hiroyuki Yaguchi

Toshiki Sugawara

Eiji Ohara

Tsutomu Kono

Norio Chujo

Naoki Matsushima

Nobuhiro Ogata

Shuichi Nagamine

Yasunobu Matsuoka

Akimaro Yoshida

Naoyuki Kanai

Akira Yamamoto

Katsuya Okumura

Masahiro Kawasaki

Naoto Watanabe

Haruo Okano

Takayuki Fujii

Yuji Kamikawa

Jun Nakajima

Mitsuaki Iwashita

Keiji Horioka

Hiroyuki Onishi

Hiroyoshi Yoshida

Masanori Takada

Yutaka Watanabe

Kazuhiro Ito

Takeshi Honjo

Takashi Tameshige

Noriyoshi Ueda

Hideto Kohtani

Daisuke Shinohara

Hirotaka Nakagawa

Makoto Hasegawa

Yushi Hirayama

Muneaki Iwata

Eiichi Ohara

Daisuke Ishizuka

Tomohiro Morimura

Motohito Hori

Katsuhiro Morikawa

Osamu Kuroda

Atsushi Takai

Shigenori Kitahara

A substrate processing apparatus includes a liquid processing module, provided with a carry-out/in opening of a substrate, including therein a first liquid processing device and a second liquid processing device; a module-outside transfer device configured to carry the substrate out from and into the liquid processing module; and a module-inside transfer device configured to transfer the substrate between the first liquid processing device and the second liquid processing device. The first liquid processing device is equipped with a first holder configured to hold the substrate. The second liquid processing device is equipped with a second holder configured to hold the substrate. The second liquid processing device is configured to perform a plating processing on the substrate held by the second holder. The first liquid processing device is configured to perform at least a post-cleaning processing performed after the plating processing on the substrate held by the first holder.

Substrate processing apparatus and substrate processing method

A technique enabling to heat a plating liquid rapidly while suppressing thermal deterioration of the plating liquid is provided. A substrate liquid processing apparatus includes a substrate holder configured to hold a substrate; a plating liquid supply configured to supply the plating liquid on a processing surface of the substrate; and a heating element, configured to heat at least one of the plating liquid on the processing surface or the substrate, including a heater, a liquid flow path through which pure water flows, and a vapor discharge opening which is connected to the liquid flow path and through which water vapor produced as the pure water is vaporized by heat from the heater is ejected.

Substrate liquid processing apparatus and substrate liquid processing method

A printer control system for controlling an inkjet printer that prints an image having a predetermined thickness on a print medium includes: an image data creating/editing portion, configured for creating and editing an image data; and a printer control portion, configured for converting the image data sent from the image data creating/editing portion into a printing data and sending the printing data to the inkjet printer. When a portion for allowing the image to have a thickness in the image printed on the print medium is defined as a thick portion, the image data sent from the image data creating/editing portion to the printer control portion includes at least one of: a thickness information regarding a thickness of the thick portion, and a shape information regarding a shape of an end portion of the thick portion.

Printer control system, printing system, printing data creation method, and printing method

A management computer manages a data processing infrastructure including a server that executes a job and a storage device that is coupled to the server via a network and stores data used for processing in accordance with the job. The management computer includes a disc and a CPU. The disc stores maximum resource amount information, path information, and load information. The CPU computes a free resource amount of components forming a path to data related to execution of a predetermined job, based on the maximum resource amount information, the path information, and the load information and determines a parallelizable number in a parallel executable processing unit when the predetermined job is executing in the server, based on the free resource amount.

Management computer, management system, and recording medium

A first wiring member bends at a first bent portion in the shape of the letter 'L' in a side view and includes a first horizontal portion parallel to the principal surface of a semiconductor chip and a first vertical portion perpendicular to the first horizontal portion. A second wiring member bends at a second bent portion in a direction opposite to the first wiring member in the shape of the letter “L” in the side view and includes a second horizontal portion flush with the first horizontal portion and a second vertical portion a determined distance distant from the first vertical portion and parallel to the first vertical portion. A wiring holding portion fills a gap between the first and second vertical portions and a gap between the first and second bent portions. Therefore, stress applied to the vicinity of the first or second bent portion is relaxed.

Semiconductor device

There is provided a site management apparatus capable of achieving both the improvement of the utilization rate of renewable energy and the reduction of the overhead of power consumption. A processor calculates, based on a site energy management table, an adjustment amount for adjusting a demand amount consumed at a migration source site of a workload. The processor selects, based on the adjustment amount and workload management information, a migration target workload, which is a workload whose execution site is to be migrated to a migration destination site, from among workloads executed in the migration source site and generates migration plan information indicating the selected migration target workload.

Site management apparatus and management method

Provided is a management system for managing a relation between a database and a volume without installing an agent. A management system manages a relation between a data catalog and a volume of a storage system storing data to be used by the data catalog. A processor of the management system accesses data that is included in the data catalog and that includes authentication information of the volume; detects the number of accesses to the volume in a time range including a timing of the access to the data; and manages the relation between the data catalog and the volume on the basis of the number of accesses.

Management system, method for management by management system, and recording medium

Easy and correct estimation of a relationship between entities is made possible. An entity relationship estimation apparatus that estimates a relationship between a plurality of entities each executing a process is configured to include: a window-based correlation and traffic volume estimation unit that acquires traffic data of a plurality of entities, and calculates correlation values in one or more windows of a predetermined time width of each traffic data of at least one entity pair; and a relationship type estimation unit that estimates a type of relationship between entities of the entity pair based on the correlation values of the windows of the entity pair.

Entity relationship estimation apparatus, entity relationship estimation method, and recording medium

A substrate liquid processing apparatus configured to perform a heating control over a processing liquid on a substrate with high accuracy in a unit of zones is provided. The substrate liquid processing apparatus includes a substrate holder configured to hold the substrate; a processing liquid supply configured to supply the processing liquid onto a processing surface of the substrate; and a heating unit configured to heat the processing liquid on the processing surface. The heating unit includes a heater, and a first sheet-shaped body and a second sheet-shaped body which are disposed to face the heater therebetween. The heater includes multiple heating elements provided in multiple heating zones of the heating unit.

Substrate liquid processing apparatus

An electrolytic processing jig configured to perform an electrolytic processing on a processing target substrate by using a processing liquid supplied to the processing target substrate includes a base body having a flat plate shape; and a direct electrode provided on a front surface of the base body and configured to be brought into contact with the processing liquid to apply a voltage between the processing target substrate and the direct electrode. An irregularity pattern is formed on a front surface of the electrolytic processing jig at a processing target substrate side.

Electrolytic processing jig and electrolytic processing method

A semiconductor module includes semiconductor elements, a case that houses the semiconductor elements, an external terminal electrically connecting the semiconductor elements and an external conductor, and a nut into which a bolt that secures the external conductor and the external terminal is threaded. The nut includes a cylindrical main body having a threaded hole, and a flange projecting in a direction radially outward of a center axis of the threaded nut hole and being disposed on one face of the main body. The case includes a wall surrounding the nut, the wall having a first recess that houses the main body, a second recess above the first recess and housing the flange, and a notch cut in a portion of the wall surrounding the main body. The first recess extends deeper than the main body, and the fillet is formed on a floor surface of the first recess.

Semiconductor module

Visibility of relevance of detailed configurations is improved while deterioration of the visibility of a general configuration between nodes is suppressed. A node coordinate calculation process calculates, upon calculation of deployment coordinates of each node, a degree of importance of an infrastructure resource and a degree of importance of an application, and weights the distance between the application node and the infrastructure node with the reciprocal of the degree of importance of the infrastructure node. Then, the node coordinate calculation process determines deployment of the application node such that the application node is deployed in the proximity of a comparatively important infrastructure node, and determines deployment of the application node on the basis of the degrees of importance of the applications such that a comparatively important application is deployed closely to the infrastructure node.

Display information processing apparatus, display information processing method and computer readable recording medium

An optimization support system that supports optimization of usage efficiency of resources identifies resource consumption and cost of each virtual machine, from management data. The management data includes data representing, for each of a plurality of virtual machines, attributes and cost of the virtual machine, and at least resource consumption out of resource consumption and resource usage rate of each of a plurality of types of calculation resources allocated to the virtual machine. The optimization support system displays a management user interface (UI) that is a UI representing both resource consumption and cost regarding the plurality of virtual machines.

System and method for supporting optimization of usage efficiency of resources

Example implementations described herein are directed to management of a first storage system for an on-premise system and a second storage system for a public cloud system. Such example implementations can involve, responsive to an update to one or more of a plurality of snapshot volumes in the first storage system, updating first shared page information stored in the first storage system according to the update to the one or more snapshot volumes, the first shared page information indicative of pages shared between the plurality of snapshot volumes in the first storage system; transmitting instructions to the second storage system to copy the updates to the one or more snapshot volumes from the first shared page information to a second shared page information stored in the second storage system; and executing read or write operations made to the second storage system based on the second shared page information.

Caching meihod for hybrid cloud storage running dev/test on public cloud

A semiconductor module internally includes semiconductor elements and multilayer substrates on which the semiconductor elements are arranged. The semiconductor module further includes, in a case, fastening portions for fastening a cooler such as conductive radiating fins or water-cooling jackets, for example. In the semiconductor module, side faces of heat radiating plates formed on the rear surface sides of the multilayer substrates are electrically connected to the fastening portions in the case by conductive connectors.

Semiconductor module and semiconductor device using the same

Growing community of inventors

Kanagawa, Japan

Satoshi Kaneko