Nitto-denko Corporation

Kyocera Document Solutions Inc.

Other

Nitto Electric Industrial Co., Ltd.

Kyocera Donment Solutions Inc.

Satoshi Ito

Makoto Kuwamura

Kazuhiro Ikemura

Takashi Fukushima

Shinichiro Sudo

Masaki Mizutani

Hiroshi Noro

Shinya Akizuki

Takeshi Tanaka

Yuichi Tsujita

Yusuke Shimizu

Miho Yamaguchi

Hideyuki Usui

Kazumasa Igarashi

Yasuhiro Koike

Tsutomu Nishioka

Megumu Nagasawa

Koichi Tsuda

Keita Kiyoshima

Takatoshi Hamada

Michio Komoto

Azusa Inoue

Akiko Kitayama

Hideto Kimura

Atsushi Yamagishi

Haruo Tabata

An image forming system includes a mobile terminal apparatus and an image forming apparatus. The mobile terminal apparatus displays a captured image of an operation panel of the image forming apparatus, extracts from the captured image, in response to a user operation on the captured image, an operation partial image including an operation part designated by the user operation, and transmits operation partial image data indicating the operation partial image to the image forming apparatus. The image forming apparatus identifies the operation part corresponding to the operation partial image data received from the mobile terminal apparatus, and executes an action corresponding to the identified operation part.

Image forming system capable of remotely operating image forming apparatus, image forming apparatus, and remote operation program

An optical transmission system transmits a Radio Frequency (RF) signal by a frequency division multiplexing method. The optical transmission system includes a Transmitter Optical SubAssembly (TOSA), an optical fiber, and a Receiver Optical SubAssembly (ROSA). The TOSA includes a surface emitting laser diode configured to be capable of emitting light at output of 0.8 mW or more. In the optical transmission system including the surface emitting laser diode, a noise index obtained by a measurement method including a predetermined step is 10.0 dB&#x3bc;V or less.

Optical transmission system and electro-optical conversion device

Connector case for cable

An electronic device includes a display, an input device, and a controller. The display displays a character input screen. The input device includes character input keys, a character delete key, and a confirmation key. When the controller detects a character input key being pressed, the controller causes a character corresponding to the character input key to be displayed on the character input screen and determines whether or not any word registered in a word table is predictable from an unconfirmed character or a character string of unconfirmed characters input of which has not been confirmed through the confirmation key. In response to a single press on the character delete key, the controller deletes a deletion start character that makes word prediction impossible, or the deletion start character and at least one unconfirmed character immediately preceding or following the deletion start character.

Electronic device for controlling deletion of character input on character input screen, character input control method for controlling deletion of character input on character input screen, and storage medium storing therein character input control method program

An information processing apparatus includes a reception processing portion, an authentication determining portion, a presence/absence determining portion, a storage processing portion, and a process executing portion. The reception processing portion receives an authentication code input via an operation portion. The authentication determining portion determines whether an authentication is successful or unsuccessful based on the authentication code. The presence/absence determining portion determines whether the authentication code by which the authentication was determined to be unsuccessful is present or absent in a first storage portion. The storage processing portion stores the unsuccessful authentication code in the first storage portion after a determination of the presence/absence determining portion. The process executing portion executes a predetermined process when a number of times that the presence/absence determining portion determined that the authentication code was absent has exceeded a predetermined upper limit number of times.

Information processing apparatus for authenticating user, information processing method

The present invention provides a process for the production of a semiconductor device comprising a semiconductor element provided on a printed circuit board with a plurality of connecting electrode portions provided interposed therebetween, the gap between said printed circuit board and said semiconductor element being sealed with an underfill resin layer. In accordance with the present invention, (1) the underfill resin layer is formed by melting a lamellar solid resin provided interposed between said printed circuit board and said semiconductor element, and (2) the lamellar solid resin provided interposed between said printed circuit board and said semiconductor element is heated for a predetermined period of time until the temperature of the solid resin layer reaches a predetermined range where the two components are connected to each other under pressure under the following conditions (X) and (Y): (X) Supposing that the initial residual heat of reaction of the solid resin before heating is 100% as determined by a differential scanning calorimeter (DSC), the residual heat of reaction thereof is not more than 70% of the initial residual heat of reaction; and (Y) The temperature of the semiconductor element is predetermined higher than that of the printed circuit board, and the difference in temperature between them is not less than 50&deg; C. In this manner, a production process which facilitates the resin sealing of the gap between the semiconductor element and the board and thus can inhibit warpage of the entire semiconductor device and a semiconductor device having an excellent reliability can be provided. In the present invention, the use of a sheet-like underfill material which gives an underfill resin layer having an elastic modulus in tension at 25&deg; C. of from 300 to 15,000 MPa when hardened can provide a semiconductor device which exerts an excellent effect of relaxing the stress on the semiconductor element, printed circuit board and connecting electrode portions and thus exhibits a high reliability.

Process for the production of semiconductor device

Described is a process for the fabrication of a semiconductor device, which comprises a step of simultaneously or successively mounting at least one semiconductor element having a connecting electrode portion onto each of both sides of an interconnection circuit substrate through an encapsulating resin layer and a step of connecting said at least one semiconductor element with an interconnection electrode on each of both sides of said interconnection circuit substrate by making use of the adhesive force of said encapsulating resin layer.

Fabrication process of a semiconductor device

Method of producing semiconductor device and encapsulating pellet

A semiconductor device comprising a semiconductor element encapsulated with a cured resin having at least two secondary differential peaks of linear thermal expansion by a thermomechanical analytical measurement, the interval between the peaks being at least 20.degree. C. The semiconductor device encapsulated with the cured resin does not cause a warp and is excellent in the TCT test characteristics and the cracking resistance.

Semiconductor device

A semiconductor device in which a semiconductor chip is encapsulated in an epoxy resin composition comprising (A) an epoxy resin represented by formula (I): ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, and R.sub.4 each represents an alkyl group having from 1 to 4 carbon atoms, and (B) a reaction product obtained by preliminarily reacting a silane compound represented by formula (II): ##STR2## wherein X represents a monovalent organic group having at least one functional group selected from the group consisting of a glycidyl group, an amino group, and a mercapto group; Y represents an alkoxy group having from 1 to 4 carbon atoms; and n represents 0, 1 or 2, with a phenol aralkyl resin represented by formula (III) ##STR3## wherein m represents 0 or a positive integer. The epoxy resin composition has low moisture absorption and low stress to provide a semiconductor device excellent in thermal crack resistance and moisture resistance.

Epoxy resin composition for semiconductor encapsulation and

A semi-conductor device in which a semi-conductor element is sealed with a molding resin is disclosed. In the device, adhesion between a semi-conductor chip and the molding resin is achieved mainly by oxygen-crosslinking between silicon in the semi-conductor chip and silicon in the molding resin. The device exhibits excellent moisture-resistant reliability even after mounting.

Semi-conductor device

Growing community of inventors

Osaka, Japan

Satoshi Ito