Mitsubishi Heavy Industries Plastic Technology Co., Ltd.

Mitsubishi Heavy Industries Plastics Technology Co., Ltd.

Mitsubishi Heavy Industries Plastic Technology

Satoshi Imaeda

Toshihiko Kariya

Michitaka Hattori

Naoki Toda

Takeshi Yamaguchi

Shigeru Nozaki

Yoshio Shikase

Toshio Shimoda

Toshifumi Furukawa

The injection molding device of the present invention is provided with a supply pipe which supplies a heat medium to a mold, a discharge pipe which discharges the heat medium from the mold, a mold temperature adjustor to which the supply pipe and the discharge pipe are connected to adjust the temperature of the mold, and a discharge rate adjusting unit which is provided with a variable flow control valve installed on the discharge pipe to adjust a flow rate of the heat medium, a discharge pipe variable flow control valve bypass pipe for bypassing the variable flow control valve and a discharge pipe bypass on-off valve installed on the bypass pipe to change a flow rate of the heat medium and which is installed at a position upstream from the mold temperature adjustor on the discharge pipe.

Injection molding device and method for discharging heat medium for injection molding device

The resin injection molding method of the present invention is a method for molding resins inside a cavity formed within a mold. The method comprises injecting resins into the cavity through a plurality of paths installed so as to be openable and closable and optionally maintaining the resin inside the cavity at a pressure; closing each of the plurality of paths such that the resins injected from each path converge, there being a time difference between when a first path and a second path of the plurality of paths are closed; and solidifying at least the resin which is injected from the path closed earliest with a crystallinity greater than or equal to a predetermined crystallinity degree.

Resin injection molding method

The injection molding method for injecting a resin into a cavity formed within a mold is provided with a heating step in which the temperature of a cavity surface forming the cavity of the mold is heated to a temperature equal to or higher than a heat distortion temperature of the resin and an injection step in which after the heating step, during a decrease in temperature of the cavity surface of the mold, the resin is injected into the cavity.

Injection molding method, molded-article producing method, and injection molding apparatus

An injection molding device is provided with a mold, an injection unit equipped with an injection screw that is displaceably configured such that a molten resin is filled into a cavity by forward movement to perform plural injection operations including at least a filling operation and a pressure keeping operation by displacing the injection screw, a position sensor for detecting the position of the injection screw, a temperature sensor capable of measuring the temperature of the vicinity of the cavity of the mold, a temperature adjustment unit capable of adjusting the temperature of the mold by heating or cooling the mold, a control unit for controlling the displacement of the injection screw and the temperature of the mold and determining plural switching timings of the injection operations on the basis of the position of the screw, and a display unit for displaying an image. The control unit creates a temperature waveform of the vicinity of the cavity based on an input from the temperature sensor and displays a first correlation diagram showing the correlation between the temperature waveform and a predetermined variation corresponding to the change of the temperature waveform and showing at least part of the determined plural switching timings of the injection operations on the display unit.

Injection molding method and apparatus for controlling a mold temperature and displacement of an injection screw

In a mold temperature control circuit of an injection molding device, such a molding cycle is repeated that, prior to injection of a resin, a heating-use medium is returned to molds and heated to a temperature suitable for resin injection, after injection of the resin, the heating-use medium is switched to a cooling-use medium, thereby the cooling-use medium is returned to the molds and cooling is conducted to give a temperature equal to or lower than a temperature at which the resin is solidified. In the mold temperature control circuit of the injection molding device, a junction piping is able to commonly use the respective supply pipings of the heating-use medium, the cooling-use medium and the scavenging compressed air to the molds and the respective discharge pipings thereof, and there is provided mold bypass piping coupling the supply-side junction piping of the heating medium with the discharge-side junction piping, a mold bypass on-off valve, a passed heating medium sensor, a mold-temperature adjusting control device which stores a mold temperature determination program and a passed heating medium determination program.

Mold temperature control circuit of injection molding device and method for discharging heating medium

There are provided an injection molding system, a computer program, a method of injection molding, and an injection molding machine capable of performing precise temperature control of a mold even when there is a delay in temperature increase of the mold in heat supply with a heating medium. The temperature control is performed so that temperatures of a fixed mold and a movable mold are maintained between an upper limit TU and a lower limit TL of a predetermined temperature range after start of injection of resin during an injection molding cycle. The temperature control of the fixed mold and the movable mold is performed only by switching ON/OFF supply of the heating medium, and cooling with a cooling medium is not performed. In a process of cooling the resin, the temperature control is performed so that the temperatures of the fixed mold and the movable mold are maintained between an upper limit TUa and a lower limit TLa of a temperature range effective for resin annealing by stop of supply of the cooling medium and the supply and stop of the heating medium.

Injection molding system, computer program, method of injection molding, and injection molding machine

Provided is a molding machine system enabling a free setting of execution timings of respective steps in a molding cycle of heating of a mold, injection and pressure holding of a molding material, cooling of the mold, etc. The molding machine system repeating a series of molding cycle comprises three temperature sensors arranged at predetermined places of a mold, a change-over valve unit having a heat medium channel by which heating medium from a heating unit, cooling medium from a cooling unit and pressurized air are changed over to be supplied into and recovered from the mold and a molding control means, provided on the change-over valve unit, having a temperature judging program judging respective detected temperatures of the three temperature sensors to give a judgement result and a timer to give a time set signal. A molding operation control is carried out by combining the judgement result with the time set signal and enables an arbitrary supply control of the heating medium, cooling medium and pressurized air to be supplied into the mold and an arbitrary supply control of the molding material to be supplied into the mold.

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Nagoya, Japan

Satoshi Imaeda