Kyocera Corporation

Satoshi Kajita

Tadashi Nagasawa

Chie Chikara

Yasuhide Tami

Satoshi Yoshiura

Yuuhei Matsumoto

Mitsuhiro Hagihara

Kouji Fujikawa

An organic insulator is produced by cured resin product containing a cyclic olefin copolymer as a main component and has a cumulative luminescence amount measured by chemiluminescence measurement method of 4×10cpm or less. The glass transition temperature of the cured product is from 134° C. to 140° C. The cumulative luminescence amount is from 8.2.8×10cpm to 3.2×10cpm. A wiring board includes an insulation layer and an electrical conductor layer disposed on a surface of the insulation layer, and the insulation layer is the organic insulator described above.

Organic insulator and wiring board

A flame retardant is included in a resin phase, and the flame retardant has a maximum number frequency in a range of 1 μm or less when a particle size distribution is evaluated by dividing a particle size into 1 μm increments. The resin phase includes inorganic particles, and the inorganic particles have a maximum number frequency in a range of 0.5 μm or less when the particle size distribution is evaluated by dividing the particle size into 0.5 μm increments. The flame retardant has an average particle size larger than the average particle size of inorganic particles. The number frequency of the flame retardant and the inorganic particles, respectively, decreases with increasing the particle size.

Organic insulating body, metal-clad laminate, and wiring board

A laminated uncured sheet of the present disclosure has a structure in which resin sheet layers and resin layers are alternately laminated and a through hole penetrating in the laminating direction is formed, wherein the resin sheet layers are formed with a thermosetting resin composition containing a thermosetting resin as a main component, the resin layers are formed with a thermoplastic resin composition containing a thermoplastic resin, and the thermoplastic resin composition is adhered to the inner wall surface of the resin sheet layer part in the through hole.

Laminated uncured sheet

There is provided an organic insulating body which contains a cyclic olefin copolymer as a main component and a peroxide having a benzene ring, and has such a property that a loss tangent peak appears at 120&#xb0; C. or higher in a dynamic mechanical analysis.

Organic insulating body, metal-clad laminate and wiring board

A wiring board includes: an inorganic insulating layer having a via hole formed so as to penetrate the inorganic insulating layer in a thickness direction thereof; a conductive layer disposed on the inorganic insulating layer; and a via conductor which adheres to an inner wall of the via hole and is connected with the conductive layer. The inorganic insulating layer includes a first section including a plurality of inorganic insulating particles partly connected to each other, and a resin portion located in gaps between the inorganic insulating particles, and a second section which is interposed between the first section and the via conductor, including a plurality of inorganic insulating particles partly connected to each other, and a conducting portion composed of part of the via conductor which is located in gaps between the inorganic insulating particles.

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Kirishima, Japan

Satoshi Kajita