Panasonic Intellectual Property Management Co., Ltd.

Satoshi Kanai

Koji Morikawa

Koichi Ikemoto

Shin Tabuchi

Tsuyoshi Inoue

Takeshi Kawabata

Takashi Yui

Kiyomi Hagihara

Hiromichi Nishiyama

Masatoshi Sasaki

The condition monitoring system includes an acquisition unit and a generation unit. The acquisition unit acquires waveform data from a measuring device to measure an electrical signal that is either output or input of a converter. The waveform data represents a waveform of the electrical signal. The generation unit generates, based on the waveform data, analysis data to monitor the condition concerning the converter. The generation unit obtains, by frequency analysis, a plurality of combinations, each including a value of a frequency and a value of a feature quantity that is either intensity or phase, based on the waveform data when a value of the drive frequency varies and thereby generate the analysis data having at least three variables including the frequency, the feature quantity, and the drive frequency.

Condition monitoring system, condition monitoring method, condition monitoring program, and storage medium

A power generation equipment monitoring system includes a receiver and a determining processor. The receiver acquires, from a measuring device that measures output currents of power generation equipment that converts rotational energy of a rotor thereof into electric energy to output AC voltage with a reference frequency, waveform data representing waveform of the output currents. The determining processor determines presence and absence of a malfunction in a rotary block that applies motive power to the rotor of the power generation equipment, according to the waveform data acquired through the receiver. The determining processor determines the presence and absence of the malfunction based on a component of at least one specific frequency arranged at one or more intervals according to a rotational speed of the rotor from the reference frequency on a frequency axis in a frequency spectrum of the output currents.

Power generation equipment monitoring system, power generation equipment monitoring method and program

A blood pressure estimation apparatus includes: a pulse wave measurement unit measuring a user's pulse wave signal; an electrocardiogram signal measurement unit measuring a user's electrocardiogram signal; and a processing circuit estimating a user's blood pressure value by using the pulse wave and electrocardiogram signals, wherein the processing circuit (a) acquires a pulse wave signal feature by using the pulse wave signal, (b) acquires an electrocardiogram signal feature by using the electrocardiogram signal, (c) acquires a pulse wave propagation time by using the pulse wave and electrocardiogram signals, (d) selects a blood pressure group indicating a relationship between a pulse wave propagation time and blood pressure of the user by using the pulse wave signal feature, electrocardiogram signal feature, and pulse wave propagation time, and (e) estimates the blood pressure value by using the blood pressure group, pulse wave signal feature, electrocardiogram signal feature, and pulse wave propagation time.

Blood pressure estimation apparatus, blood pressure estimation method, and non-transitory computer-readable recording medium

A semiconductor module includes: one or more semiconductor elements; a wiring substrate having a first surface on which the one or more semiconductor elements are mounted, the wiring substrate being electrically connected to the one or more semiconductor elements; a heat sink on which the wiring substrate is mounted, the heat sink facing a second surface of the wiring substrate on a reverse side of the first surface; a binder which is formed in a die pad area on the heat sink so as to be present between the wiring substrate and the heat sink, and bonds the wiring substrate and the heat sink; and a support which is formed in a peripheral part of the die pad area on the heat sink, and fixes the wiring substrate to the heat sink by being in contact with a peripheral part of the second surface of the wiring substrate.

Semiconductor module and method for manufacturing the same

A sensor device includes a plurality of electrode chambers, a measurement chamber, and an accommodation chamber which are connected in annular relationship permitting expansion and contraction. Each of the plurality of electrode chambers has a measurement electrode. The measurement chamber has a biological potential measurement circuit which is connected with each measurement electrode via electrically conductive wiring for measuring biological potential of the user by using the measurement electrode. The accommodation chamber has an internal protrusion. The wiring which connects at least one measurement electrode and the biological potential measurement circuit is provided around the protrusion, the wiring having a length which enables longitudinal feeding in accordance with an amount of elongation when the sensor device is elongated. A maximum clearance S between the accommodation chamber and an adjacent chamber is greater than a maximum clearance R between any two adjacent chambers.

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Osaka, Japan

Satoshi Kanai