Other

Tokyo Electron Limited

Fujikin Inc.

Kabushiki Kaisha Yaskawa Denki

Tokyo Electron Kabushiki Kaisha

Tokyo Electron Sagami Limited

Satoshi Kagatsume

Nobukazu Ikeda

Kouji Nishino

Michio Yamaji

Tadahiro Ohmi

Ryousuke Dohi

Jun Hirose

Eiji Ideta

Tomio Uno

Takashi Hirose

Hiroshi Koizumi

Hideki Nagaoka

Yukio Minami

Tsutomu Shinohara

Tomohiro Nakata

Kazuhiro Yoshikawa

Atsushi Matsumoto

Akihiro Morimoto

Norihiko Amikura

Kazuhiko Sugiyama

Yukio Naito

Kazuo Fukasawa

Toyomi Uenoyama

Satoshi Muto

Katsunori Yonehana

Kazuo Fukazawa

Masahiko Satoh

Hirotsugu Shiraiwa

Takashi Tozawa

Seiichi Iida

Takeo Suzuki

Mutsunori Koyomogi

Katsuhiko Iwabuchi

Manohar L Shrestha

A bolt-locking apparatus includes a plurality of fitting membersandwhich are relatively non-rotatably fitted to heads of a plurality of bolts, and an engaging memberfitted to the plurality of fitting membersandsuch that the engaging memberstraddles the fitting membersand. Outer peripheral surfacesandof the fitting membersandare non-circular in shape. The engaging memberincludes a plurality of engaging holes (non-circular engaging portions)andwhich correspond to the non-circular outer peripheral surfacesandof the plurality of fitting membersand

Bolt-locking apparatus, mounting method thereof and mounting jig

A fluid supply apparatus with a plurality of flow lines branching out from one pressure regulator with the flow lines arranged in parallel and constructed so that opening or closing one flow passage will have no transient effect on the steady flow of the other flow passages. Each flow passage is provided with a time delay-type mass flow controller MFC so that when one closed fluid passage is opened, the mass flow controller on that flow passage reaches a set flow rate Qs in a specific delay time &#x394;t from the starting point. The invention includes a method and an apparatus in which a plurality of gas types can be controlled in flow rate with high precision by one pressure-type flow control system.

Parallel divided flow-type fluid supply apparatus, and fluid-switchable pressure-type flow control method and fluid-switchable pressure-type flow control system for the same fluid supply apparatus

A fluid supply apparatus with a plurality of flow lines branching out from one pressure regulator with the flow lines arranged in parallel and constructed so that opening or closing one flow passage will have no transient effect on the steady flow of the other flow passages. Each flow passage is provided with a time delay-type mass flow controller MFC so that when one closed fluid passage is opened, the mass flow controller on that flow passage reaches a set flow rate Qs in a specific delay time At from the starting point. The invention includes a method and an apparatus in which a plurality of gas types can be controlled in flow rate with high precision by one pressure-type flow control system.

A construction for mounting a pressure detector prevents the detector diaphragm from being strained by stress applied to the pressure detector as the detector is mounted in a fixture main body provided in a pipe line or the like, thereby keeping the output characteristics and temperature characteristics of the detector from greatly differing before and after the mounting. The pressure detector is constructed by combining and fastening together a diaphragm base having a diaphragm and a sensor base having a sensor element therein that is activated by displacement of the diaphragm base. The pressure detector, with a gasket placed thereunder, is disposed in a mounting hole of a fixture main body that is mounted in a pipe line. The pressure detector is air-tightly pressed and fastened by a presser member inserted from above in the mounting hole. The presser member is brought in contact with a block upper surface of the diaphragm base, and the gasket is also brought in contact with the block lower surface of the diaphragm base. A shallow groove is defined in the form of a ring on the lower surface of the block at a place inward of the portion contacting the metal gasket so that the shallow groove absorbs strain caused by the presser member.

Structure or construction for mounting a pressure detector

A method of detecting abnormalities in flow rate in pressure-type flow controller. The method checks the flow rate for abnormalities while controlling the flow rate of fluid in a pressure-type flow controller FCS using an orifice&mdash;the pressure-type flow controller wherein with the upstream pressure P maintained about two or more times higher than the downstream pressure P , the downstream flow rate Q is calculated by the equation Q &equals;KP (K: constant) and wherein the control valve CV is controlled on the basis of the difference signal Q between the calculated flow rate Q and the set flow rate Q .

Method of detecting abnormalities in flow rate in pressure-type flow controller

A fluid-switchable flow rate control system that permits free changing of the full scale flow rate and which can control a plurality of kinds of fluids with high precision. The fluid-switchable flow rate control system controls the flow rate of fluid with the pressure P,on the upstream side of the orifice member held about twice or more higher than the downstream pressure P,, the fluid-switchable flow rate control system comprising an orifice member,replaceable with another to provide a suitable orifice diameter according to the kind of fluid and the flow rate range, a control valve,provided on the upstream side thereof, a pressure detector,provided between the control valve,and the orifice member,, a flow rate calculation circuit,where from the pressure P,detected by the pressure detector, the flow rate Qc is calculated with the equation Qc&equals;KP,(K&equals;constant), a flow rate-setting circuit,for outputting flow rate setting signal Qe, a flow rate conversion circuit,for multiplying the calculated flow rate signal Qc by the flow rate conversion rate k into switch-over calculated flow rate signal Qf (Qf&equals;kQc) to change the full scale flow rate, and a calculation control circuit,to output the difference between the switch-over calculation flow rate signal Qf and the flow rate setting signal Qe as control signal Qy to the drive,of the control valve,, thereby opening or closing the control valve to bring the control signal Qy to zero, thus controlling the flow rate on the downstream side of the orifice member.

Fluid-switchable flow rate control system

Method and apparatus for detection of orifice clogging in pressure-type flow rate controllers

An improved and reduced-size and low-cost gas supply system equipped with a pressure-type flow rate control unit, to be used, for instance, in semiconductor manufacturing facilities is disclosed. Transient flow rate characteristics are improved to prevent the gas from overshooting when the gas supply is started, and to raise the flow rate control accuracy and reliability of facilities. That eliminates non-uniformity of products or semiconductors and raises the production efficiency. The gas supply system equipped with a pressure-type flow rate control unit is so configured that with the pressure on the upstream side of the orifice held about twice or more higher than the downstream side pressure, the gas flow rate is controlled to supply the gas to a gas-using process through an orifice-accompanying valve, the gas supply system comprising a control valve to receive gas from the gas supply source, an orifice-accompanying valve provided on the downstream side of the control valve, a pressure detector provided between the control valve and the orifice-accompanying valve, an orifice provided on the downstream side of the valve mechanism of the orifice-accompanying valve and a calculation control unit where on the basis of the pressure P,detected by the pressure detector, the flow rate Qc is calculated with an equation Qc&equals;KP,(K: constant) and the difference between the flow-rate specifying signal Qs and the calculated flow rate Qc is then input as control signal Qy in the drive for the control valve, thereby regulating the opening of the control valve for adjusting the pressure P,so that the flow rate of the gas to supply can be controlled.

Gas supply system equipped with pressure-type flow rate control unit

An apparatus for mixing and feeding plural gases flowing at different mass flow rates and having different molecular weights includes a plurality of gas feed lines connected to a mixing region having an outlet for feeding a mixture of the gases to a semiconductor production apparatus. The gas feed line carrying the lowest-flow-rate gas is connected to the mixing region at a location farther from the outlet than where any other feed line is connected to the mixing region. Feed lines carrying gases other than the lowest-flow-rate gas are connected to the mixing region according to (1) the relative mass flow rates of the gases carried by the lines (2) the relative molecular weights of the gases carried by the lines or (3) the product of the respective gas flow rates and molecular weights of the gases. At least the line carrying the lowest-flow-rate gas is provided with an apparatus for increasing the velocity of the gas flowing therein prior to entry of the gas into the mixing region.

Backflow prevention apparatus for feeding a mixture of gases

A heat-treatment apparatus comprises a heat-treatment section for subjecting a heat-treatment to a wafer and a loading section for loading a wafer boat into and unloading it from the heat-treatment section. The loading section is connected to the heat-treatment section and includes in it a movable support member, a drive mechanism and a vertical base board as well as a load-lock chamber for maintaining the inside in vacuum. The movable support member supports a wafer boat. The movable support member is attached to a vertical base board so that it can move up and down. The drive mechanism is attached on the major surface of the vertical base board opposite to the surface facing the wafer boat. The drive mechanism drives the movable support to move up and down. The heat-treatment apparatus further comprises a wafer transfer section that includes an orientation flat alignment mechanism and a buffer stage disposed near the orientation flat alignment mechanism. The wafer transfer section includes a wafer cassette means, a buffer stage and a wafer transfer robot for transferring wafers between the orientation flat alignment mechanism and the wafer boat.

Heat-treatment apparatus

A vertical type of heat treatment apparatus which houses objects for treatment loaded on a wafer boat, in a process tube and performs heat treatment, and including a cap which opens and closes an opening portion of a manifold and which is disposed on the side of an opening portion of the process tube, a support mechanism which elastically supports the cap and which is provided to a vertical motion mechanism of the wafer boat, and an expandable and contractible airtightness maintenance means which maintains airtightness on the side of the cap, and which is provided between the cap and the vertical motion mechanism.

Heat treatment apparatus

An etching device comprising a housing in which etching process is carried out, an electrode system having lower and upper electrodes opposed to each other used to generate plasma between these electrodes, while a semiconductor wafer is being placed on the lower electrode, a lifter system to move the lower electrode up and down, a high-frequency power source for applying current between these electrodes, a holder member located between the lower and upper electrodes to hold the wafer at a certain position between these electrodes, and a gas supply means for supplying reaction gases used to generate plasma, between the lower and upper electrodes.

Etching device, and etching method

Growing community of inventors

Nirasaki, Japan

Satoshi Kagatsume