Canon Kabushiki Kaisha

Satoshi Ideta

Kyosuke Toda

Shimpei Yoshikawa

Shuhei Oya

Takashi Hayasaka

Tomoaki Kamagata

A liquid ejection head includes an element substrate, an electric wiring board, a cover member, and a support member having a first through hole, a second through hole, and a support surface. The element substrate includes an ejection port and a pressure chamber to supply liquid to the ejection port. The cover member is joined to the support surface with a first adhesive. The support member supports the element substrate and the electric wiring board on the support surface. The first through hole serves as a flow passage through which the liquid is supplied to the pressure chamber and the second through hole opens in the support surface. The first adhesive is disposed in an outer peripheral region of the support surface of the support member. A space surrounded by the cover member, the support member, and the first adhesive communicates with the second through hole.

Liquid ejection head and method for manufacturing the same

A liquid ejection apparatus includes an ejection head that ejects a liquid, a container that stores the liquid, and a reservoir that supplies the liquid to the ejection head and stores the liquid supplied from the container. The reservoir includes a first chamber that stores the liquid, a second chamber that is arranged downstream of the first chamber and stores the liquid, and a first flow path and a second flow path that communicate the first and second chambers with each other. A communication port between the first chamber and the second flow path is located lower than a communication port between the first chamber and the first flow path in a usage posture of the liquid ejection apparatus. The second flow path is configured so that a rate of a pressure loss increases as a flow rate of the liquid flowing inside the second flow path increases.

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Kanagawa, Japan

Satoshi Ideta