Hitachi Automotive Systems, Ltd.

Hitachi Astemo Ltd.

Satoshi Ikeo

Takayuki Yogo

Ryosuke Doi

Hiroyuki Abe

Binti Haridan Fatin Farhanah

Hiroshi Kikuchi

Hideki Mukuno

Toshifumi Sagawa

Yuta Chiba

A physical quantity measurement device is configured to seal a cavity portion on a back surface side of a diaphragm of a thermal air flow rate sensor while improving measurement accuracy. The device may include a lead frame having a mounting surface on which a flow rate sensor which is the thermal air flow rate sensor is mounted, and a flow passage forming member disposed on a back surface opposite to the mounting surface of the lead frame. A ventilation flow path is formed by a first through hole in communication with a cavity portion of the flow rate sensor, a second through hole provided in the lead frame and opened in the mounting surface, and a connection flow path that is defined between the lead frame and the flow passage forming member and connecting the first through hole and the second through hole.

Physical quantity measurement device including a thermal flow rate sensor with a ventilation flow path

Provided is a thermal type airflow volume meter improving measurement accuracy, a method for manufacturing the same, and an adhesive sheet for use therein, the adhesive sheet divided into at least two or more per adherend and having a thickness of approximately 0.1 mm or less is divided to correspond to a shape of the adherend and generates or increases adhesion or stickiness by external energy.

Adhesive sheet, method for manufacturing semiconductor device using same, method for manufacturing thermal airflow sensor using same, and thermal airflow sensor

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Hitachinaka, Japan

Satoshi Ikeo