Jsr Corporation

Dsm IP Assets B.v.

Satoshi Kamo

Hiroshi Yamaguchi

Edward Joseph Murphy

Takeo Shigemoto

Zen Komiya

Tomotaka Shinoda

Takahiro Hayama

Naoki Nishiguchi

Yasutaka Kamei

Masanobu Sugimoto

Paulus Antonius Maria Steeman

Kenneth Dake

A semiconductor treatment composition includes particles having a particle size of 0.1 to 0.3 micrometers in a number of 3&#xd7;10to 1.5&#xd7;10per mL.

Semiconductor treatment composition and treatment method

A semiconductor treatment composition includes potassium, sodium, and a compound A represented by the formula (1), and has a potassium content M(ppm) and a sodium content M(ppm) that satisfy M/M=1&#xd7;10to 1&#xd7;10.

The invention relates to a curable liquid resin composition comprising the following components (A), (B), and (C): (A) a urethane (meth)acrylate oligomer, (B) a monomer shown by the following formula (1), CH&#x2550;CRCOOR(1) wherein Rrepresents a hydrogen atom or a methyl group and Rrepresents a monovalent organic group, 40 wt % or more of the total amount of the component (B) being a monomer in which the Rgroup in the formula (1) is a nonpolar organic group, and the monomer in the component (B) in which the Rgroup in the formula (1) is a nonpolar organic group being hereinafter referred to as 'nonpolar (meth)acrylate-containing monomer', and (C) a polymerization initiator.

Curable liquid resin composition

The invention relates to a curable liquid resin composition comprising: (A) a urethane(meth)acrylate having a structure originating from a polyol and a number average molecular weight of 800 g/mol or more, but less than 6,000 g/mol, and (B) a urethane(meth)acrylate having a structure originating from a polyol and a number average molecular weight of 6,000 g/mol or more, but less than 20,000 g/mol, wherein the total amount of the component (A) and component (B) is 20-95 wt % of the curable liquid resin composition and the content of the component (B) is 0.1-30 wt % of the total of the component (A) and component (B).

The present invention provides a curable liquid resin composition which, when cured, exhibits excellent removability from an adjacent coating layer and is suitable for an optical fiber upjacket material. The curable liquid resin optical fiber upjacket composition comprising a urethane (meth)acrylate or a (meth)acrylate oligomer, a reactive diluent, a polymerization initiator, and a polyol compound having a molecular weight of 1500 or more.

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Tokyo, Japan

Satoshi Kamo