Canon Kabushiki Kaisha

Satoshi Ibe

Hiroto Komiyama

Teruo Ozaki

Yoshinori Tagawa

Toshiyasu Sakai

Ichiro Saito

Takuya Hatsui

Kenji Ono

Kazuaki Shibata

Sakai Yokoyama

Kazuhiro Asai

Hirokazu Komuro

Kouji Hasegawa

Shiro Sujaku

Toshiaki Kurosu

Keisuke Kishimoto

Jun Yamamuro

Shimpei Otaka

Masataka Nagai

Sadayoshi Sakuma

Shuhei Oya

Junya Hayasaka

Yoshiyuki Imanaka

Kenji Fujii

Hiroyuki Murayama

Mitsuru Chida

Yoshiaki Suzuki

Keiji Watanabe

Shuji Koyama

Koji Sasaki

Makoto Watanabe

Masaki Ohsumi

Yusuke Hashimoto

Takanobu Manabe

Keiji Edamatsu

Hirohisa Fujita

Masahiko Kubota

Hiroyuki Morimoto

Junichiro Iri

Shingo Nagata

Yuya Yamada

Kazumasa Matsushita

Kouji Sasaki

Narumi Shinohara

A liquid ejection head includes a recording element substrate and a supporting member. The recording element substrate includes ejection ports that eject liquid, pressure chambers that communicate with respective ejection ports and are supplied with the liquid, and a liquid supply path that supplies the liquid to the pressure chambers. The supporting member is joined with the recording element substrate via an adhesive. The liquid supply path faces a joining portion of the recording element substrate and the supporting member, and includes at least one recess portion on an inner surface of the liquid supply path.

Liquid ejection head and method of manufacturing the same

A recording element substrate includes an ejection port forming member in which an ejection port configured to eject liquid is formed, and a substrate. The substrate includes a liquid supply port that supplies the liquid to the ejection port, a first surface on which the ejection port forming member is placed, and a second surface that is a rear surface of the first surface. The liquid supply port includes a first portion perpendicularly connected to the first surface, and a second portion connected to the first portion. An inner wall of the second portion includes an inclined surface that is inclined toward an inner wall of the first portion such that a width of the second portion is gradually increased toward the second surface. A hydrophilic film is formed at least on the inner wall of the first portion.

Recording element substrate and method of manufacturing the same

In a liquid ejection head and a method of manufacturing the ejection head, an ejection port board is provided with an expanded portion that communicates with a supply port and has an open end that is larger than an opening of the supply port.

Liquid ejection head and method of manufacturing liquid ejection head

To provide dummy openings having at least one of arrangement and shape determined depending on the shape of a non-effective region.

Method of manufacturing substrate and semiconductor device

A method for manufacturing a liquid ejection head includes: a step of preparing a substrate having a first surface on which energy generation elements and a first layer are provided; and a step of forming a supply port by etching the substrate with an etching liquid or an etching gas from a second surface which is a surface opposite to the first surface so as to enable the etching liquid or the etching gas to reach the first layer, and the first layer is divided by a region which is located between a portion of the first layer covering the energy generation elements and a portion of the first layer to which the etching liquid or the etching gas is reached.

Method for manufacturing liquid ejection head

A method for manufacturing a liquid-discharge-head substrate includes providing a substrate having an energy-generating element and a pad, the pad having a wiring layer and a contact-probe receiving section, the contact-probe receiving section having a Vickers hardness that is higher than a Vickers hardness of the wiring layer; bringing a contact probe into contact with the contact-probe receiving section; and performing an electrical inspection by bringing the contact probe into contact with the wiring layer in the pad.

Method for manufacturing liquid-discharge-head substrate

A method for producing a liquid-ejection-head substrate includes providing a substrate having an energy-generating element and a pad, the pad including a wiring layer, the wiring layer in the pad having a relatively thick portion and a relatively thin portion and performing electrical inspection by applying a contact probe to the relatively thin portion of the wiring layer in the pad.

Method for producing liquid-ejection-head substrate and liquid-ejection-head substrate produced by the same

A method for manufacturing a liquid ejection head having a substrate, heat generating elements formed at the front surface side of the substrate, and a nozzle layer forming liquid chambers and liquid ejection ports at the front surface side of the substrate, and the method includes a process of preparing a substrate having heat generating elements and a nozzle layer formation material layer at the front surface side, a process of driving the heat generating elements for heating to form air bubbles serving as the liquid chambers in the nozzle layer formation material layer, and a process of forming liquid ejection ports which communicate with the liquid chambers in the nozzle layer formation material layer, and then forming a nozzle layer forming the liquid chambers and the liquid ejection ports at the front surface side of the substrate.

A liquid ejection head including a recording element substrate provided with a substrate and a flow-path-forming member forming a flow path in a principal surface of the substrate, a support member supporting the recording element substrate and an underfill material covering at least a joint portion at which the substrate and the support member are joined to each other, wherein the flow-path-forming member is formed in such a manner that an end portion thereof projects from at least one side surface of the substrate, the underfill material covers an external surface of the joint portion and covers the at least one side surface of the substrate in such a manner that the underfill material reaches the projecting end portion of the flow-path-forming member.

Liquid ejection head and process for producing liquid ejection head

A liquid ejection head includes a print element board and an electric wiring board electrically connected to a bump of the print element board using an interconnecting wire. The bump has a first surface and a second surface. The height of the second surface from a surface of a base plate is higher than that of the first surface. The first surface has a protrusion formed therein, and the bump is connected to the interconnecting wire in the second surface.

Liquid ejection head and method for manufacturing liquid ejection head

A device substrate includes a substrate body having an energy generating device provided thereon, where the energy generating device generates energy for ejecting liquid, an ejection port forming member disposed on the substrate body, where the ejection port forming member has a pressure chamber that surrounds the energy generating device and an ejection port that communicates with the pressure chamber, and a supply port configured to supply the liquid to the pressure chamber. The ejection port forming member has a first surface that is in contact with the substrate body and a second surface other than the first surface, and the supply port is formed in the second surface.

Device substrate, liquid ejection head, and method for manufacturing device substrate and liquid ejection head

A liquid ejection head and a printing apparatus can perform high-quality printing by suppressing the shrinkage stress of an adhesive joining a substrate and a flow path forming member and the deformation and peeling of the flow path forming member. A stress dispersing section is formed on the side surface of the substrate.

Liquid ejection head and printing apparatus

A method for manufacturing a liquid ejection head includes the steps of: disposing an etching mask layer on a substrate having a first face and a second face that is on an opposite side of the first face, the etching mask layer being disposed on the second face; forming a concave line pattern at a region of the etching mask layer other than a region where an opening for the support port is to be formed; providing an etching opening at the etching mask layer; performing anisotropic etching from a side of the second face using the etching mask layer provided with the etching opening as a mask, thus forming the supply port at the substrate; comparing the line pattern with a recess generated at the substrate, thus selecting a device chip for liquid ejection; and connecting the selected device chip to a liquid supply part.

The method of manufacturing a liquid ejection head includes: forming a first protective layer on one surface of the substrate; forming the wiring layer on another surface of the substrate; forming the insulating layer on the wiring layer, and then partially removing the insulating layer to partially expose the wiring layer; forming the electrode pad on an exposed portion of the wiring layer; forming a flow path member on the another surface of the substrate; forming a second protective layer on the one surface of the substrate after the formation of the flow path member; and partially removing at least one of the first protective layer and the second protective layer, and then forming the supply port leading from the one surface of the substrate to the another surface of the substrate.

Method of manufacturing liquid ejection head

A liquid ejection head includes a silicon substrate and an orifice plate disposed on or above the silicon substrate. The silicon substrate has a concave portion formed therein, and the orifice plate is disposed in the concave portion.

Growing community of inventors

Yokohama, Japan

Satoshi Ibe