Hitachi Aic Inc.

Satoshi Isoda

Toshiro Okamura

Masayuki Sakurai

Hiroyoshi Yokoyama

Ryouji Sugiura

Tsutomu Zama

Kenshirou Fukuzato

Yasuhiro Iwasaki

Takanori Nishida

Youiti Matuda

Koichi Noguchi

For providing a chip-type light emitting device, having a plural number of light emitting elements therein, so as to enable to obtain a high optical output with preferable conversion efficiency thereof, and a wiring substrate for that, the chip-type light emitting device, mounting the plural number of the light emitting diodes. . . within an inside of an insulating substrate, has a base substrateand a reflector substrate, which is laminated and adhered on an upper surface thereof. In the base substrateis formed a though hole, on the reverse surface of which is formed a heat radiating platemade from a thick metal thin film. Also, on an inner periphery and a bottom portion of the through hole are formed a reflection film, and further wiring patterns. . . are formed on the substrate. On the other hand, the reflector substrateis formed with a through hole, having a diameter larger than that of the through hole of the base substrate, and on an inner peripheral surface thereof is formed a reflection film. This reflector substrate is disposed and adhered on an upper surface of the base substrate, at such the position that portions of the wiring patterns are exposed through the through hole thereof, and the plural number of the light emitting diodes are connected to the wiring patterns on the base substrate, to be mounted thereon.

Chip-type light emitting device and wiring substrate for the same

In a method of manufacturing a multilayer printed wiring board including an internal wiring circuit formed on a board, an insulating resin layer formed on the internal wiring circuit, a blind hole formed in the insulating resin layer and communicating with the internal wiring circuit, and a conductive portion formed on an inner wall of the blind hole and connected to the internal wiring circuit, the blind hole is formed by using a short-pulse CO.sub.2 laser.

Method of manufacturing multilayer printed wiring board

Growing community of inventors

Ninomiya, Japan

Satoshi Isoda